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    • 7. 发明申请
    • LAMINATED COMPOSITE CHIP DEVICE
    • 层压复合芯片装置
    • WO2010024605A3
    • 2010-06-24
    • PCT/KR2009004787
    • 2009-08-27
    • AMOTECH CO LTDJOO HYUNTAEHWANG YOONHORYU JAESULIM BYUNGGUKLEE JAEWOOKJO MINSOO
    • JOO HYUNTAEHWANG YOONHORYU JAESULIM BYUNGGUKLEE JAEWOOKJO MINSOO
    • H01C7/10
    • H01C13/02H01C7/10
    • The present invention relates to a laminated composite chip device in which a common mode filter and a suppressor are implemented in a single chip to remove noise components generated by a high speed data line and to perform an EDS protection for the high speed data line at the same time. The laminated composite chip device of the present invention includes a suppressor layer having a plurality of discharge portions for gap discharge, formed on an element containing a plurality of laminated sheets, and a common mode filter layer formed in the element, and which has a plurality of common mode electrode patterns wound opposite from each other. The suppressor layer and the common mode filter layer are laminated and formed into a single chip. The laminated composite chip device of the present invention combines a common mode filter and a suppressor into a single chip to remove ripple components generated by a data line and to perform ESD protection for the high speed data line at the same time. As the common mode filter and the suppressor are implemented into a single chip, impedance matching can be performed through line width modification carried out at one time, thereby significantly simplifying work and shortening the length of the line and widening a marginal space due to the reduced number of elements.
    • 本发明涉及一种层叠复合芯片装置,其中共模滤波器和抑制器被实现在单个芯片中,以去除由高速数据线产生的噪声分量,并对高速数据线进行EDS保护 同时。 本发明的叠层复合芯片装置包括:抑制层,其具有多个用于间隙放电的放电部分,形成在包含多个层压片的元件上;以及共模滤波层,其形成在该元件中,并且具有多个 共模电极图案彼此相反地卷绕。 抑制器层和共模滤波器层被层压并形成单个芯片。 本发明的叠层复合芯片器件将共模滤波器和抑制器组合成单个芯片,以去除由数据线生成的纹波分量,并同时对高速数据线执行ESD保护。 由于共模滤波器和抑制器被实现为单个芯片,因此可以通过一次执行线宽修改来执行阻抗匹配,从而显着简化了工作并缩短了线路的长度并且由于减小了线路的长度而扩大了边缘空间 元素的数量。