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    • 2. 发明申请
    • HALF DENSITY ROM EMBEDDED DRAM
    • 高密度ROM嵌入式DRAM
    • WO2003050815A1
    • 2003-06-19
    • PCT/US2002/039707
    • 2002-12-12
    • MICRON TECHNOLOGY, INC.
    • DERNER, ScottKURTH, CaseyWALD, Phillip, G.
    • G11C11/00
    • G11C11/404G11C17/12G11C2207/104
    • A half-density ROM embedded DRAM uses hard programmed non-volatile cells and unprogrammed dynamic cells. By hard programming either a first or second memory cell in a pair of cell, different data states are stored. Two word lines are used to access the memory cell pair. Because one of the cells is hard programmed, sense amplifier circuitry identifies the appropriate data state. The ROM cell can be programmed in numerous different manners. For example, ROM cells can be hard programmed by eliminating cell dielectric to short cell plates to a program voltage, or an electrical plug can be fabricated between the cell plates and shorted to a program voltage. In other embodiments, the ROM cell can be programmed using an anti-fuse programming technique, or by providing a high leakage path (not full short) such as through an active area to the substrate.
    • 半密度ROM嵌入式DRAM使用硬编程的非易失性单元和未编程的动态单元。 通过对一对单元格中的第一或第二存储单元进行硬编程,存储不同的数据状态。 两条字线用于访问存储单元对。 因为其中一个单元是硬编程的,所以读出放大器电路识别适当的数据状态。 ROM单元可以以多种不同的方式进行编程。 例如,ROM单元可以通过将单元电池的电介质消除到编程电压来进行硬编程,或者可以在单元板之间制造电插头并且短路到编程电压。 在其他实施例中,ROM单元可以使用反熔丝编程技术进行编程,或者通过向衬底提供诸如通过有源区域的高泄漏路径(非完全短路)。