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1. 发明申请

WO2011138684A3 PICK AND BOND METHOD AND APPARATUS FOR TRANSFERRING ADHESIVE ELEMENT TO SUBSTRATE 审中-公开
标题翻译：用于将粘合元件转移到基板的拾取和粘合方法和设备
公开(公告)号：WO2011138684A3
公开(公告)日：2012-03-22
申请号：PCT/IB2011001423
申请日：2011-05-03
申请人： RAYMOND A & CIE , HANSEL MATHIAS
发明人： HANSEL MATHIAS
IPC分类号： F16B11/00 , C09J5/06 , H01L23/498 , H05K3/34
CPC分类号： B65G65/40 , B29C65/02 , B29C65/544 , F16B11/006 , H01L21/486 , Y10T156/17
摘要： A method and apparatus for transferring formed adhesive elements from a reservoir (30) containing plural formed adhesive elements (12) to a bonding part attachable to a glass surface or other substrate through the use of adhesives. Transfer of the formed adhesive element to the bonding part (14) is accomplished by use of a vacuum tool (10) having a vacuum outlet, an internal plenum, and a series of vacuum lines formed in an adhesive element holding face. The vacuum tool is positioned over a reservoir of formed adhesive elements. Once the formed adhesive elements have been captured by the vacuum tool (10) the tool is used to place them into contact with the heated bonding part (14) directly or indirectly by intermediate placement onto a matrix (60) having a plurality of ejector pins (72) movably fitted therein. The ejector pins move the formed adhesive elements into position against the bonding part.
摘要翻译：一种方法和设备，用于通过使用粘合剂将形成的粘合剂元件从包含多个形成的粘合剂元件（12）的贮存器（30）转移到可附着到玻璃表面或其他基底的粘合部分。通过使用具有真空出口，内部充气室以及在粘合元件保持面中形成的一系列真空线的真空工具（10）来实现将形成的粘合元件转移到结合部分（14）。真空工具定位在形成的粘合剂元件的储存器上方。一旦形成的粘合剂元件已经被真空工具（10）捕获，则该工具被用于将它们直接或间接地通过中间放置到具有多个推顶销（14）的矩阵（60）上而与加热的接合部件（72）可移动地安装在其中。推顶销将形成的粘合元件移动到抵靠粘合部分的位置。

2. 发明申请

WO2011138684A4 PICK AND BOND METHOD AND APPARATUS FOR TRANSFERRING ADHESIVE ELEMENT TO SUBSTRATE 审中-公开
标题翻译：用于将粘合元件转移到基板的拾取和粘合方法和装置
公开(公告)号：WO2011138684A4
公开(公告)日：2012-07-12
申请号：PCT/IB2011001423
申请日：2011-05-03
申请人： RAYMOND A & CIE , HANSEL MATHIAS
发明人： HANSEL MATHIAS
IPC分类号： F16B11/00 , C09J5/06 , H01L23/498 , H05K3/34
CPC分类号： B65G65/40 , B29C65/02 , B29C65/544 , F16B11/006 , H01L21/486 , Y10T156/17
摘要： A method and apparatus for transferring formed adhesive elements from a reservoir (30) containing plural formed adhesive elements (12) to a bonding part attachable to a glass surface or other substrate through the use of adhesives. Transfer of the formed adhesive element to the bonding part (14) is accomplished by use of a vacuum tool (10) having a vacuum outlet, an internal plenum, and a series of vacuum lines formed in an adhesive element holding face. The vacuum tool is positioned over a reservoir of formed adhesive elements. Once the formed adhesive elements have been captured by the vacuum tool (10) the tool is used to place them into contact with the heated bonding part (14) directly or indirectly by intermediate placement onto a matrix (60) having a plurality of ejector pins (72) movably fitted therein. The ejector pins move the formed adhesive elements into position against the bonding part.
摘要翻译：一种用于通过使用粘合剂将形成的粘合剂元件从包含多个形成的粘合元件（12）的储存器（30）转移到可附着到玻璃表面或其它基底上的粘合部分的方法和装置。通过使用具有真空出口，内部增压室和形成在粘合剂元件保持面中的一系列真空管线的真空工具（10）来实现将形成的粘合元件转移到接合部分（14）。真空工具位于形成的粘合剂元件的储存器上。一旦所形成的粘合剂元件已被真空工具（10）捕获，则使用该工具将其通过中间放置直接或间接地与加热的接合部分（14）接触，所述基体（60）具有多个顶针（72）可移动地装配在其中。顶出销将成形的粘合剂元件移动到抵靠接合部分的位置。

