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1. 发明申请

WO2006133265A3 DIRECTED ASSEMBLY OF A CONDUCTING POLYMER 审中-公开
标题翻译：导向聚合物的指导性组件
公开(公告)号：WO2006133265A3
公开(公告)日：2009-04-30
申请号：PCT/US2006022070
申请日：2006-06-07
申请人： UNIV NORTHEASTERN , UNIV MASSACHUSETTS , MEAD JOEY L , BARRY CAROL M F , BUSNAINA AHMED , WEI MING , TAO ZHENGHONG
发明人： MEAD JOEY L , BARRY CAROL M F , BUSNAINA AHMED , WEI MING , TAO ZHENGHONG
IPC分类号： C25D13/12
CPC分类号： C25D5/02 , C25B7/00 , C25D1/12
摘要： The present invention provides a method for directed assembly of a conducting polymer. A method of the invention comprises providing a template such as an insulated template and electrophorectically assembling a conducting polymer thereon. Preferably, the template comprises a patterned electrode on which the conducting polymer is assembled. Moreover, the invention provides a method for transferring an assembled conducting polymer. For example, a method of the invention comprises providing a substrate such as a polymeric substrate and contacting a surface thereof with an assembled conducting polymer. The assembled conducting polymer can be disposed on a patterned electrode of a template, hi one embodiment, a method comprises removing the substrate. By removing the substrate, the assembled conducting polymer is transferred from the patterned electrode of the template to the substrate. The invention also provides a device with a template or substrate comprising an assembled conducting polymer.
摘要翻译：本发明提供一种导电聚合物的定向组装方法。本发明的方法包括提供诸如绝缘模板的模板，并在其上电泳组装导电聚合物。优选地，模板包括其上组装导电聚合物的图案化电极。此外，本发明提供了一种转移组装的导电聚合物的方法。例如，本发明的方法包括提供诸如聚合物基底的基底并使其表面与组装的导电聚合物接触。组装的导电聚合物可以设置在模板的图案化电极上。在一个实施方案中，一种方法包括去除衬底。通过去除衬底，组装的导电聚合物从模板的图案化电极转移到衬底。本发明还提供一种具有包含组装的导电聚合物的模板或基底的装置。

2. 发明申请

WO2009075720A3 PATTERNED NANOSUBSTRATES MADE BY DIRECTED SELF ASSEMBLY OF AMPHIPHILIC MOLECULES 审中-公开
标题翻译：由自主分布的自主组装制作的图案纳米结构
公开(公告)号：WO2009075720A3
公开(公告)日：2009-09-24
申请号：PCT/US2008012977
申请日：2008-11-21
申请人： UNIV NORTHEASTERN , UNIV MASSACHUSETTS , BUSNAINA AHMED , MEAD JOEY L , BARRY CAROL M F , WEI MING
发明人： BUSNAINA AHMED , MEAD JOEY L , BARRY CAROL M F , WEI MING
IPC分类号： H01L31/00 , H01L33/00
CPC分类号： C40B30/00 , B05D1/185 , B05D3/141 , B82Y10/00 , B82Y30/00 , B82Y40/00 , G01N2033/0096 , G01N2035/00158 , G03F7/00 , G03F7/0002 , G03F7/004 , Y10S977/888 , Y10T428/2462
摘要： Nanoscale patterns prepared by lithography are used to direct the self-assembly of amphiphilic molecules to form patterned nanosubstrates having a desired distribution of chemical functional moieties. These patterns can be fabricated over a large area and require no special limitations on the chemistry the assembled amphiphiles. Hydrophilic/hydrophobic patterns can be created and used to direct the deposition of a single functional component to specific regions of the surface or to selectively assemble polymer blends to desired sites in a one step fashion with high specificity and selectivity. The selective deposition of functional moieties on a patterned surface can be based on electrostatic forces, hydrogen bonding, or hydrophobic interactions. The methods and patterned nanosubstrates of the invention can be used in the assembly of functional polymer systems, polyelectrolytes, biomolecules, conducting polymers, colloids and nanoparticles, and find wide technological applications in biosensors, biochips, photonics and electronics.
摘要翻译：通过光刻制备的纳米尺度图案用于引导两亲分子的自组装以形成具有期望的化学功能部分分布的图案化的纳米底物。这些图案可以在大面积上制造，并且对组装的两亲物的化学性质没有特别的限制。可以产生亲水/疏水图案并用于将单个功能组分沉积到表面的特定区域，或以高特异性和选择性以一步的方式有选择地将聚合物共混物组装到所需位点。功能部分在图案化表面上的选择性沉积可以基于静电力，氢键或疏水相互作用。本发明的方法和图案化的纳米基质可用于功能性聚合物体系，聚电解质，生物分子，导电聚合物，胶体和纳米颗粒的组装，并且在生物传感器，生物芯片，光子学和电子学领域广泛应用。

