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2. 发明申请

WO2010143175A1 AN OPTICAL DEVICE MODULE AND PRODUCTION METHOD 审中-公开
标题翻译：光学器件模块和生产方法
公开(公告)号：WO2010143175A1
公开(公告)日：2010-12-16
申请号：PCT/IE2010/000038
申请日：2010-06-11
申请人： FIRECOMMS LIMITED , LAMBKIN, John, D. , BARROW, David , HUNG, Vincent , DOYLE, Patrick
发明人： LAMBKIN, John, D. , BARROW, David , HUNG, Vincent , DOYLE, Patrick
IPC分类号： G02B6/42
CPC分类号： G02B6/4204 , G02B6/423 , G02B6/4292
摘要： An optical device module has leads (1) arranged for connection of the module to an external circuit. A substrate (2) is patterned with electrical tracks on at least opposed surfaces and is secured to the leads (2). A signal processing integrated circuit (3) with an optical device driver or amplifier function is on the substrate (2) and is electrically connected to at least some of the substrate tracks. There is a moulding (7) around the substrate (2) leaving at least one opening (8) exposing part of the substrate (2), the moulding fully encapsulating the integrated circuit (3). An optical device (9) is mounted on the substrate (2) within the moulding opening (8). An optical coupler (11) is mounted in the moulding opening (8) and is in alignment with the optical device (9). In another embodiment, the substrate (201) has an opening (206) which is accessible via the moulding opening (228) and the optical device (202) is mounted on a side of the substrate (201) opposed to the moulding opening, and there is a light path between the coupler and the optical device via said opening. The substrate (201) may include alignment features (212) engaging mating alignment features (213) of the optical coupler.
摘要翻译：光学器件模块具有布置成将模块连接到外部电路的引线（1）。基板（2）在至少相对的表面上被电气迹线图案化并且被固定到引线（2）。具有光学器件驱动器或放大器功能的信号处理集成电路（3）在基板（2）上并且电连接到至少一些基板轨道。在基板（2）周围有一个模制件（7），留下暴露基板（2）的一部分的至少一个开口（8），模制件完全封装集成电路（3）。光学装置（9）安装在模制开口（8）内的基板（2）上。光耦合器（11）安装在模制开口（8）中并与光学装置（9）对准。在另一实施例中，基板（201）具有通过模制开口（228）可接近的开口（206），并且光学装置（202）安装在与模制开口相对的基板（201）的一侧上，以及经由所述开口在耦合器和光学装置之间存在光路。基板（201）可以包括接合光耦合器的配合对准特征（213）的对准特征（212）。

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