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1. 发明申请

WO2007122521A2 HEAT DISSIPATION SYSTEM FOR A MINIATURIZED FORM FACTOR COMMUNICATIONS CARD 审中-公开
标题翻译：用于微型形式因子通信卡的散热系统
公开(公告)号：WO2007122521A2
公开(公告)日：2007-11-01
申请号：PCT/IB2007050901
申请日：2007-03-15
申请人： UTSTARCOM INC , LIU GUO TAO , BAO SHANQUAN , LE TAOJIN , HUANG BILL , TAN MENG-EN
发明人： LIU GUO TAO , BAO SHANQUAN , LE TAOJIN , HUANG BILL , TAN MENG-EN
IPC分类号： H05K7/20
CPC分类号： H05K1/0207 , H05K1/0206 , H05K1/141 , H05K7/205 , H05K2201/0919 , H05K2201/09309 , H05K2201/09781
摘要： A heat dissipation system for a miniaturized form factor card allows a communications system for mobile information devices contained in the card to operate with high heat loads by employing a high conductivity pad on the printed circuit board of the mobile information device which contacts the case of the miniaturized form factor card. Additionally, heat dissipation plugs are integrated into the edge of the PCB with emitting surfaces adjacent radiation holes in the case of the mobile information device adjacent the PCB. Heat convection channels through layers of the PCB allow transfer of heat from the pad to other conductive layers in the PCB. High thermal conductivity packing in the miniaturized form factor card conducts heat from the internal components to the case of the card in contact with the high conductivity. Placement of high heat generation components within the card case adjacent the contact interface with the high conductivity pad is also employed for maximum heat dissipation. A high conductivity membrane is provided on the card case for increased conductivity from the case into the pad on the PCB.
摘要翻译：用于小型化形状因子卡的散热系统允许包含在卡中的移动信息设备的通信系统通过在移动信息设备的印刷电路板上使用高电导率焊盘来操作，具有高热负荷，该电导板接触到小型化外形尺寸卡。此外，在移动信息设备邻近PCB的情况下，散热塞被集成到PCB的边缘中，发射表面邻近辐射孔。通过PCB层的热对流通道允许热量从焊盘传递到PCB中的其他导电层。小型化形状卡中的高导热性填料将热量从内部组件传导到与高导电性接触的卡的情况。也可采用与高电导率焊盘相邻的接触界面内的卡壳内的高发热部件的放置，以实现最大的散热。在卡盒上提供高导电性膜，以增加从壳体到PCB上的焊盘的导电性。

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