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    • 3. 发明申请
    • BOOSTED SUBSTRATE/TUB PROGRAMMING FOR FLASH MEMORIES
    • 用于闪存存储器的增强基板/ TUB编程
    • WO2005029501A1
    • 2005-03-31
    • PCT/US2004/030014
    • 2004-09-14
    • MICRON TECHNOLOGY, INC.NAZARIAN, Hagop, A.
    • NAZARIAN, Hagop, A.
    • G11C16/04
    • G11C16/12G11C16/0483
    • A boosted substrate tub/substrate floating gate memory cell programming process is described that applies a voltage to the substrate or substrate "tub" of a NAND Flash memory array to precharge a channel of carriers within the floating gate memory cells prior to applying a high gate programming voltage to the gate of the selected floating gate memory cells and coupling a program or program-inhibit voltage to program the selected floating gate memory cell(s) as desired. The use of a boosted tub programming approach avoids the requirement that the bitline and/or source line circuit design of the NAND Flash array be able to withstand or carry high voltages during programming of a floating gate memory cells and allows reuse of the block erase high voltage circuits connected to the substrate tub. This allows the NAND Flash memory array to be designed with smaller circuit designs and/or smaller circuit feature elements.
    • 描述了一种升压的衬底槽/衬底浮动栅极存储单元编程过程,其将电压施加到NAND闪存阵列的衬底或衬底“桶”,以在施加高栅极之前对浮置栅极存储器单元中的载流子通道预充电 编程电压到所选择的浮动栅极存储器单元的栅极,并且耦合程序或程序禁止电压以根据需要对所选择的浮动栅极存储单元进行编程。 使用升压桶编程方法避免了NAND​​闪存阵列的位线和/或源极线电路设计在浮置栅极存储器单元的编程期间能够承受或承载高电压,并允许重新使用块擦除高电平 连接到衬底桶的电压电路。 这允许NAND闪存阵列被设计成具有更小的电路设计和/或更小的电路特征元件。