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1. 发明申请

WO1998013538A1 FLUXING AGENTS FOR THE REFLOWING OF ELECTRO-DEPOSITED TINPLATE 审中-公开
标题翻译：用于沉积电沉积锡的浮选剂
公开(公告)号：WO1998013538A1
公开(公告)日：1998-04-02
申请号：PCT/GB1997002498
申请日：1997-09-15
申请人： YORKSHIRE CHEMICALS PLC , O'DRISCOLL, Cavan, Hugh , SOHDA, Himashu , LANCASTER, Michael
发明人： YORKSHIRE CHEMICALS PLC
IPC分类号： C25D05/50
CPC分类号： C25D5/505
摘要： There is disclosed a composition for use as a flux material in a tinplating process, which comprises an aqueous solution of one or more hydroxy phenyl compounds of general formula (I), wherein M = a cationic species, preferably H, substituted or unsubstituted ammonium, alkali metal, alkaline earth metal or tin; R = H, C1-C6 linear or branched alkyl, alkoxyl or alkenyl, or aryl (which may be substituted); m = 2 or 3; n = 0, 1 or 2 with the proviso that when n = 0, R = H and must contain at least one SO3M or OSO3M substituent, the composition containing from about 0.1 g/l to saturation of said compound of general formula (I). There is also disclosed a process for treating matte tinplate and a process for tinplating using such composition.
摘要翻译：公开了一种在镀锡工艺中用作焊剂材料的组合物，其包含一种或多种通式（I）的羟基苯基化合物的水溶液，其中M =阳离子种类，优选H为取代或未取代的铵，碱金属，碱土金属或锡; R = H，C 1 -C 6直链或支链烷基，烷氧基或烯基或芳基（其可被取代）; m = 2或3; n = 0,1或2，条件是当n = 0时，R = H并且必须含有至少一个SO 3 M或OSO 3 M取代基，所述组合物含有约0.1g / l至所述通式（I）化合物的饱和，。还公开了一种用于处理无光泽马口铁的方法和使用这种组合物进行镀锡的方法。

2. 发明申请

WO1997014827A1 TIN PLATING ELECTROLYTE COMPOSITIONS 审中-公开
标题翻译：电镀电镀组合物
公开(公告)号：WO1997014827A1
公开(公告)日：1997-04-24
申请号：PCT/GB1996002524
申请日：1996-10-15
申请人： YORKSHIRE CHEMICALS PLC , O'DRISCOLL, Cavan, Hugh
发明人： YORKSHIRE CHEMICALS PLC
IPC分类号： C25D03/32
CPC分类号： C25D3/32
摘要： There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: a) one or more acids selected from sulphuric acid, sulphamic acid, aryl sulphonic acids, alkyl sulphonic acids and alkanol sulphonic acids, b) one or more addition agents comprising a mono-, di- or tri-substituted phenol (each optionally alkyoxylated) or a mixture of two or more such compounds, in which at least one of the substituents includes a secondary, tertiary or quaternary nitrogen atom, c) a tin source and d) water. There is also disclosed a method of tin plating using the composition of this invention.
摘要翻译：公开了适合用于用锡电镀表面的方法中的组合物，其包含：a）一种或多种选自硫酸，氨基磺酸，芳基磺酸，烷基磺酸和链烷醇磺酸的酸，b）一种或多种包含单 - ，二 - 或三 - 取代的苯酚（各自任选烷氧基化）或两种或更多种这样的化合物的混合物的添加剂，其中至少一个取代基包括仲，叔或季氮原子，c）锡源和d）水。还公开了使用本发明的组合物的镀锡方法。

3. 发明申请

WO1997014826A1 TIN PLATING ELECTROLYTE COMPOSITIONS 审中-公开
标题翻译：电镀电镀组合物
公开(公告)号：WO1997014826A1
公开(公告)日：1997-04-24
申请号：PCT/GB1996002522
申请日：1996-10-15
申请人： YORKSHIRE CHEMICALS PLC , O'DRISCOLL, Cavan, Hugh
发明人： YORKSHIRE CHEMICALS PLC
IPC分类号： C25D03/32
CPC分类号： C25D3/32
摘要： There is disclosed a composition suitable for use in a process for electroplating surfaces with tin, comprising: an unsubstituted or substituted para alkylbenzene sulphonic acid (component a), one or more acids capable of giving good plating at low current density (component b), one or more addition agents, a tin source, water. There are also described methods of tin plating by the compositions of the invention.
摘要翻译：公开了一种适合用于用锡电镀表面的方法的组合物，其包含：未取代或取代的对烷基苯磺酸（组分a），能够以低电流密度（组分b）赋予良好电镀的一种或多种酸）一种或多种添加剂，锡源，水。还描述了通过本发明的组合物镀锡的方法。

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