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1. 发明申请

WO2006096549A2 APPARATUS AND METHOD FOR AUTOMATED STRESS TESTING OF FLIP-CHIP PACKAGES 审中-公开
标题翻译：用于自动应力测试的芯片包装的装置和方法
公开(公告)号：WO2006096549A2
公开(公告)日：2006-09-14
申请号：PCT/US2006/007700
申请日：2006-03-03
申请人： OMNIPROBE, INC. , ZAYKOVA-FELDMAN, Lyudmila , MOORE, Thomas M.
发明人： ZAYKOVA-FELDMAN, Lyudmila , MOORE, Thomas M.
IPC分类号： G06K9/00
CPC分类号： G01R31/2881 , G01M7/08 , G01N3/00 , G01N3/307 , G01N3/313 , G01N2203/0044 , G01N2203/005 , G01N2203/0057 , G01N2203/0296 , G01N2203/0676 , G01R31/2868 , H01L21/67011
摘要： An apparatus for testing flip-chip packages has a programmed computer (100), a test-engine stage (130) for applying an impact to at least one package (110) under test, and a monitoring stage (140). The test-engine stage (130) causes an impact on the package (110) on the side opposite its ball-grid array. The test-engine stage (130) has actuators connected to the test-engine stage (130) and the computer (100), for moving and aligning the test-engine stage (130). The monitoring stage (140) has a digital camera (300) connected to the computer (100) for transmitting digital images from the ball-grid array side of the package (110) to the computer (100). A microscope (290) is preferably connected to the digital camera (300). A sample stage (120) located between the test-engine stage (130) and the monitoring stage (140) holds the package (110 under test. The sample stage (120) has an acoustic transducer (190) capable of being removably connected to the package (110) under test. The acoustic transducer (190) is connected to the computer (100) for transmitting signals from the acoustic transducer (190) to the computer (100).
摘要翻译：用于测试倒装芯片封装的装置具有编程计算机（100），用于对被测试的至少一个封装（110）施加冲击的测试引擎级（130）和监视级（140）。测试引擎级（130）在与球栅阵列相对的一侧上引起对包装（110）的冲击。测试发动机级（130）具有连接到测试引擎级（130）和计算机（100）的致动器，用于移动和对准测试引擎级（130）。监视级（140）具有连接到计算机（100）的数字照相机（300），用于将数字图像从包装（110）的球栅阵列侧传送到计算机（100）。显微镜（290）优选地连接到数字照相机（300）。位于测试引擎级（130）和监控级（140）之间的样品台（120）保持被测试的包装（110）。样品台（120）具有能够可移除地连接到声学换能器（190）连接到计算机（100），用于将信号从声换能器（190）发送到计算机（100）。

