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1. 发明申请

WO2002071509A1 ELECTROCHEMICAL DEVICE USING MULTICOMPONENT COMPOSITE MEMBRANE FILM 审中-公开
标题翻译：使用多组分复合薄膜的电化学装置
公开(公告)号：WO2002071509A1
公开(公告)日：2002-09-12
申请号：PCT/KR2002/000377
申请日：2002-03-05
申请人： LG CHEM, LTD. , LEE, Seung-Jin , LEE, Hyang-Mok , AHN, Soon-Ho , CHO, Jin-Yeon , YONG, Hyun-Hang , LEE, Hyung-Keun , LEE, Sang-Young , SONG, Heon-Sik , AHN, Byeong-In , PARK, Soon-Yong , KYUNG, You-Jin
发明人： LEE, Seung-Jin , LEE, Hyang-Mok , AHN, Soon-Ho , CHO, Jin-Yeon , YONG, Hyun-Hang , LEE, Hyung-Keun , LEE, Sang-Young , SONG, Heon-Sik , AHN, Byeong-In , PARK, Soon-Yong , KYUNG, You-Jin
IPC分类号： H01M2/14
CPC分类号： H01M2/1653 , B01D67/0013 , B01D67/0027 , B01D67/0083 , B01D67/009 , B01D69/12 , B01D2325/04 , B01D2325/26 , H01M2/14 , H01M10/0525 , H01M10/0565 , H01M10/0585
摘要： The present invention provides a electrochemical element, wherein a multi-component composite film comprising a) polymer support layer film and b) a porous gellable polymer layer which is formed on either or both sides of the support layer film of a), wherein the support layer film of a) and the gellable polymer layer of b) are unified with each other without an interface between them.
摘要翻译：本发明提供一种电化学元件，其中多组分复合膜包括a）聚合物支撑层膜和b）形成在a）的载体层膜的一侧或两侧上的多孔可凝胶聚合物层，其中载体 a）的层状膜和b）的可胶化聚合物层彼此统一而没有它们之间的界面。

2. 发明申请

WO2003027178A2 POLYIMIDE COPOLYMER AND METHODS FOR PREPARING THE SAME 审中-公开
标题翻译：聚酰亚胺共聚物及其制备方法
公开(公告)号：WO2003027178A2
公开(公告)日：2003-04-03
申请号：PCT/KR2002/001828
申请日：2002-09-27
申请人： LG CHEM LTD. , AHN, Byeong-In , KYUNG, You-Jin , KO, Joo-Eun , SONG, Heon-Sik
发明人： AHN, Byeong-In , KYUNG, You-Jin , KO, Joo-Eun , SONG, Heon-Sik
IPC分类号： C08L
CPC分类号： C08G73/1053 , C08G73/1042 , C08G73/1046 , C08G73/1064 , C09J179/08
摘要： The present invention relates to a polyimide copolymer used in a precursor of heat resistant adhesive and methods for preparing the same, and more particularly, to a polyamic acid copolymer and methods for preparing the same obtained by controlling a polymerization degree of the tetracarboxylic acid dianhydride and aromatic diamine. The present invention also comprises a polyimide copolymer obtained by curing the polyamic acid copolymer, and methods for preparing the same. The present invention also provides a heat resistant adhesive composition comprising the polyamic acid copolymer and the polyimide copolymer, and a semiconductor device using the same. The polyamic acid copolymer used in a precursor and polyimide copolymer obtained therefrom of the present invention has superior adhesion strength and simultaneously satisfies physical properties like high heat resistance and low water absorption rate, etc. and thus it can be effectively adhered parts of semiconductor devices, etc.
摘要翻译：本发明涉及用于耐热粘合剂前体的聚酰亚胺共聚物及其制备方法，更具体地说，涉及一种聚酰胺酸共聚物及其制备方法，该方法是通过控制四羧酸二酐的聚合度和芳香二胺。本发明还包括通过固化聚酰胺酸共聚物获得的聚酰亚胺共聚物及其制备方法。本发明还提供了包含聚酰胺酸共聚物和聚酰亚胺共聚物的耐热性粘合剂组合物，以及使用其的半导体装置。由本发明得到的前体和聚酰亚胺共聚物中使用的聚酰胺酸共聚物具有优异的粘合强度，同时满足高耐热性和低吸水率等的物理性能，因此可以有效地粘附半导体器件，等等

3. 发明申请

WO2003027178A3 POLYIMIDE COPOLYMER AND METHODS FOR PREPARING THE SAME 审中-公开
公开(公告)号：WO2003027178A3
公开(公告)日：2003-04-03
申请号：PCT/KR2002/001828
申请日：2002-09-27
申请人： LG CHEM LTD. , AHN, Byeong-In , KYUNG, You-Jin , KO, Joo-Eun , SONG, Heon-Sik
发明人： AHN, Byeong-In , KYUNG, You-Jin , KO, Joo-Eun , SONG, Heon-Sik
IPC分类号： C08G69/12
摘要： The present invention relates to a polyimide copolymer used in a precursor of heat resistant adhesive and methods for preparing the same, and more particularly, to a polyamic acid copolymer and methods for preparing the same obtained by controlling a polymerization degree of the tetracarboxylic acid dianhydride and aromatic diamine. The present invention also comprises a polyimide copolymer obtained by curing the polyamic acid copolymer, and methods for preparing the same. The present invention also provides a heat resistant adhesive composition comprising the polyamic acid copolymer and the polyimide copolymer, and a semiconductor device using the same. The polyamic acid copolymer used in a precursor and polyimide copolymer obtained therefrom of the present invention has superior adhesion strength and simultaneously satisfies physical properties like high heat resistance and low water absorption rate, etc. and thus it can be effectively adhered parts of semiconductor devices, etc.

4. 发明申请

WO2009025498A2 ALKALI DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM MANUFACTURED BY THE SAME 审中-公开
标题翻译：碱性显影光敏树脂组合物和由其制造的干膜
公开(公告)号：WO2009025498A2
公开(公告)日：2009-02-26
申请号：PCT/KR2008/004850
申请日：2008-08-20
申请人： LG CHEM, LTD. , LEE, Kwang-Joo , SONG, Heon-Sik , KYUNG, You-Jin , KO, Joo-Eun , YOON, Jung-Il , SHIM, Jung-Jin
发明人： LEE, Kwang-Joo , SONG, Heon-Sik , KYUNG, You-Jin , KO, Joo-Eun , YOON, Jung-Il , SHIM, Jung-Jin
IPC分类号： G03F7/004
CPC分类号： G03F7/037 , G03F7/027 , H05K3/287 , H05K3/4676
摘要： The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate-based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus-based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.
摘要翻译：本发明涉及能够用碱性水溶液显影的聚酰亚胺光敏树脂组合物，以及由其制备的干膜，并且更具体地涉及光敏树脂组合物，包含a）聚酰胺酸，b）两个或更多个在碳之间包含一个或多个双键的基于（甲基）丙烯酸酯的化合物，c）光聚合引发剂，d）磷基阻燃剂，和e）有机溶剂，以及由其制造的干膜。

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