3. 发明申请

WO2009075720A9 PATTERNED NANOSUBSTRATES MADE BY DIRECTED SELF ASSEMBLY OF AMPHIPHILIC MOLECULES 审中-公开
标题翻译：两亲性分子直接自组装形成的图案化纳米组分
公开(公告)号：WO2009075720A9
公开(公告)日：2009-08-06
申请号：PCT/US2008012977
申请日：2008-11-21
申请人： UNIV NORTHEASTERN , UNIV MASSACHUSETTS , BUSNAINA AHMED , MEAD JOEY L , BARRY CAROL M F , WEI MING
发明人： BUSNAINA AHMED , MEAD JOEY L , BARRY CAROL M F , WEI MING
IPC分类号： H01L31/00 , H01L33/00
CPC分类号： C40B30/00 , B05D1/185 , B05D3/141 , B82Y10/00 , B82Y30/00 , B82Y40/00 , G01N2033/0096 , G01N2035/00158 , G03F7/00 , G03F7/0002 , G03F7/004 , Y10S977/888 , Y10T428/2462
摘要： Nanoscale patterns prepared by lithography are used to direct the self-assembly of amphiphilic molecules to form patterned nanosubstrates having a desired distribution of chemical functional moieties. These patterns can be fabricated over a large area and require no special limitations on the chemistry the assembled amphiphiles. Hydrophilic/hydrophobic patterns can be created and used to direct the deposition of a single functional component to specific regions of the surface or to selectively assemble polymer blends to desired sites in a one step fashion with high specificity and selectivity. The selective deposition of functional moieties on a patterned surface can be based on electrostatic forces, hydrogen bonding, or hydrophobic interactions. The methods and patterned nanosubstrates of the invention can be used in the assembly of functional polymer systems, polyelectrolytes, biomolecules, conducting polymers, colloids and nanoparticles, and find wide technological applications in biosensors, biochips, photonics and electronics.
摘要翻译：通过光刻制备的纳米级图案用于指导两亲性分子的自组装以形成具有期望分布的化学官能部分的图案化的纳米基底。这些图案可以在大面积上制造，并且不需要对组装的两亲物的化学特别限制。可以创建亲水/疏水图案并用于将单一功能组分的沉积引导到表面的特定区域，或者以高特异性和选择性以一步方式选择性地将聚合物共混物组装到期望位点。功能部分在图案化表面上的选择性沉积可以基于静电力，氢键或疏水性相互作用。本发明的方法和图案化的纳米衬底可以用于功能聚合物系统，聚电解质，生物分子，导电聚合物，胶体和纳米颗粒的组装中，并且在生物传感器，生物芯片，光子学和电子学中找到广泛的技术应用。