2. 发明申请

WO2006096549A3 APPARATUS AND METHOD FOR AUTOMATED STRESS TESTING OF FLIP-CHIP PACKAGES 审中-公开
标题翻译：用于自动应力测试的芯片包装的装置和方法
公开(公告)号：WO2006096549A3
公开(公告)日：2007-04-19
申请号：PCT/US2006007700
申请日：2006-03-03
申请人： OMNIPROBE INC , ZAYKOVA-FELDMAN LYUDMILA , MOORE THOMAS M
发明人： ZAYKOVA-FELDMAN LYUDMILA , MOORE THOMAS M
IPC分类号： G01N27/82 , G01N11/00 , G01R33/09 , G01R33/12
CPC分类号： G01R31/2881 , G01M7/08 , G01N3/00 , G01N3/307 , G01N3/313 , G01N2203/0044 , G01N2203/005 , G01N2203/0057 , G01N2203/0296 , G01N2203/0676 , G01R31/2868 , H01L21/67011
摘要： An apparatus for testing flip-chip packages has a programmed computer (100), a test-engine stage (130) for applying an impact to at least one package (110) under test, and a monitoring stage (140). The test-engine stage (130) causes an impact on the package (110) on the side opposite its ball-grid array. The test-engine stage (130) has actuators connected to the test-engine stage (130) and the computer (100), for moving and aligning the test-engine stage (130). The monitoring stage (140) has a digital camera (300) connected to the computer (100) for transmitting digital images from the ball-grid array side of the package (110) to the computer (100). A microscope (290) is preferably connected to the digital camera (300). A sample stage (120) located between the test-engine stage (130) and the monitoring stage (140) holds the package (110 under test. The sample stage (120) has an acoustic transducer (190) capable of being removably connected to the package (110) under test. The acoustic transducer (190) is connected to the computer (100) for transmitting signals from the acoustic transducer (190) to the computer (100).
摘要翻译：用于测试倒装芯片封装的装置具有编程计算机（100），用于对被测试的至少一个封装（110）施加冲击的测试引擎级（130）和监视级（140）。测试引擎级（130）在与球栅阵列相对的一侧上引起对包装（110）的冲击。测试发动机级（130）具有连接到测试引擎级（130）和计算机（100）的致动器，用于移动和对准测试引擎级（130）。监视级（140）具有连接到计算机（100）的数字照相机（300），用于将数字图像从包装（110）的球栅阵列侧传送到计算机（100）。显微镜（290）优选地连接到数字照相机（300）。位于测试引擎级（130）和监控级（140）之间的样品台（120）保持被测试的包装（110）。样品台（120）具有能够可移除地连接到声学换能器（190）连接到计算机（100），用于将信号从声换能器（190）发送到计算机（100）。

3. 发明申请

WO1991012513A1 THERMAL EXPANSION DRIVEN INDENTATION STRESS-STRAIN SYSTEM 审中-公开
标题翻译：热膨胀驱动应力应变系统
公开(公告)号：WO1991012513A1
公开(公告)日：1991-08-22
申请号：PCT/US1991000649
申请日：1991-02-05
申请人： THE UNIVERSITY OF MARYLAND
发明人： THE UNIVERSITY OF MARYLAND , LESKO, John, J. , ARMSTRONG, Ronald, William
IPC分类号： G01N03/42
CPC分类号： G01N3/42 , G01N33/44 , G01N2203/0057 , G01N2203/0071 , G01N2203/0073 , G01N2203/0076 , G01N2203/0078 , G01N2203/0082 , G01N2203/0098 , G01N2203/0222
摘要： Disclosed is a method and apparatus of indentation testing of variable types of specimens which includes mounting an indenter member (3) into a thermally expandable member (2), mounting the specimen (5) to be tested on a pedestal (4), loading the specimen with the indenter member by thermally expanding the thermally expandable member and measuring applied force to and displacement of the specimen so as to determine the hardness or other material properties of the specimen. The indenter member is thermally insulated from the thermally expandable member prior to thermally expanding the thermally expandable member. The thermal expansion driven indentation system in the present invention allows for controlled application of precise and continuous reproducible loads to produce stress-strain plots. Continuous indentation testing with this system has yielded results which correlate well to Rockwell fixed load hardness tests on standard test blocks. Further, efforts in drawing relationships with tensile results have shown support for the use of continuous indentation testing for the generation of local material properties.

4. 发明申请

WO2017195154A2 EVALUATION OF APPLICATIONS USING DIGITAL IMAGE CORRELATION TECHNIQUES 审中-公开
标题翻译：应用数字图像相关技术评估应用
公开(公告)号：WO2017195154A2
公开(公告)日：2017-11-16
申请号：PCT/IB2017/052782
申请日：2017-05-11
申请人： SABIC GLOBAL TECHNOLOGIES B.V.
发明人： THAMBI, Joel
IPC分类号： G01N3/32 , G01B11/16
CPC分类号： G01N3/32 , G01B11/16 , G01N2203/0005 , G01N2203/0044 , G01N2203/0057 , G01N2203/0073 , G01N2203/0075 , G01N2203/0218 , G01N2203/0641