3. 发明申请

WO2011138674A3 METHOD AND APPARATUS FOR PLACING ADHESIVE ELEMENT ON A MATRIX 审中-公开
标题翻译：用于在基质上放置粘合元素的方法和装置
公开(公告)号：WO2011138674A3
公开(公告)日：2012-03-22
申请号：PCT/IB2011001349
申请日：2011-05-03
申请人： RAYMOND A & CIE , HANSEL MATHIAS , LE PABIC HERBERT , KOELBERT EMILIEN
发明人： HANSEL MATHIAS , LE PABIC HERBERT , KOELBERT EMILIEN
IPC分类号： F16B11/00 , C09J5/06 , H01L23/498 , H05K3/34
CPC分类号： B65G65/40 , B29C65/02 , B29C65/544 , F16B11/006 , H01L21/486 , Y10T156/17
摘要： A method and apparatus for positioning, holding and moving formed adhesive elements (40) to a heated bonding part (42) are disclosed. The apparatus includes a hopper (12) movably positioned over a matrix plate (14). The matrix plate includes a nesting matrix (18) defined by formed adhesive element - receiving apertures (22). An ejector system (20) is fitted beneath the matrix plate and includes a body (24) having a vacuum chamber (26) with an air inlet (28) and an air exhaust (30). The chamber is fluidly continuous with the apertures formed in the matrix plate (14). The ejector system includes a lifting body to which ejector stamps (34,34') and an inlet shut off shaft are attached. Channels for the ejector stamps are formed in the body of the ejector system. The ejector stamps are movably fitted in the apertures and the channels. In operation, the hopper (12) slides over the matrix and deposits formed adhesive elements into the apertures (22) then slides away.
摘要翻译：公开了一种用于将形成的粘合元件（40）定位，保持和移动到加热的接合部分（42）的方法和装置。该装置包括可移动地定位在矩阵板（14）之上的料斗（12）。矩阵板包括由形成的粘合元件 - 接收孔（22）限定的嵌套基体（18）。喷射器系统（20）安装在矩阵板的下面，并且包括具有带有空气入口（28）和排气（30）的真空室（26）的主体（24）。腔室与形成在矩阵板（14）中的孔流体连续。喷射器系统包括提升体，喷射器标记（34,34'）和入口关闭轴被附接到该提升体上。用于喷射器标记的通道形成在喷射器系统的主体中。喷射器邮票可移动地装配在孔和通道中。在操作中，料斗（12）在基体上滑动并将形成的粘合剂元件沉积到孔（22）中然后滑动。

4. 发明申请

WO2011161514A3 PICK AND BOND METHOD FOR ATTACHMENT OF ADHESIVE ELEMENT TO SUBSTRATE 审中-公开
标题翻译：用于将粘合元件连接到基板的拾取和粘合方法
公开(公告)号：WO2011161514A3
公开(公告)日：2012-03-15
申请号：PCT/IB2011001384
申请日：2011-05-03
申请人： RAYMOND A & CIE , HANSEL MATHIAS , LAURE FREDERIC , DAVERIO OLIVIER
发明人： HANSEL MATHIAS , LAURE FREDERIC , DAVERIO OLIVIER
IPC分类号： F16B11/00 , C09J5/06 , H01L23/498 , H05K3/34
CPC分类号： B65G65/40 , B29C65/02 , B29C65/544 , F16B11/006 , H01L21/486 , Y10T156/17
摘要： A method for the attachment of a formed adhesive element (34,34') to a hot bonding part (10) in a practical and efficient way is disclosed. The formed adhesive element may be attached to the hot bonding part by the end-user prior to attachment of the hot bonding part to the substrate. In order to attach the formed adhesive element (34,34') to the bonding part according to the disclosed invention, the bonding part (10) is heated then is moved in position over the formed adhesive element positioned on a detent of a matrix plate (36). Thereafter the hot bonding part is moved into contact with the formed adhesive element or the formed adhesive element is moved against the hot bonding part. The bonding part, now having the formed adhesive element attached, is ready for attachment to the substrate. One or more formed adhesive elements may be attached to the bonding part. Attachment of the formed adhesive elements to the bonding part may be done manually or mechanically.
摘要翻译：公开了一种以实用和有效的方式将形成的粘合元件（34,34'）附接到热粘合部分（10）的方法。在将热粘合部分附接到基底之前，形成的粘合元件可以由终端用户附接到热粘合部分。为了将形成的粘合元件（34,34'）附接到根据公开的发明的接合部分，接合部件（10）被加热然后被移动到定位在矩阵板的制动器上的形成的粘合元件上（36）。此后，热粘合部分移动与形成的粘合元件接触，或者形成的粘合元件抵靠热粘合部分移动。现在具有所形成的粘合剂元件的接合部件准备好连接到基底。一个或多个成形的粘合剂元件可以附接到粘合部分。形成的粘合剂元件附着到粘合部分可以手动或机械地完成。

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