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1. 发明申请

WO2005044893A1 CURABLE POLYESTER HAVING AN OXETANYL GROUP AT END AND PROCESS FOR PREPARING THE SAME, RESIST COMPOSITION, JET PRINTING INK COMPOSITION, CURING METHODS AND USES THEREOF 审中-公开
标题翻译：具有OXETANYL组的可固化聚酯及其制备方法，耐蚀组合物，喷墨打印墨水组合物，固化方法及其用途
公开(公告)号：WO2005044893A1
公开(公告)日：2005-05-19
申请号：PCT/JP2004/016698
申请日：2004-11-04
申请人： SHOWA DENKO K.K. , SAKATA, Yuko , UCHIDA, Hiroshi , KAMATA, Hirotoshi
发明人： SAKATA, Yuko , UCHIDA, Hiroshi , KAMATA, Hirotoshi
IPC分类号： C08G63/668
CPC分类号： C08G59/4207 , C08G63/20 , C08G63/668 , C08G63/914 , C09D11/101 , C09D11/104 , C09D11/30 , C09D167/00 , G03F7/038 , H05K3/285 , H05K3/4676 , H05K2201/0145 , H05K2203/013
摘要： There are provided a novel curable polyester, a cured product thereof, and a process for preparing the same, as well as a resist composition and a jet Printing ink composition comprising the curable polyester, curing methods and uses thereof. The curable polyester of the present invention has a polyester skeleton as a main chain and also has an oxetanyl group at the molecular end. The curable polyester of the present invention is excellent in curability and has excellent flexibility, adhesion and mechanical strength, and also exhibits high safety to the human. The resist composition containing a novel curable polyester having an oxetanyl group at the molecular end of the present invention is suitable for a solder resist for forming a pattern with high accuracy or an interlayer insulation film because neither bleeding after screen printing nor sagging upon heat curing occurs, and the jet printing ink composition containing a novel curable polyester having an oxetanyl group at the molecular end of the present invention is suitable for a solder resist or an interlayer insulation film, which is excellent in line width retention of a thin line pattern because neither bleeding nor sagging upon heat curing occurs.
摘要翻译：提供了一种新颖的可固化聚酯，其固化产物及其制备方法，以及抗蚀剂组合物和包含可固化聚酯的喷墨印刷油墨组合物，其固化方法和用途。本发明的固化性聚酯具有聚酯骨架作为主链，在分子末端具有氧杂环丁烷基。本发明的固化性聚酯的固化性优异，柔软性，粘合性，机械强度优异，对人体的安全性高。含有本发明分子末端具有氧杂环丁烷基的新型可固化聚酯的抗蚀剂组合物适用于形成高精度图案的阻焊剂或层间绝缘膜，因为丝网印刷后出现渗色或热固化时不会下垂，并且含有本发明分子末端具有氧杂环丁烷基的新型可固化聚酯的喷墨印刷油墨组合物适用于薄线图案的线宽保持性优异的阻焊层或层间绝缘膜，因为既不发生热固化时出血或下垂发生。

2. 发明申请

WO2005097882A1 THERMOSETTING COMPOSITION AND CURING METHOD THEREOF 审中-公开
标题翻译：热固化组合物及其固化方法
公开(公告)号：WO2005097882A1
公开(公告)日：2005-10-20
申请号：PCT/JP2005/007000
申请日：2005-04-05
申请人： SHOWA DENKO K.K. , KAMATA, Hirotoshi , KIMURA, Kazuya , UCHIDA, Hiroshi
发明人： KAMATA, Hirotoshi , KIMURA, Kazuya , UCHIDA, Hiroshi
IPC分类号： C08K5/00
CPC分类号： C08K5/3445 , C08L67/025 , C08L101/08 , C08L2666/02 , C09J167/025 , H05K3/287 , H05K3/4676 , C08L67/00
摘要： The invention relates to a thermosetting composition comprising (A) a compound having at least one oxetanyl group in the molecule, (B) a compound having at least two carboxyl groups in the molecule, and (C) an imidazolium salt, curing method thereof and products cured thereby. Cured products prepared from the composition of the invention are excellent in electrical isolation, flexibility, adhesiveness and mechanical strength.
摘要翻译：本发明涉及一种热固性组合物，其包含（A）分子中具有至少一个氧杂环丁烷基的化合物，（B）分子中具有至少两个羧基的化合物和（C）咪唑鎓盐，其固化方法和产品被固化。由本发明组合物制备的固化产品在电绝缘性，柔韧性，粘合性和机械强度方面是优异的。

