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    • 2. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD
    • 制造半导体器件的方法和采用这种方法获得的半导体器件
    • WO2007057803A1
    • 2007-05-24
    • PCT/IB2006/053996
    • 2006-10-29
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MELAI, JoostHIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • MELAI, JoostHIJZEN, ErwinMEUNIER-BEILLARD, PhilippeDONKERS, Johannes, J., T., M.
    • H01L21/331
    • H01L29/66242H01L29/66287
    • The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one bipolar transistor having an emitter region (1), a base region (2) and a collector region (3), wherein in the semiconductor body (12) a first semiconductor region (13) is formed that forms one (3) of the collector and emitter regions (1,3) and on the surface of the semiconductor body (12) a stack of layers is formed comprising a first insulating layer (4), a polycrystalline semiconductor layer (5) and a second insulating layer (6) in which stack an opening (7) is formed, after which by non-selective epitaxial growth a further semiconductor layer (22) is deposited of which a monocrystalline horizontal part on the bottom of the opening (7) forms the base region (2) and of which a polycrystalline vertical part (2A) on a side face of the opening (7) is connected to the polycrystalline semiconductor layer (5), after which spacers (S) are formed parallel to the side face of the opening (7) and a second semiconductor region (31) is formed between said spacers (S) forming the other one (1) of the emitter and collector regions (1,3). According to the invention the above method is characterized in that before the further semiconductor layer (22) is deposited, the second insulating layer (6) is provided with an end portion (6A) that viewed in projection overhangs an end portion (5A) of the underlying semiconductor layer (5). In this way bipolar transistor devices can be obtained with good high frequency properties in a cost effective manner.
    • 本发明涉及一种制造半导体器件(10)的方法,所述半导体器件(10)具有衬底(11)和半导体本体(12),所述半导体器件(12)具有至少一个具有发射极区域(1),基极区域(2), 和集电极区域(3),其中在所述半导体本体(12)中形成第一半导体区域(13),所述第一半导体区域形成所述集电极和发射极区域(1,3)中的一个(3)并且在所述半导体主体 (12)形成一叠层,其包括形成有开口(7)的第一绝缘层(4),多晶半导体层(5)和第二绝缘层(6),之后通过非选择性 外延生长沉积另外的半导体层(22),其中开口(7)的底部上的单晶水平部分形成基部区域(2),并且在该开口的侧面上具有多晶垂直部分(2A) (7)连接到多晶半导体层(5),之后是间隔 (S)形成为平行于开口(7)的侧面,并且在形成发射极和集电极区域(1,3)的另一个(1)的所述间隔物(S)之间形成第二半导体区域(31) )。 根据本发明,上述方法的特征在于,在沉积另外的半导体层(22)之前,第二绝缘层(6)设置有端部(6A),该端部在突出部分中突出伸出端部(5A) 底层半导体层(5)。 以这种方式,可以以成本有效的方式获得具有良好高频特性的双极晶体管器件。
    • 5. 发明申请
    • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH A BIPOLAR TRANSISTOR AND DEVICE WITH A BIPOLAR TRANSISTOR
    • 用双极晶体管制造半导体器件的方法和具有双极晶体管的器件
    • WO2005013350A1
    • 2005-02-10
    • PCT/IB2004/051292
    • 2004-07-26
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.NEUILLY, Francois, I.DONKERS, Johannes, J., T., M.AKSEN, EyupMELAI, JoostFURUKAWA, Yukiko
    • NEUILLY, Francois, I.DONKERS, Johannes, J., T., M.AKSEN, EyupMELAI, JoostFURUKAWA, Yukiko
    • H01L21/331
    • H01L29/66287H01L29/41708H01L29/66242
    • The invention relates to the manufacturing of a bipolar transistor device (10) in which the emitter is formed using a polycrystalline silicon region (14) which is prevent in a window in an insulating layer (13) and which extends laterally over said insulating layer (13). The silicon region (14) as well as another silicon region (12) bordering the stack of insulating region (13) and silicon region (14) are silicided by means of a metal layer (16) deposited over the structure. The sideface of the stack is provided with means to avoid bridging of the silicides (17) to be formed. According to the invention the means to prevent bridging of the silicides to be formed comprises that the side face of the stack is structured in such a way that the distance between the upper surface of the silicon region (14) and the upper surface the other silicon region (12) along the surface of the side face of the stack is made longer than the total thickness of the insulating layer (13) and the semiconductor layer (14). Through the increased path by either a positive or negative slope of the side face of the stack, the bridging of silicides is avoided. Preferred embodiments relate to how the side face of the stack is structured.
