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    • 1. 发明申请
    • METHOD OF MANUFACTURING A FIBROUS SUBSTRATE INCORPORATING AN ELECTRONIC CHIP
    • 制造混合电子芯片的薄膜基板的方法
    • WO2004048691A3
    • 2004-07-29
    • PCT/GB0305092
    • 2003-11-24
    • RUE DE INT LTDHOWLAND PAULHENDERSON PETER MCLEANSNELLING JAMES PETER
    • HOWLAND PAULHENDERSON PETER MCLEANSNELLING JAMES PETER
    • D21F1/44D21H1/44
    • D21F1/44
    • The invention relates to improvements in manufacturing substrates and in particular to a method of manufacturing a fibrous substrate, such as paper, incorporating an electronic circuit. A method of making a fibrous substrate comprises the steps of depositing fibres on a support surface to form a fibrous mat and incorporating at least one electronic chip (11) during the fibre deposition process. The support surface comprises means for modifying the distribution of fibres as they are deposited on the support surface to provide at least one area (13, 14) of the fibrous mat having a grammage which is greater or less than that of the rest of the fibrous mat. The said area (13, 14) is positioned with respect to said chip such that the thickness of the substrate in a region of the chip is not greater than the thickness of the substrate in a region of the substrate immediately adjacent the chip.
    • 本发明涉及制造基板的改进,特别涉及一种制造包含电子电路的诸如纸的纤维基材的方法。 制造纤维基材的方法包括以下步骤:在纤维沉积工艺中将纤维沉积在支撑表面上以形成纤维垫并且并入至少一个电子芯片(11)。 支撑表面包括用于在纤维沉积在支撑表面上时修改纤维的分布的装置,以提供至少一个纤维垫的区域(13,14),其具有大于或小于纤维的其余部分的克重 垫。 所述区域(13,14)相对于所述芯片定位,使得芯片区域中的衬底的厚度不大于紧邻芯片的衬底区域中衬底的厚度。