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    • 3. 发明申请
    • METHODS AND APPARATUSES FOR DRYING ELECTRONIC DEVICES
    • 干燥电子设备的方法和装置
    • WO2014153007A1
    • 2014-09-25
    • PCT/US2014/028634
    • 2014-03-14
    • REVIVE ELECTRONICS, LLC
    • ZIELINSKI, ReubenTRUSTY, JoelTRUSTY, Micah
    • F26B5/14F26B3/04F26B11/00F26B21/10F26B23/00B01D53/26
    • F26B25/22F26B3/02F26B5/04F26B9/06F26B2200/00
    • Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device. Embodiments include heating the gas supplied into the interior of the electronic device with pump used to decrease pressure within the electronic device and/or a separate heater. Still other embodiments include controlling the temperature of the gas supplied into the electronic device. Still further embodiments automatically control, such as by using an electronic processor, some or all aspects of the drying of the electronic device. Yet further embodiments remove moisture by supplying pressurized gas, which may be heated, to the interior of the electronic device with or without placing the electronic device in a low pressure environment.
    • 公开了用于干燥电子设备的方法和设备。 实施例包括在电子设备内加热和减少压力的方法和装置。 一些实施例在增加和减少压力的同时增加热能,例如通过使用与电子设备接触的加热压板或通过将可被加热的气体(例如空气)供应到电子设备的内部。 实施例包括使用用于降低电子设备内的压力的泵和/或单独的加热器来加热供应到电子设备内部的气体。 其它实施例包括控制供应到电子设备中的气体的温度。 另外的实施例,例如通过使用电子处理器自动控制电子设备的干燥的一些或所有方面。 另外的实施例通过在电子设备处于或不将电子设备置于低压环境中的情况下,将可能被加热的加压气体供应到电子设备的内部来去除水分。