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1. 发明申请

WO2006011897A1 PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELECTRONIC IMAGERS 审中-公开
标题翻译：包装微电子图像和包装微电子图像的方法
公开(公告)号：WO2006011897A1
公开(公告)日：2006-02-02
申请号：PCT/US2004/037415
申请日：2004-11-09
申请人： MICRON TECHNOLOGY, INC. , AKRAM, Salman , WATKINS, Charles, M. , KIRBY, Kyle, K. , WOOD, Alan, G. , HIATT, William, M.
发明人： AKRAM, Salman , WATKINS, Charles, M. , KIRBY, Kyle, K. , WOOD, Alan, G. , HIATT, William, M.
IPC分类号： H01L27/146
CPC分类号： H01L27/146 , H01L21/76898 , H01L27/14618 , H01L27/148 , H01L31/02016 , H01L2224/48227 , H01L2924/01046 , H01L2924/01066 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.
摘要翻译：本文公开了微电子成像器，用于封装微电子成像器的方法，以及用于在微电子成像器中形成导电晶片间互连的方法。在一个实施例中，微电子成像管芯可以包括微电子衬底，集成电路和电耦合到集成电路的图像传感器。接合焊盘由衬底承载并电耦合到集成电路。导电晶片互连延伸穿过衬底并与接合焊盘接触。互连可以包括完全延伸穿过衬底和接合焊盘的通道，沉积到通道中并与衬底接触的电介质衬垫，沉积在电介质衬垫的至少一部分上的第一和第二导电层以及导电在第二导电层的至少一部分上沉积到通道中并且电耦合到接合焊盘的填充材料。

2. 发明申请

WO2011116315A2 LIGHT EMITTING DIODES AND METHODS FOR MANUFACTURING LIGHT EMITTING DIODES 审中-公开
标题翻译：发光二极管和制造发光二极管的方法
公开(公告)号：WO2011116315A2
公开(公告)日：2011-09-22
申请号：PCT/US2011/029045
申请日：2011-03-18
申请人： MICRON TECHNOLOGY, INC. , WATKINS, Charles, M.
发明人： WATKINS, Charles, M.
IPC分类号： H01L33/50 , H01L33/52
CPC分类号： H01L33/50 , H01L2933/0041
摘要： Light emitting diodes and methods for manufacturing light emitting diodes are disclosed herein. In one embodiment, a method for manufacturing a light emitting diode (LED) comprises applying a first light conversion material to a first region on the LED and applying a second light conversion material to a second, different region on the LED. A portion of the LED is exposed after applying the first and second light conversion materials.
摘要翻译：本文公开了发光二极管和制造发光二极管的方法。在一个实施例中，制造发光二极管（LED）的方法包括将第一光转换材料施加到LED上的第一区域，并将第二光转换材料施加到LED上的第二不同区域。在施加第一和第二光转换材料之后，LED的一部分被曝光。

3. 发明申请

WO2011109417A2 METHOD FOR FORMING A LIGHT CONVERSION MATERIAL 审中-公开
标题翻译：形成光转换材料的方法
公开(公告)号：WO2011109417A2
公开(公告)日：2011-09-09
申请号：PCT/US2011/026712
申请日：2011-03-01
申请人： MICRON TECHNOLOGY, INC. , WATKINS, Charles, M. , TETZ, Kevin , GEHRKE, Thomas
发明人： WATKINS, Charles, M. , TETZ, Kevin , GEHRKE, Thomas
CPC分类号： H01L33/44 , H01L33/507 , H01L2933/0041
摘要： A method and system for manufacturing a light conversion structure for a light emitting diode (LED) is disclosed. The method includes forming a transparent, thermally insulating cover over an LED chip. The method also includes dispensing a conversion material onto the cover to form a conversion coating on the cover, and encapsulating the LED, the silicone cover, and the conversion coating within an encapsulant. Additional covers and conversion coatings can be added.
摘要翻译：公开了一种制造用于发光二极管（LED）的光转换结构的方法和系统。该方法包括在LED芯片上形成透明的绝热覆盖物。该方法还包括将转换材料分配到盖上以在盖上形成转换涂层，并且将LED，硅酮盖和转换涂层封装在密封剂内。可以添加额外的封面和转换涂层。

4. 发明申请

WO2013081968A1 COATED COLOR-CONVERTING PARTICLES AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS 审中-公开
标题翻译：包装颜色转换颗粒和相关设备，系统和方法
公开(公告)号：WO2013081968A1
公开(公告)日：2013-06-06
申请号：PCT/US2012/066529
申请日：2012-11-26
申请人： MICRON TECHNOLOGY, INC.
发明人： WATKINS, Charles, M.
IPC分类号： C09C3/08 , C09K11/02 , H05B33/02
CPC分类号： H01L33/502 , B29D11/00634 , H01L33/501 , Y10T428/254 , Y10T428/2998
摘要： Coated color-converting particles and associated devices, systems, and methods are disclosed herein. A coating of the coated color-converting particles can include, for example, a parylene, such as a fluorinated parylene (e.g., parylene AF-4). In particular embodiments, the coating can be configured to protect a color-converting material of a particle core of the coated color-converting particles from detrimental reactions. For example, the coating can prevent, slow, or otherwise inhibit detrimental reactions between the color-converting material and a matrix material or between the color-converting material and an environmental constituent that can diffuse through a matrix. In particular embodiments, the coated color-converting particles can be incorporated into a matrix (e.g., a generally optically transmissive matrix) to form a composite. The composite can be used, for example, with a radiation transducer. Methods associated with the coated color-converting particles can include, for example, separating coated color-converting particles having acceptable coatings from coated color-converting particles having unacceptable coatings using relative buoyancy.
摘要翻译：本文公开了涂覆的颜色转换颗粒及其相关设备，系统和方法。涂覆的颜色转换颗粒的涂层可以包括例如聚对二甲苯如氟化聚对二甲苯（例如聚对二甲苯AF-4）。在具体实施方案中，涂层可以被配置为保护涂覆的颜色转换颗粒的颗粒核心的颜色转换材料免受有害反应。例如，涂层可以防止，减慢或以其他方式抑制颜色转换材料和基质材料之间或可以通过基质扩散的颜色转换材料和环境成分之间的有害反应。在具体实施方案中，涂覆的颜色转换颗粒可以结合到基质（例如，通常为光学透射的基质）中以形成复合物。复合材料可以用于例如辐射换能器。与涂覆的颜色转换颗粒相关的方法可以包括例如使用相对浮力从具有不可接受的涂层的涂覆的颜色转换颗粒中分离具有可接受涂层的涂覆的颜色转换颗粒。

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