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1. 发明申请

WO2009036134A1 LOW-LOSS INTERFACE 审中-公开
标题翻译：低损失接口
公开(公告)号：WO2009036134A1
公开(公告)日：2009-03-19
申请号：PCT/US2008/075969
申请日：2008-09-11
申请人： VIASAT, INC. , COOK, Dean , FILREIS, Jon , LOPEZ, Noel , ZIENKEWICZ, Rob , WOODS, Charles
发明人： COOK, Dean , FILREIS, Jon , LOPEZ, Noel , ZIENKEWICZ, Rob , WOODS, Charles
IPC分类号： H03F1/14
CPC分类号： H03F3/602 , H01P5/107
摘要： In general, and in accordance with various exemplary embodiments of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, an interface comprises a step launch. In another exemplary embodiment, the interface is adjustable. In yet another exemplary embodiment, an electrical system further comprises an isolation wall. In still yet another embodiment, numerous electrical circuits are combined with interfaces for increased power output.
摘要翻译：通常，根据本发明的各种示例性实施例，公开了用于将诸如单片微波集成电路的集成电路连接到诸如波导的能量传输装置的低损耗接口。在一个示例性实施例中，接口包括步骤发射。在另一个示例性实施例中，该界面是可调节的。在另一个示例性实施例中，电气系统还包括隔离壁。在另一个实施例中，许多电路与用于增加功率输出的接口组合。

2. 发明申请

WO2009114731A2 MULTI-LEVEL POWER AMPLIFICATION SYSTEM 审中-公开
标题翻译：多级功率放大系统
公开(公告)号：WO2009114731A2
公开(公告)日：2009-09-17
申请号：PCT/US2009/037023
申请日：2009-03-12
申请人： VIASAT, INC. , LOPEZ, Noel , WOODS, Charles , ZIENKEWICZ, Rob , FILREIS, Jon
发明人： LOPEZ, Noel , WOODS, Charles , ZIENKEWICZ, Rob , FILREIS, Jon
IPC分类号： H03F3/68 , H03F3/60 , H03F3/20
CPC分类号： H01P5/024 , H01P5/182 , H03F3/602
摘要： In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.
摘要翻译：通常，根据本发明的示例性方面，提供了一种配置为使用诸如来自单片微波集成电路或MMIC的微波信号的组合的功率的电气系统。在一个示例性实施例中，本发明的系统还包括电路直接连接到的低损耗接口。在另一个示例性实施例中，电路连接到连接到低损耗接口的引脚。在本发明的另一个示例性实施例中，提供了一种多层功率放大器，其包括两个或多个根据本发明的阻抗匹配接口的底板和电路。该多层功率放大器被配置为放大能量信号并且与现有功率组合器相比具有显着减小的体积。

3. 发明申请

WO2009137783A3 INCLINED ANTENNA SYSTEMS AND METHODS 审中-公开
公开(公告)号：WO2009137783A3
公开(公告)日：2009-11-12
申请号：PCT/US2009/043321
申请日：2009-05-08
申请人： VIASAT, INC. , DEL RIO, Daniel, Llorens , TIEZZI, Ferdinando , VACCARO, Stefano , LOPEZ, Noel , FILREIS, Jon
发明人： DEL RIO, Daniel, Llorens , TIEZZI, Ferdinando , VACCARO, Stefano , LOPEZ, Noel , FILREIS, Jon
IPC分类号： H01Q21/10 , H01Q19/10 , H01Q5/00 , H01Q1/24
摘要： In accordance with various aspects of the present invention, a method and system for designing an inclined antenna array with a hybrid mechanical-electronic steering system with improved radiation performances at low elevation angles is presented. In an exemplary embodiment, a radiating element structure is attached to a mounting surface and includes a patch antenna and a ground plane. The bottom edge of the patch antenna is farther from the mounting surface than the top edge of the patch antenna. If the radiating element structure is used in an inclined array antenna, then the patch antenna has an uncovered view of a low elevation angle. Furthermore, at least a portion of a patch antenna may be uncovered and have a clear view. A clear view of the low elevation angle results in increased directivity and increased polarization quality due to reduced signal scattering.

4. 发明申请

WO2005053022A1 DIRECT CONTACT FLUID COOLING FOR SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于半导体器件的直接接触流体冷却
公开(公告)号：WO2005053022A1
公开(公告)日：2005-06-09
申请号：PCT/US2004/031263
申请日：2004-09-23
申请人： U. S. MONOLITHICS, L.L.C. , TORKINGTON, Richard, S. , FILREIS, Jon , BUER, Kenneth, V.
发明人： TORKINGTON, Richard, S. , FILREIS, Jon , BUER, Kenneth, V.
IPC分类号： H01L23/44
CPC分类号： H01L23/44 , H01L2224/48091 , H01L2924/1305 , H01L2924/00014 , H01L2924/00
摘要： Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.
摘要翻译：通过添加导热流体可以减少与在半导体上产生热量的小几何电子特征相关联的热扩散阻力。例如，可以在半导体封装和半导体衬底之间的体积内使用电介质流体。因此，可以采用直接热冷却来降低MMIC功率放大器器件中经常遇到的耐热扩散电阻。此外，本文描述了实现该密封的示例性方法。

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