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    • 2. 发明申请
    • HUMIDITY SENSOR OF CAPACITANCE TYPE AND METHOD OF FABRICATING SAME
    • 电容式湿度传感器及其制造方法
    • WO2010056049A3
    • 2010-08-26
    • PCT/KR2009006654
    • 2009-11-12
    • KOREA ELECTRONICS TECHNOLOGYHONG SUNG MINKIM KUN NYUNJO YOUNG CHANGKIM WON HYO
    • HONG SUNG MINKIM KUN NYUNJO YOUNG CHANGKIM WON HYO
    • G01N27/22G01N27/00G01N27/26
    • G01N27/223
    • The present invention relates to a humidity sensor of capacitance type, and more specifically to a humidity sensor of capacitance type and a method of manufacturing same that enable not only the fabrication of a compact humidity sensor by forming a sensor part on top of an ROIC substrate, but also the enhancement of the reliability of the sensor by forming a humidity sensing layer with a polymeric material of a large surface area between a lower electrode layer and an upper electrode layer. The humidity sensor of capacitance type of the present invention comprises: an ROIC substrate that includes an electrode pad; a metallic layer that is formed on top of said ROIC substrate and patterned to expose a part of said electrode pad; an insulation layer that is formed on top of said metallic layer and patterned to expose a part of said electrode pad; a lower electrode layer that is formed on top of said insulation layer; a humidity sensing layer that is etched and formed on top of said lower electrode layer to expand the surface area; an upper electrode layer that is formed on top of said moisture sensing layer; and a connection layer that is formed on top of said exposed electrode pad to bring each of said lower electrode layer and upper electrode layer into contact with said electrode pad.
    • 电容式湿度传感器技术领域本发明涉及一种电容式湿度传感器,更具体地说,涉及一种电容型湿度传感器及其制造方法,不仅能够通过在ROIC基板的顶部形成传感器部件来制造小型湿度传感器 而且还通过在下电极层和上电极层之间形成具有大表面积的聚合材料的湿度感测层来提高传感器的可靠性。 本发明的电容式湿度传感器包括:ROIC衬底,其包括电极焊盘; 金属层,其形成在所述RO​​IC基板的顶部上并被图案化以暴露所述电极焊盘的一部分; 绝缘层,其形成在所述金属层的顶部并被图案化以暴露所述电极焊盘的一部分; 形成在所述绝缘层的顶部的下电极层; 湿度感测层,其被蚀刻并形成在所述下电极层的顶部上以使表面积膨胀; 上部电极层,其形成在所述湿度感测层的顶部; 以及形成在所述暴露的电极焊盘的顶部上以使所述下电极层和上电极层中的每一个与所述电极焊盘接触的连接层。
    • 3. 发明申请
    • HUMIDITY SENSOR OF CAPACITANCE TYPE AND METHOD OF FABRICATING SAME
    • 电容式湿度传感器及其制造方法
    • WO2010056049A2
    • 2010-05-20
    • PCT/KR2009006654
    • 2009-11-12
    • KOREA ELECTRONICS TECHNOLOGYHONG SUNG MINKIM KUN NYUNJO YOUNG CHANGKIM WON HYO
    • HONG SUNG MINKIM KUN NYUNJO YOUNG CHANGKIM WON HYO
    • G01N27/22G01N27/00G01N27/26
    • G01N27/223
    • The present invention relates to a humidity sensor of capacitance type, and more specifically to a humidity sensor of capacitance type and a method of manufacturing same that enable not only the fabrication of a compact humidity sensor by forming a sensor part on top of an ROIC substrate, but also the enhancement of the reliability of the sensor by forming a humidity sensing layer with a polymeric material of a large surface area between a lower electrode layer and an upper electrode layer. The humidity sensor of capacitance type of the present invention comprises: an ROIC substrate that includes an electrode pad; a metallic layer that is formed on top of said ROIC substrate and patterned to expose a part of said electrode pad; an insulation layer that is formed on top of said metallic layer and patterned to expose a part of said electrode pad; a lower electrode layer that is formed on top of said insulation layer; a humidity sensing layer that is etched and formed on top of said lower electrode layer to expand the surface area; an upper electrode layer that is formed on top of said moisture sensing layer; and a connection layer that is formed on top of said exposed electrode pad to bring each of said lower electrode layer and upper electrode layer into contact with said electrode pad.
    • 电容型湿度传感器及其制造方法技术领域本发明涉及一种电容型湿度传感器,更具体地涉及一种电容型湿度传感器及其制造方法,其不仅能够通过在ROIC基底上形成传感器部件来制造小型湿度传感器 而且还通过在下电极层和上电极层之间用大表面积的聚合物材料形成湿敏层来提高传感器的可靠性。 本发明的电容型湿度传感器包括:ROIC基板,其包括电极焊盘; 金属层,形成在所述RO​​IC衬底的顶部上并被图案化以暴露所述电极焊盘的一部分; 绝缘层,形成在所述金属层的顶部并且被图案化以暴露所述电极焊盘的一部分; 形成在所述绝缘层的顶部上的下电极层; 湿敏层,在所述下电极层的顶部上被蚀刻并形成以扩大表面积; 形成在所述湿度感测层上的上电极层; 以及连接层,形成在所述暴露的电极焊盘的顶部上,以使每个所述下电极层和上电极层与所述电极焊盘接触。