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    • 6. 发明申请
    • EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR PREPARING SAME, COMPOSITION AND CURED MATERIAL COMPRISING SAME, AND USAGE THEREOF
    • 具有烷氧基的环氧化合物,其制备方法,包含其的组合物和固化材料及其用途
    • WO2013028045A3
    • 2013-05-10
    • PCT/KR2012006832
    • 2012-08-27
    • KOREA IND TECH INSTCHUN HYUN-AEETAK SANG-YONGPARK SU-JINKIM YUN-JUPARK SUNG-HWAN
    • CHUN HYUN-AEETAK SANG-YONGPARK SU-JINKIM YUN-JUPARK SUNG-HWAN
    • C07D407/12C07D303/12C07F7/08C08L63/02
    • C08G59/306C07D303/12C07D407/12C07F7/1804C07F7/1836C07F7/1876C08J5/24C08J2363/00C08K3/36C08K7/14C08L63/00
    • The present invention relates to an epoxy compound having an alkoxysilyl group, a method for preparing same, a composition and cured material comprising same, and usage thereof. A composite comprising the epoxy compound exhibits superior heat-resistant characteristics, or more specifically, the composite has a low coefficient of thermal expansion (CFE) and a high glass transition temperature or is Tg-less, and/or a cured material comprising the epoxy compound exhibits flame retardant properties and obviates the need for a separate silane coupling agent. The present invention provides: an epoxy compound having an alkoxysilyl group having, in a core, at least one substituent group of the chemical formula S1, and at least two epoxy groups; a method for preparing the epoxy compound by means of allylation of a starting material, Claisen rearrangement, glycidylation, and alkoxysilylation; an epoxy composition comprising the epoxy compound; and cured material of the compound and usage thereof. The novel composite of a composition comprising the epoxy compound having an alkoxysilyl group enhances chemical bonding, within the epoxy compound, of the alkoxysilyl group and filler, and additionally enhances the chemical bonding efficiency during the formation of the epoxy composite, which is due to the chemical bonding between the alkoxysilyl groups of the epoxy compound having an alkoxysilyl group. Accordingly, the composite exhibits superior heat-resistant characteristics, that is, the composite has a low CTE and a high glass transition temperature or is Tg-less. Additionally, the cured material resulting from the composition comprising the epoxy composition exhibits superior flame-retardant characteristics.
    • 本发明涉及具有烷氧基甲硅烷基的环氧化合物,其制备方法,组合物和包含该组合物的固化材料及其用途。 包含环氧化合物的复合材料表现出优异的耐热特性,或者更具体地说,该复合材料具有低的热膨胀系数(CFE)和高的玻璃化转变温度或不低于Tg,和/或包含环氧树脂的固化材料 化合物具有阻燃性能,并且不需要单独的硅烷偶联剂。 本发明提供:具有烷氧基甲硅烷基的环氧化合物,其具有在核心中至少一个具有化学式S1的取代基和至少两个环氧基的烷氧基甲硅烷基; 通过起始原料的烯丙基化,Claisen重排,缩水甘油基化和烷氧基硅烷化制备环氧化合物的方法; 包含环氧化合物的环氧组合物; 化合物的固化物及其用途。 包含具有烷氧基甲硅烷基的环氧化合物的组合物的新型复合物增强了环氧化合物内的烷氧基甲硅烷基和填料的化学键合,并且还增加了形成环氧复合材料期间的化学键合效率,这是由于 具有烷氧基甲硅烷基的环氧化合物的烷氧基甲硅烷基之间的化学键合。 因此,复合材料具有优异的耐热特性,即复合材料具有低的CTE和高的玻璃化转变温度,或者不含Tg。 此外,由包含环氧组合物的组合物得到的固化材料表现出优异的阻燃特性。