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1. 发明申请

WO2008121699A3 HOT MELT ADHESIVE HOSE ASSEMBLY WITH THERMAL FUSE LINK 审中-公开
标题翻译：热熔胶管软管组件与热熔丝链接
公开(公告)号：WO2008121699A3
公开(公告)日：2009-11-05
申请号：PCT/US2008058403
申请日：2008-03-27
申请人： ILLINOIS TOOL WORKS , MACLEAN MAIRI , HEERDT DIETER B , FULLER CHRISTOPHER R
发明人： MACLEAN MAIRI , HEERDT DIETER B , FULLER CHRISTOPHER R
IPC分类号： G05D23/275 , B05C5/00 , B67D7/08
CPC分类号： G05D23/27536
摘要： A hot melt adhesive hose assembly comprises a heater circuit wrapped around an external surface portion of the hose assembly, a temperature sensor, and an elongated thermal fuse which is likewise wrapped around an external surface portion of the hose assembly such that successive spiral turns of the thermal fuse are effectively interposed between successive spiral turns of the heater circuit. The thermal fuse may be electrically connected in series with the heater circuit so as to effectively terminate electrical power to the heater circuit as a result of the melting of the thermal fuse, or alternatively, the thermal fuse may be electrically connected in series with the temperature sensor, so as to detect abnormal temperature levels at substantially any location throughout the length of the hose assembly.
摘要翻译：热熔胶管组件包括围绕软管组件的外表面部分缠绕的加热器电路，温度传感器和细长的热熔丝，其同样缠绕在软管组件的外表面部分上，使得连续的螺旋匝热熔丝被有效地插入在加热器电路的连续螺旋圈之间。热熔丝可以与加热器电路串联电连接，以便有效地终止由于热熔丝熔化而导致加热器电路的电力，或者可选地，热熔丝可以与温度串联电连接传感器，以便在软管组件的整个长度上的基本上任何位置检测异常温度水平。

2. 发明申请

WO2006121654A3 CONTROL CIRCUITS FOR HOT MELT ADHESIVE HEATER CIRCUITS AND APPLICATOR HEADS 审中-公开
标题翻译：热熔胶加热器电路和应用头的控制电路
公开(公告)号：WO2006121654A3
公开(公告)日：2007-04-05
申请号：PCT/US2006016478
申请日：2006-05-01
申请人： ILLINOIS TOOL WORKS , HEERDT DIETER B , PAHL ANDREAS
发明人： HEERDT DIETER B , PAHL ANDREAS
IPC分类号： B67D7/80 , G05B19/048 , B05C5/00 , B05C11/10 , G05D23/19
CPC分类号： G05D23/1934 , B05C5/001 , B05C11/1042 , Y10T307/469
摘要： An electronic control circuit, for use in connection a hot melt adhesive dispensing system having a relatively large applicator head, has a plurality of heater circuits and a plurality of temperature sensors disposed upon different regions of the relatively large applicator head, so as to control individual ones of the plurality of heater circuits and thereby ensure that all of the heater circuits will maintain the same temperature setting throughout all regions of the applicator head. A second electronic control circuit enables the temperature sensors to effectively be eliminated due to the fact that the temperature value of each heater circuit can be calculated from resistance and temperature coefficient values characteristic of the heater circuit, wherein the electronic control circuitry can again interface between the heater circuit and the adhesive supply unit (ASU) temperature controller.
摘要翻译：一种电子控制电路，用于连接具有相对较大的施用头的热熔胶分配系统，具有多个加热器电路和多个温度传感器，该温度传感器设置在相对较大的涂抹头的不同区域上，以便控制个体多个加热器电路中的一个，从而确保所有加热器电路将在施用头的所有区域保持相同的温度设置。第二电子控制电路使得能够有效地消除温度传感器，这是由于可以根据加热器电路特性的电阻和温度系数值来计算每个加热器电路的温度值，其中电子控制电路可以再次在加热器电路和粘合剂供应单元（ASU）温度控制器。

3. 发明申请

WO2009045704A3 INFORMATION COMMUNICATION SYSTEMS BETWEEN COMPONENTS OF A HOT MELT ADHESIVE MATERIAL DISPENSING SYSTEM 审中-公开
标题翻译：信息通信系统之间的热熔胶粘剂材料分配系统的组成部分
公开(公告)号：WO2009045704A3
公开(公告)日：2009-12-10
申请号：PCT/US2008076383
申请日：2008-09-15
申请人： ILLINOIS TOOL WORKS , HEERDT DIETER B , SURENBROCK MICHAEL
发明人： HEERDT DIETER B , SURENBROCK MICHAEL
IPC分类号： B05C5/00 , B67D7/80 , G05B19/042
CPC分类号： G05B19/0423 , B05C5/001 , B05C11/1042
摘要： A hot melt adhesive material dispensing system includes a communication system for transmitting information or data between the adhesive supply unit (ASU) and one or more applicator heads, wherein the number of hard wires actually interconnecting the adhesive supply unit (ASU) and the one or more hot melt adhesive material dispensing applicator heads can be reduced by the employment of signal couplers. In addition, the number of applicator heads that can be utilized in conjunction with a particular adhesive supply unit (ASU) can be increased by incorporating the temperature controller, normally disposed upon the adhesive supply unit (ASU), upon the applicator head.
摘要翻译：热熔粘合剂材料分配系统包括用于在粘合剂供应单元（ASU）和一个或多个涂敷器头之间传输信息或数据的通信系统，其中实际上互连粘合剂供应单元（ASU）和一个或多个通过使用信号耦合器可以减少更多的热熔粘合材料分配涂敷头。此外，可以通过将通常设置在粘合剂供应单元（ASU）上的温度控制器结合到涂抹器头上来增加可以与特定粘合剂供应单元（ASU）结合使用的涂抹器头的数量。

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