    • 本发明涉及双极晶体管器件(10)的制造,其中使用在绝缘层(13)的窗口中防止并且在所述绝缘层上横向延伸的多晶硅区域(14)形成发射极 13)。 通过沉积在结构上的金属层(16)将硅区域(14)以及与绝缘区域(13)和硅区域(14)接合的另一个硅区域(12)被硅化。 堆叠的侧面设置有避免要形成的硅化物(17)的桥接的装置。 根据本发明,防止要形成的硅化物的桥接的手段包括:堆叠的侧面以如下方式构成:硅区域(14)的上表面与上表面之间的距离与另一硅 使得沿着堆叠侧面的表面的区域(12)比绝缘层(13)和半导体层(14)的总厚度长。 通过堆叠侧面的正或负斜率的增加的路径,避免了硅化物的桥接。 优选实施例涉及如何构造堆叠的侧面。
    • 6. 发明申请
    • BIPOLAR TRANSISTOR AND METHOD OF FABRICATING THE SAME
    • 双极晶体管及其制造方法
    • WO2006114746A2
    • 2006-11-02
    • PCT/IB2006/051248
    • 2006-04-21
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.MELAI, JoostMADAKASIRA, Vijayaraghavan
    • MELAI, JoostMADAKASIRA, Vijayaraghavan
    • H01L29/7378H01L27/0623H01L29/0821H01L29/66242
    • The invention provides a bipolar transistor with an improved performance because of a reduced collector series resistance and a reduced collector to substrate capacitance. The bipolar transistor includes a protrusion (5) which size may be reduced to a dimension that cannot be achieved with lithographic techniques. The protrusion (5) comprises a collector region (21) and a base region (22), in which the collector region (21) covers and electrically connects to a first portion of a first collector connecting region (3). A second collector connecting region (13) covers a second portion of the first collector connecting region (3) and is separated from the protrusion (5) by an insulation layer (10, 11), which covers the sidewalls of the protrusion (5). A contact to the base region (22) is provided by a base connecting region (15), which adjoins the protrusion (5) and which is separated from the second collector connecting region (13) by an insulation layer (14). A collector contact (31) and a base contact (32) are formed simultaneously on an exposed portion of the second collector connecting region (13) and on a portion of the base connecting region (15) that has not been removed.
    • 本发明提供一种具有改进性能的双极晶体管,因为集电极串联电阻降低,集电极与基板电容降低。 双极晶体管包括突起(5),其尺寸可以减小到用光刻技术无法实现的尺寸。 突起(5)包括收集器区域(21)和基极区域(22),集电区域(21)覆盖并电连接到第一集电器连接区域(3)的第一部分。 第二集电器连接区域(13)覆盖第一集电器连接区域(3)的第二部分,并且通过覆盖突起(5)的侧壁的绝缘层(10,11)与突起(5)分离, 。 与基部区域(22)的接触由邻接突起(5)的基部连接区域(15)提供,并且通过绝缘层(14)与第二集电器连接区域(13)分离。 同时在第二集电器连接区域(13)的露出部分和未被去除的基座连接区域(15)的一部分上同时形成集电极触点(31)和基部触点(32)。
    • 8. 发明申请
    • BIPOLAR TRANSISTOR AND METHOD OF MANUFACTURING SAME
    • 双极晶体管及其制造方法
    • WO2003015177A1
    • 2003-02-20
    • PCT/IB2002/002680
    • 2002-06-27
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.
    • HUIZING, Hendrik, G., A.SLOTBOOM, Jan, W.LYUBOSHENKO, IgorKLOOTWIJK, Johan, H.VAN RIJS, FreerkMELAI, Joost
    • H01L29/737
    • H01L29/7378H01L29/0821H01L29/7371
    • The bipolar transistor comprises a collector region (1) of a semiconductor material with a first doping type, an emitter region (2) with a first doping type, and a base region (3) of a semiconductor material with a second doping type, opposite to the first doping type, which base region is arranged between the emitter region (2) and the collector region (1), and a semiconductor area (4) extending between the collector region (1) and the base region (3). The collector region (1) is doped such that the semiconductor area (4) is fully depleted and the magnitude of the intrinsic electric field in the semiconductor area (4) is at least substantially independent of the applied doping types and the doping concentration in the semiconductor area (4). The method of manufacturing the bipolar transistor comprises the step of epitaxially growing a semiconductor layer (6) over a collector region (1) and doping the epitaxial layer (6) in situ, after which the base region (3) is deposited epitaxially. The comparatively thin semiconductor area (4) between the base region (3) and the collector region (1) allows ultrafast bipolar transistors with a high cutoff frequency and an improved breakdown voltage to be manufactured. The product of the cutoff frequency and the collector-emitter breakdown voltage of these bipolar transistors exceeds the Johnson limit.
    • 双极晶体管包括具有第一掺杂类型的半导体材料的集电极区域(1),具有第一掺杂类型的发射极区域(2)和具有第二掺杂类型的半导体材料的基极区域(3) 到第一掺杂类型,该基极区域布置在发射极区域(2)和集电极区域(1)之间,以及在集电极区域(1)和基极区域(3)之间延伸的半导体区域(4)。 掺杂集电极区域(1)使得半导体区域(4)完全耗尽并且半导体区域(4)中的本征电场的大小至少基本上与施加的掺杂类型和掺杂浓度 半导体区域(4)。 制造双极晶体管的方法包括在集电极区域(1)上外延生长半导体层(6)并原位掺杂外延层(6)的步骤,然后外延地沉积基极区域(3)。 在基极区域(3)和集电极区域(1)之间的较薄的半导体区域(4)允许制造具有高截止频率和改善的击穿电压的超快双极型晶体管。 这些双极晶体管的截止频率和集电极 - 发射极击穿电压的乘积超过约翰逊限制。