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    • 4. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD
    • 制造半导体器件的方法和采用这种方法获得的半导体器件
    • WO2007057803A1
    • 2007-05-24
    • PCT/IB2006/053996
    • 2006-10-29
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MELAI, JoostHIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • MELAI, JoostHIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • H01L21/331
    • H01L29/66242H01L29/66287
    • The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one bipolar transistor having an emitter region (1), a base region (2) and a collector region (3), wherein in the semiconductor body (12) a first semiconductor region (13) is formed that forms one (3) of the collector and emitter regions (1,3) and on the surface of the semiconductor body (12) a stack of layers is formed comprising a first insulating layer (4), a polycrystalline semiconductor layer (5) and a second insulating layer (6) in which stack an opening (7) is formed, after which by non-selective epitaxial growth a further semiconductor layer (22) is deposited of which a monocrystalline horizontal part on the bottom of the opening (7) forms the base region (2) and of which a polycrystalline vertical part (2A) on a side face of the opening (7) is connected to the polycrystalline semiconductor layer (5), after which spacers (S) are formed parallel to the side face of the opening (7) and a second semiconductor region (31) is formed between said spacers (S) forming the other one (1) of the emitter and collector regions (1,3). According to the invention the above method is characterized in that before the further semiconductor layer (22) is deposited, the second insulating layer (6) is provided with an end portion (6A) that viewed in projection overhangs an end portion (5A) of the underlying semiconductor layer (5). In this way bipolar transistor devices can be obtained with good high frequency properties in a cost effective manner.
    • 本发明涉及一种制造半导体器件(10)的方法,所述半导体器件(10)具有衬底(11)和半导体本体(12),所述半导体器件(12)具有至少一个具有发射极区域(1),基极区域(2), 和集电极区域(3),其中在所述半导体本体(12)中形成第一半导体区域(13),所述第一半导体区域形成所述集电极和发射极区域(1,3)中的一个(3)并且在所述半导体主体 (12)形成一叠层,其包括形成有开口(7)的第一绝缘层(4),多晶半导体层(5)和第二绝缘层(6),之后通过非选择性 外延生长沉积另外的半导体层(22),其中开口(7)的底部上的单晶水平部分形成基部区域(2),并且在该开口的侧面上具有多晶垂直部分(2A) (7)连接到多晶半导体层(5),之后是间隔 (S)形成为平行于开口(7)的侧面,并且在形成发射极和集电极区域(1,3)的另一个(1)的所述间隔物(S)之间形成第二半导体区域(31) )。 根据本发明,上述方法的特征在于,在沉积另外的半导体层(22)之前,第二绝缘层(6)设置有端部(6A),该端部在突出部分中突出伸出端部(5A) 底层半导体层(5)。 以这种方式,可以以成本有效的方式获得具有良好高频特性的双极晶体管器件。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH A DEVICE
    • 半导体器件及其制造方法
    • WO2007088494A1
    • 2007-08-09
    • PCT/IB2007/050210
    • 2007-01-22
    • NXP B.V.DONKERS, Johannes, J., T., M.MEUNIER-BEILLARD, PhilippeHIJZEN, Erwin
    • DONKERS, Johannes, J., T., M.MEUNIER-BEILLARD, PhilippeHIJZEN, Erwin
    • H01L21/336H01L21/8249
    • H01L29/66628H01L21/8249H01L27/0623H01L29/6653H01L29/6656
    • The invention relates to a semiconductor device (10) with a substrate (12) and a semiconductor body (11) of silicon that is provided at one location (A) with a field effect or bipolar transistor (Tl) with a semiconductor region which forms part of the transistor (Tl) and which comprises a source or drain region of the field effect transistor or a base region of the bipolar transistor and which is adjacent to the surface of the semiconductor body (11), which semiconductor region is provided with an epitaxially thickened region. According to the invention the surface of the semiconductor body (11) is provided with another epitaxially thickened region (1) at a location (B) other than the location where the transistor is present, and said other epitaxially thickened region is provided with at least one pn-junction (2,3). If the device is provided with two pn-junctions (2,3) it allows advantageously the integration of a bipolar transistor (T2) into a device with a MOSFET (Tl). The pn-junctions in the epitaxially thickened region of the latter can be removed without difficulty, e.g. by overdoping. The invention also relates to a method of manufacturing such a device (10).