3. 发明申请

WO2005075445A2 (METH) ACRYLOYL GROUP-CONTAINING OXETANE COMPOUND AND PRODUCTION METHOD THEREOF 审中-公开
标题翻译：（METH）含丙烯酸基团的含氧化合物及其制备方法
公开(公告)号：WO2005075445A2
公开(公告)日：2005-08-18
申请号：PCT/JP2005/002381
申请日：2005-02-09
申请人： SHOWA DENKO K.K. , KAMATA, Hirotoshi , MORINAKA, Katsutoshi , UCHIDA, Hiroshi
发明人： KAMATA, Hirotoshi , MORINAKA, Katsutoshi , UCHIDA, Hiroshi
IPC分类号： C07D305/00
CPC分类号： C07D305/06
摘要： The present invention relates to an oxetane compound containing a (meth)acryloyl group represented by formula (1) having a high copolymerizability with compounds containing a (meth) acryloyl group, and to a production method of an oxetane compound containing a (meth) acryloyl group which is characterized by reacting an isocyanate compound having a (meth) acryloyl group represented by formula (5) with an oxetane compound containing a hydroxyl group represented by formula (In the formula, R 1 represents a hydrogen atom or a methyl group, A represents -OR 2 - or a bond, R 2 represents a divalent hydrocarbon group which may contain an oxygen atom in the main chain, R 3 represents a linear or branched alkylene group having 1 to 6 carbon atoms, and R 4 represents a linear or branched alkyl group having 1 to 6 carbon atoms.)
摘要翻译：本发明涉及含有与（甲基）丙烯酰基的化合物具有高共聚性的由式（1）表示的（甲基）丙烯酰基的氧杂环丁烷化合物，以及含有（甲基）丙烯酰基其特征在于使具有式（5）表示的（甲基）丙烯酰基的异氰酸酯化合物与式（5）所示的含有羟基的氧杂环丁烷化合物反应（式中，R 1表示氢原子或甲基，A表示-OR 2 - 或键，R 2表示可在主链中含有氧原子的二价烃基，R 3表示碳原子数为1〜6的直链或支链亚烷基，R 4表示碳原子数为1〜6的直链或支链烷基。）

4. 发明申请

WO2006123814A2 PRODUCTION PROCESS OF BIFUNCTIONAL EPOXY MONOMER BY SELECTIVE OXIDATION OF DIOLEFIN COMPOUND 审中-公开
标题翻译：通过选择性氧化二烯化合物制备双官能环氧单体的生产工艺
公开(公告)号：WO2006123814A2
公开(公告)日：2006-11-23
申请号：PCT/JP2006/310097
申请日：2006-05-16
申请人： SHOWA DENKO K.K. , National Institute of Advanced Industrial Science and Technology , UCHIDA, Hiroshi , SAKATA, Yuko , HIRAKAWA, Ritsuko , SATO, Kazuhiko , OOKOSHI, Masanori
发明人： UCHIDA, Hiroshi , SAKATA, Yuko , HIRAKAWA, Ritsuko , SATO, Kazuhiko , OOKOSHI, Masanori
IPC分类号： C07D301/12 , C07D303/40
CPC分类号： C07D303/40 , C07D301/12
摘要： There is provided a novel method for producing a bifunctional epoxy monomer which comprises reacting diolefin with a hydrogen peroxide aqueous solution, in the presence of molybdenum or tungsten oxide as a catalyst to selectively epoxidize a double bound at a specific position. The bifunctional epoxy monomers provided by the present invention are substances widely used in various industrial fields such as chemical industry, as materials for resist materials (particularly solder resist materials), and intermediates of agrochemicals and medicines, and various polymers such as plasticizers, adhesives and coating resins.
摘要翻译：提供了一种制备双官能环氧单体的新方法，其包括在钼或钨氧化物作为催化剂的存在下使二烯烃与过氧化氢水溶液反应，以在特定位置选择性环氧化双键。由本发明提供的双官能环氧单体是广泛用于各种工业领域的物质，例如化学工业，抗蚀剂材料（特别是阻焊材料），农药和药物的中间体以及各种聚合物如增塑剂，粘合剂和涂料树脂。

