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    • 4. 发明申请
    • ADAPTIVE, FEEDBACK-CONTROLLED MATERIAL PROCESSING USING ULTRA-SHORT LASER PULSES
    • 超短激光脉冲自适应反馈控制的资料处理
    • WO2004039530A3
    • 2004-11-18
    • PCT/DE0303530
    • 2003-10-23
    • UNIV KASSELBAUMERT THOMASASSION ANDREASWOLLENHAUPT MATTHIAS
    • BAUMERT THOMASASSION ANDREASWOLLENHAUPT MATTHIAS
    • B23K26/03B23K26/06B23K26/067B23K26/36
    • B23K26/067B23K26/032B23K26/0604B23K26/0613B23K26/0624B23K26/361
    • The invention relates to material processing using laser pulses and to a method and device for the microstructured, ablative processing of material (22), said processing being achieved in one or more sequential process steps by individual laser pulses. (14). According to the invention, ultra-short laser pulses are shaped in a precise manner with the aid of a phase modulator (12), the material (22) is irradiated with said pulses and the quality of the working process that results from the irradiation is recorded and evaluated using computer technology (32). This can, for example, be carried out with the aid of a signal emitted by laser-induced breakdown spectroscopy (LIBS). Said evaluation signal is evaluated by an optimisation algorithm and the information thus obtained is used immediately to calculate additional, potentially more suitable laser pulse forms, which are in turn set by the computer-controlled (34, 36) phase modulator (12). The material (22) is irradiated again with said new laser pulses (14), in such a way that the same conditions prevail on the material (22) as during the preceding pulse. The iteration is continued until an optimum efficiency is reached for the processing of the material.
    • 本发明是在材料加工用激光脉冲的字段。 它涉及一种用于材料(22)的微结构化烧蚀加工的方法和装置,其中,在由单独的激光脉冲(14)的一个或几个连续的工艺步骤在材料上的操作。 根据与相位调制器(12)的帮助下,本发明的超短激光脉冲在被照射材料(22)与它的特定形状,并且检测的质量由照射工作过程的计算机技术(32)并评价进行。 这可以通过从激光诱导击穿光谱(LIBS)的信号的方法进行,例如。 根据本发明,通过从ptimierungsalgorithmus该评价信号进行评价,得到的信息被直接用于进一步的计算,即由计算机控制的(34,36)相位调制器(12)依次反复调整可能更合适的激光脉冲的形状。 这些新的激光脉冲(14)再次照射到材料(22),以这样的方式在相同的条件为准的材料(22),如前面的脉冲(14)。 迭代继续进行,直至一个最佳效率在材料的加工中。