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    • 4. 发明申请
    • A HIGH DENSITY SPIN-TRANSFER TORQUE MRAM PROCESS
    • 高密度转子扭矩MRAM工艺
    • WO2010051010A1
    • 2010-05-06
    • PCT/US2009/005646
    • 2009-10-16
    • MAGIC TECHNOLOGIES, INC.ZHONG, TomTORNG, Chiu-JiuhXIAO, RongfuZHONG, AdamKAN, Wai-Ming, JohnsonLIU, Daniel
    • ZHONG, TomTORNG, Chiu-JiuhXIAO, RongfuZHONG, AdamKAN, Wai-Ming, JohnsonLIU, Daniel
    • H01L21/00
    • H01L27/228H01L43/12
    • A STT-MRAM integration scheme is disclosed wherein the connection between a MTJ and CMOS metal is simplified by forming an intermediate via contact (VAC) on a CMOS landing pad, a metal (VAM) pad that contacts and covers the VAC, and a MTJ on the VAM. A dual damascene process is performed to connect BIT line metal to CMOS landing pads through VAC/VAM/MTJ stacks in a device region, and to connect BIT line connection pads to CMOS connection pads through BIT connection vias outside the device region. The VAM pad is a single layer or composite made of Ta, TaN, or other conductors which serves as a diffusion barrier, has a highly smooth surface for MTJ formation, and provides excellent selectivity with refill dielectric materials during a chemical mechanical polish process. Each VAC is from 500 to 3000 Angstroms thick to minimize additional circuit resistance and minimize etch burden.
    • 公开了一种STT-MRAM集成方案,其中通过在CMOS着陆焊盘,接触和覆盖VAC的金属(VAM)焊盘上形成中间通孔接触(VAC)来简化MTJ和CMOS金属之间的连接,以及MTJ 在VAM上 执行双镶嵌工艺,通过设备区域中的VAC / VAM / MTJ堆叠将BIT线金属连接到CMOS着陆焊盘,并通过设备区域外的BIT连接通孔将BIT线连接焊盘连接到CMOS连接焊盘。 VAM焊盘是由Ta,TaN或用作扩散阻挡层的其他导体制成的单层或复合材料,具有用于MTJ形成的高度光滑的表面,并且在化学机械抛光工艺期间提供优异的再填充介电材料的选择性。 每个VAC的厚度为500至3000埃,以最小化额外的电路电阻并最小化蚀刻负担。