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1. 发明申请

WO1995018487A1 COMPONENT-MODULE-ADAPTED OSCILLATING CIRCUIT ARRANGEMENT 审中-公开
标题翻译：组件模块适配振荡电路布置
公开(公告)号：WO1995018487A1
公开(公告)日：1995-07-06
申请号：PCT/SE1994001189
申请日：1994-12-09
申请人： TELEFONAKTIEBOLAGET L M ERICSSON
发明人： TELEFONAKTIEBOLAGET L M ERICSSON , HEDBERG, Mats, Olov, Joakim
IPC分类号： H03H09/05
CPC分类号： H03H9/14597 , H03B5/326 , H03H9/0542
摘要： A component-module-adapted oscillating circuit arrangement adapted to form a signal with a high frequency and a narrow frequency range includes a signal amplifying circuit, a signal generating circuit with a resonance element, required electrical wiring, and required matching network. On one surface of a carrier substrate belonging to the component module, electrically conductive surface sections are formed and distributed in such a way that they can coact in a firm and electrically conductive manner with corresponding contact surfaces of the resonance element. An integrated circuit is attached to the surface sections adjacent to the surface sections intended for the resonance element. This integrated circuit includes the required amplifying circuit. The contact surfaces of the resonance element are connected to the contact surfaces of the carrier substrate by bonding or the like. The integrated circuit includes further signal amplifying and/or signal processing circuits, and contact surfaces of the integrated circuit are connected to contact surfaces of the carrier substrate by bonding or the like.
摘要翻译：适于形成具有高频率和窄频率范围的信号的组件模块适配振荡电路装置包括信号放大电路，具有谐振元件的信号发生电路，所需电线以及所需的匹配网络。在属于部件模块的载体基板的一个表面上，导电表面部分以这样的方式形成和分布，使得它们能够以牢固且导电的方式与谐振元件的相应接触表面共同作用。集成电路附接到与用于谐振元件的表面部分相邻的表面部分。该集成电路包括所需的放大电路。共振元件的接触面通过接合等与载体基板的接触面连接。集成电路还包括信号放大和/或信号处理电路，并且集成电路的接触表面通过接合等连接到载体衬底的接触表面。

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