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    • 2. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • WO2003046967A2
    • 2003-06-05
    • PCT/IB2002/004881
    • 2002-11-20
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.STOLK, Peter, A.
    • STOLK, Peter, A.
    • H01L21/268
    • H01L29/66575H01L21/26513H01L21/2652H01L21/268H01L21/324
    • In the method of manufacturing a semiconductor device (1) with a semiconductor body (2), a doped zone (3) is formed in the semiconductor body (2). The semiconductor body (2) has a crystalline surface region (4), which crystalline surface region (4) is at least partly amorphized so as to form an amorphous surface layer (5). The amorphization is achieved by irradiating the surface (6) with a radiation pulse (7) which is absorbed by the crystalline surface region (4). The radiation pulse (7) has a wavelength which is chosen such that the radiation is absorbed by the crystalline surface region (4), and the energy flux of the radiation pulse (7) is chosen such that the crystalline surface layer (5) is melted. The method is useful for making ultra-shallow junctions.
    • 在制造具有半导体本体(2)的半导体器件(1)的方法中,在半导体本体(2)中形成掺杂区(3)。 半导体本体(2)具有晶体表面区域(4),该晶体表面区域(4)至少部分非晶化,以形成非晶表面层(5)。 非晶化是通过用由结晶表面区域(4)吸收的辐射脉冲(7)照射表面(6)来实现的。 辐射脉冲(7)具有选择为使得辐射被结晶表面区域(4)吸收的波长,并且选择辐射脉冲(7)的能量通量使得晶体表面层(5)为 融化了。 该方法可用于制造超浅结。