会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明申请
    • CONCURRENT EPOXIDATION AND CATALYST RESIDUE EXTRACTION
    • 同时环氧化和催化剂残留提取
    • WO1996036646A1
    • 1996-11-21
    • PCT/EP1996002138
    • 1996-05-15
    • SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.
    • SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.ERICKSON, James, RobertRAO, Bhaskar, PeecheraSTEVENS, Craig, AldredVEITH, Cary, Alan
    • C08C19/06
    • C08C2/04C08C19/06
    • A process for the concurrent epoxidation of, and catalyst residue extraction from, anionically polymerized diene-containing polymers which have been hydrogenated using a Group VIII metal catalyst, said process comprising: (a) introducing a catalyst residue-containing diene-containing polymer cement into a reactor; (b) heating the polymer cement to a temperature of from 25 to 65 DEG C; (c) contacting the polymer cement with a caustic solution; (d) contacting the polymer cement with a peracid solution; (e) mixing the polymer, caustic, and acid at from 25 to 65 DEG C for from 1/2 to 3 hours; (f) optionally adding sufficient caustic solution to neutralize excess acid while continuing the mixing; (g) adding sufficient water such that the aqueous/organic phase weight ratio is from 0.2:1 to 1:1 while continuing the mixing; (h) allowing the phases to settle for from 5 to 90 minutes; (i) removing the aqueous phase from the reactor; (j) optionally repeating steps (g), (h), and (i) until catalyst residue contents are less than 10 ppm; and (k) removing the polymer cement from the reactor and removing the solvent to recover the epoxidized polymer.
    • 一种使用VIII族金属催化剂进行氢化的阴离子聚合的含二烯聚合物的并行环氧化和催化剂残余物提取的方法,所述方法包括:(a)将含催化剂残余物的含二聚物的聚合物水泥引入 一个反应堆 (b)将聚合物水泥加热到25至65℃的温度; (c)使聚合物水泥与苛性碱溶液接触; (d)使聚合物水泥与过酸溶液接触; (e)将聚合物,苛性碱和酸在25至65℃下混合1/2至3小时; (f)任选地加入足量的苛性碱溶液以中和过量的酸,同时继续混合; (g)加入足够的水使得水/有机相重量比为0.2:1至1:1,同时继续混合; (h)允许相沉降5至90分钟; (i)从反应器中除去水相; (j)任选地重复步骤(g),(h)和(i),直到催化剂残余物含量小于10ppm; 和(k)从反应器中除去聚合物粘合剂并除去溶剂以回收环氧化聚合物。
    • 7. 发明申请
    • PRESSURE SENSITIVE STRUCTURAL ADHESIVES AND SEALANTS BASED ON TELECHELIC/HETEROTELECHELIC POLYMERS WITH DUAL CURE SYSTEMS
    • 基于具有双重固化系统的电话/聚酯聚合物的压敏粘结剂粘合剂和密封剂
    • WO1996011240A1
    • 1996-04-18
    • PCT/EP1995004015
    • 1995-10-09
    • SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.
    • SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.ST. CLAIR, David, JohnERICKSON, James, Robert
    • C09J157/00
    • C08G59/027C08G18/6208C08G18/69C08G18/698C08G59/18C08G2170/40C08G2190/00C08J3/243C08L2666/16C08L2666/24C09J4/06C09J119/006C09J163/00C09J163/08C09J175/04
    • Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer at near ambient temperature such that a pressure sensitive adhesive or sealant is formed and the other element cures the telechelic polymer upon baking at least at 100 DEG C to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer, and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.
    • 压敏结构粘合剂和密封剂组合物,其包含:(a)包含95至15重量%的遥爪聚合物和5至85重量%的异丙炔基聚合物的聚合物体系,其中至少一个其上的官能团相同 作为遥爪聚合物上的功能,和(b)双重固化系统,其中固化体系的一个元素在近环境温度下固化遥爪聚合物,使得形成压敏粘合剂或密封剂,并且另一种元素固化遥爪聚合物 至少在100℃下烘烤以形成结构粘合剂或密封剂组合物。 在一个优选的实施方案中,聚合物体系由羟基官能的遥爪二醇或多元醇聚合物组成,并且所述异氧自由基聚合物是也具有环氧化烯烃官能团的单羟基化聚二烯烃聚合物。 双重固化体系优选由异氰酸酯固化剂组成,以在环境温度下固化通过羟基以形成压敏粘合剂或密封剂和氨基树脂,以在烘烤时通过环氧官能团固化以形成结构粘合剂或密封剂。