5. 发明申请

WO2006093355A1 CARBOXYL GROUP-CONTAINING POLYURETHANE AND THERMOSETTING RESIN COMPOSITION USING THE SAME 审中-公开
标题翻译：含羧基的含聚氨酯和使用其的热固性树脂组合物
公开(公告)号：WO2006093355A1
公开(公告)日：2006-09-08
申请号：PCT/JP2006/304674
申请日：2006-03-03
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , KIMURA, Kazuya , SAKATA, Yuko
发明人： UCHIDA, Hiroshi , KIMURA, Kazuya , SAKATA, Yuko
IPC分类号： C08G18/44 , C08G18/66 , C08G18/28 , G03F7/035
CPC分类号： C08G18/44 , C08G18/0823 , C08G18/3212 , C08G18/672 , C08G18/73 , C08G18/757 , C08G18/758 , C08G18/7621 , C08G18/7642 , C08G59/4269 , C08L63/00 , C08L75/16 , C08G18/6659 , C08L2666/22
摘要： The invention relates to a carboxyl group-containing polyurethane, which is obtained by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol having a molecular weight of 300 to 50,000, (c) a dihydroxy compound having a carboxyl group and when necessary (d) a monohydroxy compound, a thermosetting composition using the carboxyl group-containing polyurethane and a paste for forming a film using thermosetting composition . The thermosetting composition of the invention is excellent in adhesion to a substrate, low warpage, flexibility, plating resistance and soldering heat resistance.
摘要翻译：本发明涉及含羧基的聚氨酯，其通过使（a）多异氰酸酯化合物，（b）分子量为300〜50,000的聚碳酸酯二醇，（c）具有羧基的二羟基化合物和必要的（d）单羟基化合物，使用含羧基的聚氨酯的热固性组合物和使用热固性组合物形成膜的糊剂。本发明的热固性组合物对基材的粘附性优异，翘曲性，柔韧性，耐电镀性和耐焊接性优异。

6. 发明申请

WO2009051272A1 METHOD AND APPARATUS FOR MANUFACTURING A RESIN STAMPER FOR A RECORDING MEDIUM 审中-公开
标题翻译：用于制造记录介质的树脂印章的方法和装置
公开(公告)号：WO2009051272A1
公开(公告)日：2009-04-23
申请号：PCT/JP2008/069175
申请日：2008-10-16
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , FUKUSHIMA, Masato , SAKATA, Yuko
发明人： UCHIDA, Hiroshi , FUKUSHIMA, Masato , SAKATA, Yuko
IPC分类号： B29C43/02 , B29C43/40 , B29C35/08 , G11B7/26
CPC分类号： B29C43/40 , B29B13/023 , B29C35/0805 , B29C43/021 , B29C2043/025 , B29L2017/003 , G11B5/855
摘要： The present invention provides a technique capable of manufacturing a resin stamper at a low cost. A method of manufacturing a plate-shaped resin stamper includes: pressing a resin composite base material (25) against a mother stamper (21) having a pattern formed on the surface thereof by compression molding to transfer the pattern of the mother stamper to the composite base material; and punching out the composite base material, hi the manufacturing method, the resin composite base material includes at least one curable (25c) resin. In addition, during the compression molding, a portion of the composite base material is cured by active energy beams or heat, the pattern is transferred to the composite base material, and the composite base material is punched out, thereby manufacturing the resin stamper.
摘要翻译：本发明提供能够以低成本制造树脂压模的技术。制造板状树脂压模的方法包括：通过压缩模塑将树脂复合材料（25）压靠在其表面上形成图案的母模（21）上，以将母模的图案转印到复合材料基材; 并冲压复合基材。在制造方法中，树脂复合基材包括至少一种可固化（25c）树脂。此外，在压缩成形时，复合基材的一部分通过活性能量束或热量固化，将图案转印到复合基材上，冲压出复合基材，由此制造树脂压模。

