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    • 1. 发明申请
    • CHIP-REISTANT SHEET-LIKE VIBRATION DAMPER
    • 芯片抗振片状振动阻尼器
    • WO2013129164A2
    • 2013-09-06
    • PCT/JP2013053881
    • 2013-02-18
    • NIHON TOKUSHU TORYO CO LTDTOYOTA MOTOR CO LTD
    • TAKATA AYUMINAKAMOTO KUNITOSHI
    • C09J7/02
    • F16F1/3605C09J7/0203C09J7/35
    • [Purpose] To provide a sheet-like vibration damper that has damping properties and chip resistance, and can be adhered by means of self-adhesion or thermal fusion via an adhesive layer comprising an adhesive or a hot melt adhesive, even at locations such as an engine compartment or under the floor of a vehicle. [Solution] A sheet-like vibration damper exhibiting damping properties and chip resistance, which is formed from a thermosetting vibration-damping sheet and an adhesive layer, wherein the thermosetting vibration-damping sheet includes: at least one synthetic rubber selected from among styrene-butadiene rubbers, butadiene rubbers and high-styrene rubbers; a polybutadiene elastomer; a setting agent; a petroleum resin; and an inorganic filler.
    • 本发明的目的是提供一种具有阻尼性能和抗碎裂性的片状振动阻尼器,该片状振动阻尼器可以通过包括粘合剂或热熔性粘合剂的粘合剂层的自粘合或热熔合来粘合,即使在诸如 发动机舱或车辆地板下。 一种由热固性减振片和粘合剂层形成的具有阻尼性能和抗碎裂性的片状振动阻尼器,其中,所述热固性减振片材包括:至少一种选自苯乙烯 - 丁二烯橡胶,丁二烯橡胶和高苯乙烯橡胶; 聚丁二烯弹性体; 设定代理人; 石油树脂; 和无机填料。