    • 本发明涉及一种半导体器件(10),其具有衬底(12)和硅的半导体本体(11),所述半导体本体(11)设置在具有场效应的一个位置(A)或具有形成半导体区域的半导体区域(Tl) 晶体管(T1)的一部分,并且其包括场效应晶体管的源极或漏极区域或双极晶体管的基极区域,并且与半导体本体(11)的表面相邻,该半导体区域设置有 外延增厚区域。 根据本发明,半导体本体(11)的表面在除了存在晶体管的位置之外的位置(B)处设置有另外的外延加厚区域(1),并且所述其它外延加厚区域至少设置有 一个pn结(2,3)。 如果该器件具有两个pn结(2,3),则有利地将双极晶体管(T2)集成到具有MOSFET(T1)的器件中。 后者的外延增稠区域中的pn结可以毫无困难地被去除,例如, 通过过度使用 本发明还涉及制造这种装置(10)的方法。
    • 9. 发明申请
    • METHOD OF MANUFACTURING A BIPOLAR TRANSISTOR AND BIPOLAR TRANSITOR OBTAINED THEREWITH
    • 制造双极晶体管的方法和获得的双极晶体管
    • WO2008001249A1
    • 2008-01-03
    • PCT/IB2007/052226
    • 2007-06-12
    • NXP B.V.HIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • HIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • H01L21/331
    • H01L29/66287H01L29/66242
    • The invention relates to a method of manufacturing a semiconductor device (10) comprising a substrate (12) and a silicon semiconductor body (11) and comprising a bipolar transistor with an emitter region (1) of a first conductivity type, a base region (2) of a second conductivity type opposite to the first conductivity type, and a collector region (3) of the first conductivity type, on the surface of the semiconductor body (11) in which the collector region (3) is formed at least an epitaxial semiconductor layer (20,21,22) being deposited in which the base region (2) is formed, on top of this an etch stop layer (15) being deposited on which a silicon low-crystalline semiconductor layer (24) is deposited in which a connection zone of the base region (2) is formed and in which at the location of an emitter region (1) to be formed an opening (7) is provided running up to the etch stop layer (15), a portion of the etch stop layer (15) covering the opening (7) being removed by means of etching and also an adjoining portion of the etch stop layer (15), a hollow being created underneath the silicon low-crystalline semiconductor layer (24) adjoining and connected the opening (7), whereinafter a high-crystalline semiconductor layer (5) is formed within the hollow. In a method according to the invention the formation of the high-crystalline semiconductor layer (5) is carried out in such a way that a part of the surface of the semiconductor body (11) adjoining the opening (7) is kept free from the high-crystalline semiconductor layer (5). In this way a high-quality device (10) is obtained in easy manner. The relevant surface is kept free using a cover layer (6) or in a preferred manner even without the use of such a layer.
    • 本发明涉及一种制造半导体器件(10)的方法,该半导体器件(10)包括衬底(12)和硅半导体本体(11),并且包括具有第一导电类型的发射极区域(1),基极区域 2)与第一导电类型相反的第二导电类型和第一导电类型的集电极区域(3),其中集电区域(3)至少形成在半导体本体(11)的表面上, 外延半导体层(20,21,22)被沉积在其中形成有基极区域(2)的上方,沉积有沉积有硅低温半导体层(24)的蚀刻停止层(15) 在其中形成基部区域(2)的连接区域,并且其中在要形成开口(7)的发射极区域(1)的位置处设置有延伸到蚀刻停止层(15)的部分 通过蚀刻去除覆盖开口(7)的蚀刻停止层(15) 以及蚀刻停止层(15)的相邻部分,在邻接和连接开口(7)的硅低温半导体层(24)下方形成中空,其后,高结晶半导体层(5)为 形成在空心中。 在根据本发明的方法中,高结晶半导体层(5)的形成是这样一种方式进行的:半导体本体(11)的与开口(7)相邻的表面的一部分保持与 高结晶半导体层(5)。 以这种方式,以容易的方式获得了高质量的装置(10)。 使用覆盖层(6)或以优选的方式即使不使用这种层也可以使相关表面保持自由。