7. 发明申请

WO2006013989A1 CURABLE TRIAZINE COMPOSITION FOR ELECTRONIC COMPONENTS, PRODUCTION METHOD THEREFOR AND CURED PRODUCT THEREOF 审中-公开
标题翻译：电子元件的可固化TRIAZINE组合物，其生产方法及其固化产物
公开(公告)号：WO2006013989A1
公开(公告)日：2006-02-09
申请号：PCT/JP2005/014460
申请日：2005-08-01
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , SEKI, Kentaro , SAKATA, Yuko
发明人： UCHIDA, Hiroshi , SEKI, Kentaro , SAKATA, Yuko
IPC分类号： C08G73/06
CPC分类号： C08G61/122 , C08G73/0644 , C08L65/00 , C08L79/04 , G03F7/038 , H05K3/285
摘要： The invention relates to a curable triazine composition used as sealing material or varnish for electronic components, comprising a triazine compound represented by formula (1): (the symbols have the same meaning as defined in the Description), wherein part or all of the n X 1 ’s have a group curable by heat or light, production method thereof and a cured product thereof excellent in heat resistance and resistance against tin plating.
摘要翻译：本发明涉及用作电子部件的密封材料或清漆的可固化三嗪组合物，其包含由式（1）表示的三嗪化合物：（符号具有与说明书中所定义的相同的含义），其中部分或全部n X

8. 发明申请

WO2007142248A1 NOVEL EPOXY COMPOUNDS AND PROCESS FOR THEIR PRODUCTION 审中-公开
标题翻译：新型环氧化合物及其生产方法
公开(公告)号：WO2007142248A1
公开(公告)日：2007-12-13
申请号：PCT/JP2007/061398
申请日：2007-05-30
申请人： SHOWA DENKO K.K. , SASAKI, Nobutoshi , FUJITA, Toshio , UCHIDA, Hiroshi
发明人： SASAKI, Nobutoshi , FUJITA, Toshio , UCHIDA, Hiroshi
IPC分类号： C08G59/30 , C08G77/388
CPC分类号： C08G59/306 , C08G77/388
摘要： Novel epoxy compounds represented by the general formula (I) (wherein R 1 and R 2 each represent hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, each R 3 may be the same or different and each independently represents hydrogen, alkyl, aryl, aralkyl, alkenyl or fluoroalkyl, and n is 0 or a positive integer), and the general formula (II) (wherein R 3 represents the same groups specified above, R 4 represents hydrogen, a C1-6 alkyl group or a C1-4 trialkylsilyl group, and n is 0 or a positive integer), and a process for their production.
摘要翻译：由通式（I）表示的新型环氧化合物（其中R 1和R 2各自表示氢，C 1-6烷基或C 1-4三烷基甲硅烷基，每个R 3可以相同或不同，并且各自独立地表示氢，烷基，芳基，芳烷基，烯基或氟烷基，n为0或正整数）和通式（II）（其中R 3表示与上述相同的基团，R 4表示氢，C 1-6烷基或C 1-4三烷基甲硅烷基，n为0或正整数），以及它们的生产过程。

