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1. 发明申请

WO2005053928A3 COMPOSITIONS AND METHODS FOR USE IN THREE DIMENSIONAL MODEL PRINTING 审中-公开
标题翻译：用于三维模型印刷的组合物和方法
公开(公告)号：WO2005053928A3
公开(公告)日：2005-08-04
申请号：PCT/IL2004001089
申请日：2004-11-28
申请人： OBJET GEOMETRIES LTD , NAPADENSKY EDUARDO , KRITCHMAN ELIAHU M , COHEN AVI
发明人： NAPADENSKY EDUARDO , KRITCHMAN ELIAHU M , COHEN AVI
IPC分类号： B29C20060101 , B29C35/02 , B29C35/08 , B29C37/00 , B29C41/48 , B29C41/52 , B41J2/01 , B41M3/00 , G03C9/08
CPC分类号： B29C64/10 , B29C37/005 , B29C41/48 , B29C41/52 , B29C64/106 , B29C64/112 , B29C64/40 , B29C67/0055 , B29C67/24 , B29K2063/00 , B29L2009/00 , B33Y10/00 , B33Y40/00 , B33Y70/00 , B33Y80/00 , B41M3/16
摘要： A pseudo composite material, may include, inter alia, a first phase and a second phase, wherein each phase may include, inter alia, an organic compound, wherein each phase comprising a multiplicity of construction layers, wherein the layers were deposited by ink-jet printing, wherein the pseudo composite material exhibits non-homogeneous three-dimensional structure. A method is disclosed for the preparation of a pseudo composite material. An apparatus is disclosed for printing a pseudo composite material. Furthermore, there is disclosed a method for printing a three-dimensional object using various suitable materials.
摘要翻译：假赝复合材料尤其可以包括第一相和第二相，其中每一相尤其可以包括有机化合物，其中每一相包含多个构造层，其中这些层通过喷墨方法沉积，其中所述假复合材料呈现非均匀的三维结构。公开了一种制备假复合材料的方法。公开了一种用于印刷假复合材料的设备。此外，公开了一种使用各种合适的材料印刷三维物体的方法。

2. 发明申请

WO2009013751A3 SOLID FREEFORM FABRICATION USING A PLURALITY OF MODELING MATERIALS 审中-公开
标题翻译：使用多种建模材料的固体FREEFORM制造
公开(公告)号：WO2009013751A3
公开(公告)日：2010-04-15
申请号：PCT/IL2008001025
申请日：2008-07-24
申请人： OBJET GEOMETRIES LTD , NAPADENSKY EDUARDO , MENCHIK GUY , KRITCHMAN ELIAHU M , SHTILERMAN SLAVA , KLEINHENDLER CHAIM , LEVI MOSHE , TARAN DAVID
发明人： NAPADENSKY EDUARDO , MENCHIK GUY , KRITCHMAN ELIAHU M , SHTILERMAN SLAVA , KLEINHENDLER CHAIM , LEVI MOSHE , TARAN DAVID
IPC分类号： B29C67/00
CPC分类号： B29C67/0066 , B29C64/106 , B29C64/112 , B29C64/20 , B29C64/393 , B29C64/40 , B29C67/0059 , B29C67/0088 , B29C67/0092 , B29C67/202 , B29K2105/0058 , B29K2105/24 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , G06T17/00 , Y10T428/24802
摘要： A system and methods for solid freeform fabrication of an object is disclosed. The system comprises a solid freeform fabrication apparatus having a plurality of dispensing heads, a building material supply apparatus configured to supply a plurality of building materials to the fabrication apparatus, and a control unit configured for controlling the fabrication apparatus and the supply apparatus based on an operation mode selected from a plurality of predetermined operation modes.
摘要翻译：公开了用于物体的固体自由形状制造的系统和方法。该系统包括具有多个分配头的固体自由形状制造装置，构造成向制造装置供应多个建筑材料的建筑材料供给装置，以及基于以下步骤控制制造装置和供给装置的控制单元操作模式从多个预定操作模式中选择。

3. 发明申请

WO2008142691A3 METHOD OF REMOVING SUPPORT STRUCTURE FROM 3-D OBJECTS MADE BY SOLID FREEFORM FABRICATION 审中-公开
标题翻译：通过固体FREEFORM制造从三维物体移除支撑结构的方法
公开(公告)号：WO2008142691A3
公开(公告)日：2010-02-25
申请号：PCT/IL2008000694
申请日：2008-05-22
申请人： OBJET GEOMETRIES LTD , KRITCHMAN ELIAHU M , KLEINHENDLER CHAIM , TARAN DAVID , NAROVLYANSKY VLADIMIR , COHEN AVI , SOFFER BEVERLEY
发明人： KRITCHMAN ELIAHU M , KLEINHENDLER CHAIM , TARAN DAVID , NAROVLYANSKY VLADIMIR , COHEN AVI , SOFFER BEVERLEY
IPC分类号： B24C1/00
CPC分类号： B08B3/06 , B08B3/006 , B29C64/35 , B29C64/40 , B33Y40/00 , B33Y80/00
摘要： Some demonstrative embodiments of the invention include an apparatus and a method for removing the support structures from three-dimensional objects, in which the support removal is carried out using techniques that decrease the duration of the support removal process and increase the quality of the final three-dimensional objects. This method also ensures the safe removal of the support structures without damage to the three-dimensional object.
摘要翻译：本发明的一些说明性实施例包括一种用于从三维物体中移除支撑结构的装置和方法，其中使用减少支撑移除过程的持续时间并提高最终三次的质量的技术进行支撑移除维对象。该方法还确保了支撑结构的安全移除而不损坏三维物体。

