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1. 发明申请

WO2008070722A2 METHODS AND SYSTEMS FOR IDENTIFYING DEFECT TYPES ON A WAFER 审中-公开
标题翻译：用于识别晶片上缺陷类型的方法和系统
公开(公告)号：WO2008070722A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/086508
申请日：2007-12-05
申请人： KLA-TENCOR CORPORATION , SAITO, Jason , SHEN, Wei-Ning
发明人： SAITO, Jason , SHEN, Wei-Ning
IPC分类号： G01N21/88
CPC分类号： G01N21/9501
摘要： Various methods and systems for identifying defect types on a wafer are provided. One computer-implemented method for identifying defect types on a wafer includes acquiring output of an inspection system for defects detected on a wafer. The output is acquired by different combinations of illumination and collection channels of the inspection system. The method also includes identifying defect types of the defects based on the output acquired by a set of the different combinations. The set of the different combinations is selected based on the defect types to be identified on the wafer and a wafer type of the wafer such that a different set of the different combinations of the illumination and collection channels is used for identifying different defect types on different wafer types.
摘要翻译：提供了用于识别晶片上的缺陷类型的各种方法和系统。一种用于识别晶片上的缺陷类型的计算机实现的方法包括获取检测系统对晶片上检测到的缺陷的输出。输出通过检测系统的照明和采集通道的不同组合获得。该方法还包括基于由一组不同组合获得的输出来识别缺陷的缺陷类型。基于要在晶片上识别的缺陷类型和晶片类型的晶片来选择这组不同的组合，使得不同组合的照明和收集通道用于识别不同的不同类型的不同的缺陷类型晶圆类型。

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