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    • 2. 发明申请
    • PRESSURE SENSOR
    • 压力传感器
    • WO2003034016A1
    • 2003-04-24
    • PCT/SE2002/001884
    • 2002-10-15
    • SILEX MICROSYSTEMS ABRANGSTEN, PelleKÄLVESTEN, EdvardMECHBACH, Marianne
    • RANGSTEN, PelleKÄLVESTEN, EdvardMECHBACH, Marianne
    • G01L9/00
    • G01L9/0042G01L9/0055Y10T29/49002Y10T29/49004Y10T29/49007
    • In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an "ideal" etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness.The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD. Sensor paths for sensing the deflection of the diaphragm are applied on the outer or inner surface of the diaphragm. The monocrystalline diphragm gives the sensor a good long-term stability. Also the sensor path can be made of monocrystalline material, this giving the sensor even better good long-term characteristics. An increased sensitivity can be obtained by making active portions of the sensor paths freely extending, unsupported by other material of the pressure sensor, by suitable etching procedures.
    • 在制造压力传感器时,形成传感器腔的一部分的凹部形成在下硅衬底中。 在衬底顶部具有单晶硅层的SOI晶片被接合到下硅衬底上,封闭凹部并形成空腔。 然后蚀刻掉SOI晶片的支撑衬底,单晶层的部分位于形成传感器膜片的凹部之上。 SOI晶片的氧化物层在此通过干式(等离子体)或湿式蚀刻方式除去基板晶片的情况下,作为“理想的”蚀刻停止。 KOH。 这是由于在一些蚀刻工艺中硅和氧化物之间的高蚀刻选择性,并且其导致具有非常精确限定和均匀厚度的膜片。通过形成到空腔的开口然后通过闭合开口来密封空腔来抽空空腔 使用LPCVD。 用于感测隔膜偏转的传感器路径被施加在隔膜的外表面或内表面上。 单晶diphragm给传感器良好的长期稳定性。 此外,传感器路径也可以由单晶材料制成,这给传感器带来更好的长期特性。 传感器路径的有效部分通过适当的蚀刻程序自由延伸,不受压力传感器的其他材料支撑,可以获得增加的灵敏度。
    • 6. 发明申请
    • A HIGH PRESSURE ISOLATION VALVE SYSTEM
    • 高压隔离阀系统
    • WO2007040455A1
    • 2007-04-12
    • PCT/SE2006/050375
    • 2006-10-04
    • NANOSPACE ABSTENMARK, LarsRANGSTEN, Pelle
    • STENMARK, LarsRANGSTEN, Pelle
    • F16K31/02F16K13/00F16K7/12G01L9/12B64G1/40
    • F16K17/383B64G1/402F16K17/403F16K99/0038Y10T137/0497Y10T137/1639Y10T137/1774Y10T137/8122Y10T137/8326
    • An isolation valve system comprises a main body (32), an actuator body (34) and a sealing membrane (307). The sealing membrane (307) is arranged at a high pressure portion (36) of the isolation valve system. The sealing membrane (307) mechanically attaches the actuator body (34) to the main body (32). The sealing membrane (307) further seals the high pressure portion (36) from a low pressure portion (38). A burst plug (315) is arranged against the main body (32) and supports the actuator body (34). An activation arrangement (50) is arranged for allowing an at least partial displacement of the burst plug (315), typically causing a phase transition. The sealing membrane (307) is dimensioned to break when the actuator body (34) is moved due to the displacement of the burst plug (315). The isolation valve system comprises preferably a stack (30) of substrates (301- 304) being bonded together. The substrates (301-304) have micromechanical structures, which form at least the actuator body (34) and the sealing membrane (307).
    • 隔离阀系统包括主体(32),致动器主体(34)和密封膜(307)。 密封膜(307)布置在隔离阀系统的高压部分(36)处。 密封膜(307)将致动器主体(34)机械地附接到主体(32)。 密封膜(307)进一步将高压部分(36)与低压部分(38)密封。 爆破塞(315)抵靠主体(32)设置并支撑致动器主体(34)。 激活装置(50)被布置成允许突发塞(315)的至少部分移位,通常导致相变。 当致动器主体(34)由于爆裂塞(315)的位移而移动时,密封膜(307)的尺寸被设计成断裂。 隔离阀系统优选地包括结合在一起的衬底(301-304)的堆叠(30)。 基板(301-304)具有至少形成致动器主体(34)和密封膜(307)的微机械结构。