4. 发明申请

WO2009129430A2 METHODS FOR FORMING METAL-POLYMER HYBRID TOOLING FOR FORMING PARTS HAVING MICRO FEATURES 审中-公开
标题翻译：形成金属聚合物混合工具的方法，用于形成具有微特征的部件
公开(公告)号：WO2009129430A2
公开(公告)日：2009-10-22
申请号：PCT/US2009040890
申请日：2009-04-17
申请人： UNIV MASSACHUSETTS LOWELL , UNIV NORTHEASTERN , YOON SUNG-HWAN , CHA NAM-GOO , BARRY CAROL M F , MEAD JOEY L , BUSNAINA AHMED A
发明人： YOON SUNG-HWAN , CHA NAM-GOO , BARRY CAROL M F , MEAD JOEY L , BUSNAINA AHMED A
IPC分类号： H01L21/027 , H01L21/203
CPC分类号： H01L21/0273 , B81C99/009 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： A method (10, 100) for forming metal-polymer hybrid tooling includes patterning a surface of a silicon wafer (20, 420), depositing a polymer material (30, 430) onto the patterned features of the surface of the silicon wafer to form a polymer layer having a reverse of the patterned surface the silicon wafer, removing the patterned polymer layer to expose a patterned polymer layer surface, depositing a metallic layer (30, 430) on the patterned polymer layer surface, and wherein the deposited metallic layer on the patterned polymer layer is operable to form parts (450) with features having a width dimension between about 0.1 microns and about 100 microns and a height dimension of between about 1 micron and about 800 microns (e.g., up to aspect ratio of 8).
摘要翻译：用于形成金属 - 聚合物混合工具的方法（10,100）包括对硅晶片（20,420）的表面进行图案化，将聚合物材料（30,430）沉积到硅晶片的表面的图案化特征上以形成具有与所述图案化表面相反的所述硅晶片的聚合物层，去除所述图案化的聚合物层以暴露图案化的聚合物层表面，在所述图案化的聚合物层表面上沉积金属层（30,430），并且其中所述沉积的金属层在图案化的聚合物层可操作以形成具有宽度尺寸在约0.1微米至约100微米之间且高度尺寸在约1微米至约800微米之间（例如，高达8倍的纵横比）的部件（450）。

5. 发明申请

WO2009129430A3 METHODS FOR FORMING METAL-POLYMER HYBRID TOOLING FOR FORMING PARTS HAVING MICRO FEATURES 审中-公开
标题翻译：形成金属聚合物混合工具的方法，用于形成具有微特征的部件
公开(公告)号：WO2009129430A3
公开(公告)日：2010-03-04
申请号：PCT/US2009040890
申请日：2009-04-17
申请人： UNIV MASSACHUSETTS LOWELL , UNIV NORTHEASTERN , YOON SUNG-HWAN , CHA NAM-GOO , BARRY CAROL M F , MEAD JOEY L , BUSNAINA AHMED A
发明人： YOON SUNG-HWAN , CHA NAM-GOO , BARRY CAROL M F , MEAD JOEY L , BUSNAINA AHMED A
IPC分类号： H01L21/027 , H01L21/203
CPC分类号： H01L21/0273 , B81C99/009 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： A method (10, 100) for forming metal-polymer hybrid tooling includes patterning a surface of a silicon wafer (20, 420), depositing a polymer material (30, 430) onto the patterned features of the surface of the silicon wafer to form a polymer layer having a reverse of the patterned surface the silicon wafer, removing the patterned polymer layer to expose a patterned polymer layer surface, depositing a metallic layer (30, 430) on the patterned polymer layer surface, and wherein the deposited metallic layer on the patterned polymer layer is operable to form parts (450) with features having a width dimension between about 0.1 microns and about 100 microns and a height dimension of between about 1 micron and about 800 microns (e.g., up to aspect ratio of 8).
摘要翻译：用于形成金属 - 聚合物混合工具的方法（10,100）包括对硅晶片（20,420）的表面进行图案化，将聚合物材料（30,430）沉积到硅晶片的表面的图案化特征上以形成具有与所述图案化表面相反的硅晶片的聚合物层，去除所述图案化的聚合物层以暴露图案化的聚合物层表面，在所述图案化的聚合物层表面上沉积金属层（30,430），并且其中所述沉积的金属层在图案化的聚合物层可操作以形成具有宽度尺寸在约0.1微米至约100微米之间且高度尺寸在约1微米至约800微米之间（例如，高达8倍的纵横比）的部件（450）。

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