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    • 6. 发明申请
    • UTILIZING PROCESSING UNITS TO CONTROL TEMPERATURE
    • 利用加工单元来控制温度
    • WO2018067225A1
    • 2018-04-12
    • PCT/US2017/045318
    • 2017-08-03
    • QUALCOMM INCORPORATED
    • KUSHLEYEV, AleksandrAHMED, RizwanMELLINGER III, Daniel WarrenTURPIN, Matthew Hyatt
    • G01D3/036G06F11/30
    • Various embodiments include methods for performing temperature calibration of a first temperature sensitive unit with an electronic device having a first processing unit that is thermally coupled to the first temperature sensitive unit. Various embodiments may include determining a current temperature of the first temperature sensitive unit, determining a processing load for the first processing unit based on the current temperature and a target temperature, applying the determined processing load to the first processing unit to vary a temperature of the first temperature sensitive unit, and determining a temperature bias for the first temperature sensitive unit at the temperature of the first temperature sensitive unit based on an output of the first temperature sensitive unit.
    • 各种实施例包括用于利用具有热耦合到第一温度敏感单元的第一处理单元的电子设备来执行第一温度敏感单元的温度校准的方法。 各种实施例可以包括确定第一温度敏感单元的当前温度,基于当前温度和目标温度确定第一处理单元的处理负载,将确定的处理负载应用于第一处理单元以改变第一处理单元的温度 第一温度敏感单元,并且基于第一温度敏感单元的输出来确定第一温度敏感单元在第一温度敏感单元的温度下的温度偏置。