9. 发明申请

WO2007108550A1 RESIN COMPOSITION 审中-公开
标题翻译：树脂组合物
公开(公告)号：WO2007108550A1
公开(公告)日：2007-09-27
申请号：PCT/JP2007/056131
申请日：2007-03-16
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , INOUE, Hirofumi
发明人： UCHIDA, Hiroshi , INOUE, Hirofumi
IPC分类号： C09D7/12 , C09D7/06
CPC分类号： H05K3/285 , C08L71/03 , C09D7/47 , C09D7/65 , C09D11/52 , H05K2201/015 , H05K2201/0209 , H05K2201/0212
摘要： The invention relates to a thermosetting resin composition comprising (A) 20 to 90 mass% of thermosetting resin, (B)IO to 80 mass% of inorganic and/or organic fine particles and (C) 0.1 to 5 mass% of fluorine-containing polyether, wherein (C) is polymer having fluorinated alkyl polyoxetane structure of formula (1) or (2) (m is an integer of 1 to 100, n is an integer of 1 to 6, R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R 2 and R 3 each represent a straight or branched chain alkyl group having 1 to 20 carbon atoms, with a proviso that at least 50% of hydrogen atoms present in the alkyl group is substituted by fluorine and the other hydrogen atoms are substituted by hydrogen, iodine, chlorine or bromine atoms) or a composition containing copolymer which consists of monomer having fluorinated alkyl polyoxetane structure and oxygen-containing monomer having 2 to 6 carbon atoms .
摘要翻译：本发明涉及一种热固性树脂组合物，其包含（A）20-90质量％的热固性树脂，（B）10至80质量％的无机和/或有机细颗粒和（C）0.1至5质量％的含氟聚醚，其中（C）为具有式（1）或（2）的氟化烷基聚氧杂环丁烷结构的聚合物（m为1〜100的整数，n为1〜6的整数，R 1〜表示氢原子或碳原子数1〜6的烷基，R 2和R 3各自表示碳原子数1〜20的直链或支链烷基，条件是存在于烷基中的至少50％的氢原子被氟取代，其他氢原子被氢，碘，氯或溴原子取代）或含有共聚物的组合物，其由具有氟化烷基聚氧杂环丁烷的单体组成结构和含2-6个碳原子的含氧单体。

10. 发明申请

WO2007105781A1 THERMOSETTING RESIN COMPOSITION AND USES THEREOF 审中-公开
标题翻译：热固性树脂组合物及其用途
公开(公告)号：WO2007105781A1
公开(公告)日：2007-09-20
申请号：PCT/JP2007/055158
申请日：2007-03-08
申请人： SHOWA DENKO K.K. , UCHIDA, Hiroshi , UMEZAWA, Tomokazu
发明人： UCHIDA, Hiroshi , UMEZAWA, Tomokazu
IPC分类号： C08L75/04 , C08G18/08 , C08G18/44 , C08G18/69 , C08G18/75 , C08G59/42
CPC分类号： C08G18/758 , C08G18/0823 , C08G18/44 , C08G18/6576 , C08G18/6659 , C08G59/4269 , C08K3/016 , C08K5/5313 , C08L63/00 , C08L75/04 , H05K3/285 , H05K2201/012 , H05K2201/0212 , C08L2666/14 , C08L2666/22
摘要： The thermosetting resin composition and the solder resist ink according to the present invention are characterized by comprising: a thermosetting resin (A) comprising (A1) a compound containing an acid anhydride group and/or a carboxyl group and (A2) a compound having a functional group which reacts with (A1) described above and an organic filler (B) containing a phosphorus atom, wherein the organic filler (B) containing a phosphorus atom has an average particle diameter of 50 Êm or less. According to the present invention, capable of being provided at a low cost and a good productivity are an excellent thermosetting resin composition and solder resist ink capable of forming a cured material which achieves an adhesion to a substrate, a low warping property, a flexibility, a plating resistance, a solder heat resistance and a long term reliability as well as a flame retardancy, and a cured material and a protective film which are excellent in the above characteristics. Further, electronic parts having a protective film which is excellent in a flame retardancy and which has a high reliability can be provided.
摘要翻译：根据本发明的热固性树脂组合物和阻焊油墨的特征在于包括：包含（A1）含有酸酐基和/或羧基的化合物的热固性树脂（A）和（A2）具有与上述（A1）反应的官能团和含有磷原子的有机填料（B），其中，含有磷原子的有机填料（B）的平均粒径为50μm以下。根据本发明，能够以低成本和高生产率提供的是具有能够形成固化材料的优异的热固性树脂组合物和阻焊油墨，其能够实现与基材的粘合性，低翘曲性，柔软性，电镀电阻，焊料耐热性和长期可靠性以及阻燃性，以及上述特性优异的固化材料和保护膜。此外，可以提供具有阻燃性优异且可靠性高的保护膜的电子部件。

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