5. 发明申请

WO2016065251A1 MEASURING TENSILE STRENGTH OF TIGHT ROCK USING ELECTROMAGNETIC HEATING 审中-公开
标题翻译：使用电磁加热测量轻质岩石的拉伸强度
公开(公告)号：WO2016065251A1
公开(公告)日：2016-04-28
申请号：PCT/US2015/057097
申请日：2015-10-23
申请人： ARAMCO SERVICES COMPANY
发明人： CHEN, Jinhong , GEORGI, Daniel , DAVIS, Lorne , LIU, Hui-hai
IPC分类号： G01N33/24 , E21B49/00 , G01N3/18
CPC分类号： G01N3/60 , G01N3/18 , G01N33/24 , G01N33/246 , G01N2203/0057
摘要： A method for determining the tensile strength of a rock sample comprising the steps of obtaining the rock sample, measuring a water content of the rock sample through a water measurement method, determining a matrix bulk modulus of the rock sample, wherein the matrix bulk modulus is determined through a matrix modulus method, heating the rock sample with electromagnetic energy such that the electromagnetic energy heats the water content in the rock sample from an initial temperature, wherein heating the water content causes a pore-water pressure of the rock sample to increase, detecting a break in the rock sample with a sensor, wherein the increase in the pore- water pressure causes the rock sample to break, wherein the break occurs at a break time, at a break temperature; and calculating the pore-water pressure through the water content, the matrix bulk modulus, and the break temperature of the water content.
摘要翻译：一种用于确定岩石样品的拉伸强度的方法，包括以下步骤：获得岩石样品，通过水测量方法测量岩石样品的含水量，确定岩石样品的基体体积模量，其中基质体积模量为通过矩阵模量法确定，用电磁能量加热岩石样品，使得电磁能从初始温度加热岩石样品中的水分，其中加热水含量导致岩石样品的孔隙水压力增加，用传感器检测岩石样品中的断裂，其中孔隙水压力的增加导致岩石样品破裂，其中断裂在断裂时间在断裂温度下发生; 并计算通过含水量的孔隙水压力，基体体积模量和水含量的断裂温度。

6. 发明申请

WO2013026500A2 SYSTEM AND METHOD FOR GENERATING A COMBINED MODEL FOR ISOTHERMAL AND ANISOTHERMAL FATIGUE LIFE 审中-公开
标题翻译：用于生成等温和热等静物疲劳生命的组合模型的系统和方法
公开(公告)号：WO2013026500A2
公开(公告)日：2013-02-28
申请号：PCT/EP2011071712
申请日：2011-12-05
申请人： SIEMENS AG , BUCHHOLZ BJOERN
发明人： BUCHHOLZ BJOERN
IPC分类号： G01N3/00
CPC分类号： G01N3/32 , G01N2203/0057 , G01N2203/0064 , G01N2203/0073 , G01N2203/0226
摘要： A technique for generating a combined model for isothermal and anisothermal fatigue life of a material is provided. As per the technique, multiple strain-controlled fatigue tests are performed on the material. For each test, test data is generated that includes a normalized load and a number of cycles to crack imitation in the material under the normalized load. The normalized load is a function of multiple instantaneous load levels determined at different points in time during the test. Each individual instantaneous load level is determined by normalizing a measured stress at an instant with a value of a temperature dependent property of the material corresponding to a temperature of the test at that instant. The test data from the plurality of strain- controlled tests are processed to generate a combined lifetime model defining a response of the number of cycles to crack initiation to the normalized load.
摘要翻译：提供了用于产生材料的等温和非等温热疲劳寿命的组合模型的技术。根据该技术，对材料进行多重应变控制疲劳测试。对于每个测试，都会生成测试数据，其中包含归一化负载和多个循环，以在标准化负载下破解材质中的模仿。归一化负载是测试期间在不同时间点确定的多个瞬时负载水平的函数。每个单独的瞬时负载水平通过在瞬间利用对应于测试温度的材料的温度依赖特性的值对瞬间测得的应力进行归一化来确定。处理来自多个应变控制测试的测试数据以生成组合寿命模型，该模型定义裂纹萌生的周期数量对归一化负载的响应。

