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    • 3. 发明申请
    • APPARATUS AND METHOD FOR CONFIGURING A DUAL RACK-MOUNTABLE CHASSIS
    • 用于配置双机架式机箱的装置和方法
    • WO2008103927A3
    • 2008-12-18
    • PCT/US2008054759
    • 2008-02-22
    • TELLABS OPERATIONS INCBODUCH MARK EPAPAKOS KIMONBLAKEMORE SCOTT AWOMAC DAVID J
    • BODUCH MARK EPAPAKOS KIMONBLAKEMORE SCOTT AWOMAC DAVID J
    • H05K7/14H05K7/18
    • H05K7/1425G06F1/20H05K5/0213H05K7/18
    • A method of configuring a rack-mountable chassis is provided. The method includes measuring a length and width of a card module slot of the chassis, a first opening width of a first rack for housing the chassis, and a second opening width of a second rack for housing the chassis, where the first opening width is greater than the second opening width. The method also includes verifying whether the first opening width is sufficiently wide to allow enough clearance between at least one side of the chassis and the first rack when the chassis is disposed in the first rack, to allow for the adequate cooling of housed components. If the first opening width is sufficiently wide, a dimension of at least one parameter related to the configuration of the chassis is determined so that the second opening width is a multiple of a total chassis width of the chassis. A chassis configured according to the method is provided.
    • 提供了配置机架安装式机箱的方法。 该方法包括测量机壳的卡模块插槽的长度和宽度,用于容纳机壳的第一机架的第一开口宽度以及用于容纳机壳的第二机架的第二开口宽度,其中第一开口宽度是 大于第二开口宽度。 该方法还包括验证第一开口宽度是否足够宽以在机架设置在第一机架中时允许机架的至少一侧与第一机架之间具有足够的间隙以允许容纳的部件的充分冷却。 如果第一开口宽度足够宽,则确定与底盘的配置相关的至少一个参数的尺寸,使得第二开口宽度是底盘的总底盘宽度的倍数。 提供了根据该方法配置的底盘。
    • 4. 发明申请
    • APPARATUS AND METHOD FOR CONFIGURING A DUAL RACK-MOUNTABLE CHASSIS
    • 用于配置双机架式机箱的装置和方法
    • WO2008103927A9
    • 2010-11-11
    • PCT/US2008054759
    • 2008-02-22
    • TELLABS OPERATIONS INCBODUCH MARK EPAPAKOS KIMONBLAKEMORE SCOTT AWOMAC DAVID J
    • BODUCH MARK EPAPAKOS KIMONBLAKEMORE SCOTT AWOMAC DAVID J
    • H05K7/14H05K7/18
    • H05K7/1425G06F1/20H05K5/0213H05K7/18
    • A method of configuring a rack-mountable chassis is provided. The method includes measuring a length and width of a card module slot of the chassis, a first opening width of a first rack for housing the chassis, and a second opening width of a second rack for housing the chassis, where the first opening width is greater than the second opening width. The method also includes verifying whether the first opening width is sufficiently wide to allow enough clearance between at least one side of the chassis and the first rack when the chassis is disposed in the first rack, to allow for the adequate cooling of housed components. If the first opening width is sufficiently wide, a dimension of at least one parameter related to the configuration of the chassis is determined so that the second opening width is a multiple of a total chassis width of the chassis. A chassis configured according to the method is provided.
    • 提供了一种配置机架式机架的方法。 该方法包括测量底盘的卡模块槽的长度和宽度,用于容纳底架的第一机架的第一开口宽度和用于容纳底架的第二开口宽度,其中第一开口宽度为 大于第二开口宽度。 该方法还包括验证第一开口宽度是否足够宽,以便当底架设置在第一机架中时,在底架的至少一侧和第一机架之间具有足够的间隙,以允许对容纳部件进行适当的冷却。 如果第一开口宽度足够宽,则确定与底盘的配置相关的至少一个参数的尺寸,使得第二开口宽度是底盘的总底盘宽度的倍数。 提供了根据该方法配置的底盘。