4. 发明申请

WO2004096527A3 RAPID PROTOTYPING APPARATUS 审中-公开
标题翻译：快速原型设备
公开(公告)号：WO2004096527A3
公开(公告)日：2005-02-17
申请号：PCT/IL2004000368
申请日：2004-05-02
申请人： OBJET GEOMETRIES LTD , ZEYTOUN IGAL , LEVI MOSHE , KRITCHMAN ELIAHU M , ESHED DAVID , GOTHAIT HANAN , DANAI DROR , BAR NATHAN MEIR , KLEINHENDLER CHAIM , MENCHIK GUY
发明人： ZEYTOUN IGAL , LEVI MOSHE , KRITCHMAN ELIAHU M , ESHED DAVID , GOTHAIT HANAN , DANAI DROR , BAR NATHAN MEIR , KLEINHENDLER CHAIM , MENCHIK GUY
IPC分类号： B29C67/00
CPC分类号： B29C64/135 , B29C64/112 , B29C64/209 , B29C64/321 , B29C64/343 , B29C64/35 , B29C64/386 , B29C67/0059 , B29C67/0088 , B29C67/0096 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02 , B33Y70/00 , G05B19/048 , G05B2219/49023 , G06F17/50
摘要： Apparatus for producing an object by sequentially forming thin layers of a construction material one on top of the other responsive to data defining the object, the apparatus comprising: a plurality of printing heads (52) each having a surface formed with a plurality of output orifices (58) and controllable to dispense the construction material through each orifice independently of the other orifices; a shuttle (50) to which the printing heads are mounted; a support surface; and a controller adapted to control the shuttle to move back and forth over the support surface and as the shuttle moves to control the printing heads to dispense the construction material through each of their respective orifices responsive to the data to form a first layer on the support surface and thereafter, sequentially the other layers; wherein each printing head is dismountable from the shuttle and replaceable independently of the other printing heads.
摘要翻译：用于通过依据形成物体的数据顺序地形成一层结构材料的薄层来制造物体的设备，所述设备包括：多个打印头（52），每个打印头具有形成有多个输出孔的表面（58），并可控制，以独立于其他孔口分配每个孔口的建筑材料; 安装打印头的梭子（50）; 支撑面; 以及控制器，其适于控制梭子在支撑表面上来回移动，并且随着梭子移动以控制打印头，以响应于数据来分配建筑材料通过它们各自的孔中的每一个，以在支撑件上形成第一层表面，然后依次是其他层; 其中每个打印头可从梭子上拆卸并且可独立于其它打印头进行替换。

5. 发明申请

WO2011095968A2 FABRICATION OF CONTACTS FOR SEMICONDUCTOR SUBSTRATES 审中-公开
标题翻译：半导体衬底接触的制造
公开(公告)号：WO2011095968A2
公开(公告)日：2011-08-11
申请号：PCT/IL2011000112
申请日：2011-01-31
申请人： XJET LTD , PELEG RAN ASHER , DOVRAT MICHAEL , KRITCHMAN ELIAHU M
发明人： PELEG RAN ASHER , DOVRAT MICHAEL , KRITCHMAN ELIAHU M
IPC分类号： H01L31/0224
CPC分类号： H01L31/022425 , H01L31/068 , Y02E10/547
摘要： A method for fabricating electric contacts for a semiconductor substrate includes depositing a first line of a first conducting material on the semiconductor substrate and depositing a second line of a second conducting material on the substrate, so as to cross the first line. The first conducting material and the second conducting material may differ from one another in that the first conducting material and the second conducting material penetrate into the substrate to different depths when subjected to a heat treatment. Furthermore, materials may differ from one another in that an electrical connection formed between the substrate and the first conducting material when subjected to the heat treatment differs in its contact resistivity from an electrical connection formed between the substrate and the second conducting material when subjected to the heat treatment. Alternatively, the method may include depositing a first line of a conducting material on the substrate, the first line including a zone of reduced thickness, and depositing a second line of a conducting material on the substrate, so as to cross the first line at the zone of the reduced thickness.
摘要翻译：一种用于制造用于半导体衬底的电触头的方法，包括在半导体衬底上沉积第一导电材料的第一线，并在衬底上沉积第二导电材料的第二线，以跨过第一线。第一导电材料和第二导电材料可以彼此不同，因为当进行热处理时，第一导电材料和第二导电材料在基板中渗透到不同的深度。此外，材料可以彼此不同，因为当经受热处理时，在基板和第一导电材料之间形成的电连接的接触电阻与当基板和第二导电材料之间形成的电连接受到热处理。或者，该方法可以包括在衬底上沉积导电材料的第一线，第一线包括厚度减小的区域，以及在衬底上沉积导电材料的第二线，从而在第厚度减小的区域。

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