7. 发明申请

WO2006089257A1 STRENGTH MEASUREMENT OF SOLDER JOINTS USING LASER GENERATED STRESS WAVES 审中-公开
标题翻译：使用激光发生应力波的焊接接头的强度测量
公开(公告)号：WO2006089257A1
公开(公告)日：2006-08-24
申请号：PCT/US2006/005896
申请日：2006-02-17
申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA , GUPTA, Vijay
发明人： GUPTA, Vijay
IPC分类号： G01N3/08 , G01N3/20
CPC分类号： G01N3/00 , B23K31/02 , G01N29/2418 , G01N2203/001 , G01N2203/005 , G01N2203/0057 , G01N2203/0296 , G01N2291/0421
摘要： Method and apparatus are disclosed for direct measurement of the tensile strength of solder joints with use of laser spallation. A laser pulse (24) is directed at a surface in communication with the solder joint, generating a stress wave to separate the solder ball (102)/(118) from its underlying structure. The solder joint may be measured either prior to joining of PCB board (86) or CSP package (90), or after they have been joined. The joint for testing may be prepared by polishing either the PC board or CSP package to expose the desired solder joint for testing. The tensile strength of the embedded solder joints may also be measured in-situ.
摘要翻译：公开了使用激光剥离直接测量焊点的拉伸强度的方法和装置。激光脉冲（24）指向与焊点相连的表面，产生应力波以将焊球（102）/（118）与其下面的结构分离。焊接接头可以在接合PCB板（86）或CSP封装（90）之前或之后被测量。用于测试的接头可以通过抛光PC板或CSP封装以暴露所需的焊点进行测试来制备。嵌入式焊点的拉伸强度也可以原位测量。

8. 发明申请

WO2006022761A1 HIGH TEMPERATURE AND PRESSURE TESTING FACILITY 审中-公开
标题翻译：高温和压力测试设备
公开(公告)号：WO2006022761A1
公开(公告)日：2006-03-02
申请号：PCT/US2004/033551
申请日：2004-10-12
申请人： FLORIDA TURBINE TECHNOLOGIES, INC.
发明人： BROSTMEYER, Joseph , WILSON, Jack , EBERT, Todd, A.
IPC分类号： G01N25/00
CPC分类号： G01N25/00 , G01M15/14 , G01M99/002 , G01N3/18 , G01N17/002 , G01N2203/0042 , G01N2203/0057 , G01N2203/0226 , G01N2203/0232
摘要： A test facility (100) is provided for testing materials under high temperature, pressure, and mechanical loads. The facility (100) provides a physically scaled system that simulates conditions in hot sections of gas turbine engines. A test article is coated with a test material and exposed to a hot combusting flow in a test section housing (105). The article may be a pipe or conduit member oriented at any direction to the flow. A second cooler flow (210) of fluid is channeled through the test article to create a sharp temperature gradient in the test article and through the test material. A liquid-cooled sleeve is disposed about the test article to create an annular channel of combusting flow over the test article. The downstream end of the second cooler flow is connected to the upstream end of the main hot flow at the combustion chamber (240).
摘要翻译：提供测试设备（100）用于在高温，高压和机械负载下测试材料。设备（100）提供了模拟燃气涡轮发动机热段条件的物理缩放系统。测试物品涂覆有测试材料并暴露于测试部分壳体（105）中的热燃烧流。制品可以是在流动的任何方向上定向的管道或管道构件。流体的第二冷却器流（210）被引导通过测试物品，以在测试物品和测试材料中产生急剧的温度梯度。液体冷却的套筒围绕测试物品设置，以产生在测试物品上燃烧的环形通道。第二冷却器流的下游端连接到燃烧室（240）处的主热流的上游端。

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