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2. 发明申请

WO2011057401A1 CLEANING APPARATUS. RADIATION SOURCE MODULE AND FLUID TREATMENT SYSTEM 审中-公开
标题翻译：清洁装置辐射源模块和流体处理系统
公开(公告)号：WO2011057401A1
公开(公告)日：2011-05-19
申请号：PCT/CA2010/001792
申请日：2010-11-10
申请人： TROJAN TECHNOLOGIES , TRAUBENBERG, George , ARCHER, Allan , MOGLAN, Cristian
发明人： TRAUBENBERG, George , ARCHER, Allan , MOGLAN, Cristian
IPC分类号： B08B9/023 , A61L9/20 , B08B1/00
CPC分类号： B08B1/008 , B08B9/023 , C02F1/325 , C02F2201/3225 , C02F2201/3227 , C02F2201/324 , Y10T137/4238
摘要： There is described a cleaning apparatus for a surface (e.g., a radiation source assembly) in a fluid treatment system. A preferred embodiment of the cleaning apparatus comprises: a wiping element for contact with at least a portion of the surface; at least one cutting element connected to the wiping element for cutting elongate debris in contact with the surface; and a motive element for moving the carriage between a first position and a second position. This preferred embodiment of the present cleaning apparatus is particularly advantageous for removing elongate debris from one or more radiation source assemblies disposed in the fluid treatment system. The approach utilized in this preferred embodiment of the present cleaning apparatus is to include at least one cutting element which is moved along the exterior of the radiation source assembly. The cutting element is connected to a wiping element that is translated between a first position and a second position. As the wiping element is moved from the first position to the second position, it will tend to push the elongate debris toward a distal portion of the radiation source assembly. During this translation step, it is possible that some of the debris may be cut by the cutting element. As the wiping element approaches the distal portion of the radiation source assembly, it will tend to clamp down on the elongate debris and, as the force of movement is continually applied, the cutting element will cut the elongate debris. Once the elongate debris is cut, it will more readily fall away from the radiation source assembly and this action is facilitated by a flow of fluid past the radiation source assembly.
摘要翻译：在流体处理系统中描述了用于表面（例如，辐射源组件）的清洁装置。清洁装置的优选实施例包括：用于与表面的至少一部分接触的擦拭元件; 连接到所述擦拭元件的至少一个切割元件，用于切割与所述表面接触的细长碎片; 以及用于在第一位置和第二位置之间移动托架的动力元件。本清洁装置的该优选实施例对于从设置在流体处理系统中的一个或多个辐射源组件移除细长碎片是特别有利的。本清洁装置的该优选实施例中采用的方法是包括沿着辐射源组件的外部移动的至少一个切割元件。切割元件连接到在第一位置和第二位置之间平移的擦拭元件。当擦拭元件从第一位置移动到第二位置时，它将倾向于将细长碎片推向辐射源组件的远端部分。在该平移步骤期间，有些碎片可能被切割元件切割。当擦拭元件接近辐射源组件的远端部分时，它将倾向于夹紧在细长碎片上，并且随着移动力被连续施加，切割元件将切割细长碎片。一旦细长的碎片被切割，它将更容易地从辐射源组件脱落，并且通过流过该辐射源组件的流体促进了该作用。

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