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    • 2. 发明申请
    • ENHANCED STRUCTURE FOR NATURAL COOLING HEAT SINK
    • 天然冷却热水器的增强结构
    • WO2015022032A1
    • 2015-02-19
    • PCT/EP2013/067176
    • 2013-08-16
    • HUAWEI TECHNOLOGIES CO., LTD.HU, WeifengMONOKROUSOS, AntoniosEKHOLM, PeterTSOI, Vadim
    • HU, WeifengMONOKROUSOS, AntoniosEKHOLM, PeterTSOI, Vadim
    • H01L23/467F28F3/02
    • H01L23/467H01L2924/0002H01L2924/00
    • The present invention relates to a heat sink for instance for use in a remote radio unit comprising a plurality of fins (8, 9, 10) arranged such that channels (11, 12, 13) are formed between adjacent fins, said channels (11, 12, 13) comprising an air inflow and an air outflow, wherein the heat sink comprises at least two groups (5, 6, 7) of fins (8, 9, 10) arranged such that the air inflow of the channels of a first of said groups (5) is located differently from the air outflow of the channels of the remaining of said groups (6, 7). The invention furthermore relates to a method of cooling a heat- generating device, such as a remote radio unit, the method comprising providing at least two groups of air flow channels in thermal contact with said heat- generating device, each channel having an air inflow region and an air outflow region, wherein the air inflow regions of the channels of the first group are located differently from the air outflow regions of the channels of the remaining groups, such that hot air leaving through the air outflow regions of said remaining groups is prevented from entering the channels of the first group through the respective air inflow regions of the first group.
    • 散热器技术领域本发明涉及一种散热器,例如用于远程无线电单元,包括多个散热片(8,9,10),其布置成使得在相邻散热片之间形成通道(11,12,13),所述通道(11 ,12,13),其包括空气流入和空气流出,其中所述散热器包括至少两组散热片(8,9,10),所述散热片(8,9,10)布置成使得所述散热片 所述组(5)中的第一位置与所述组(6,7)中剩余的通道的空气流出不同。 本发明还涉及一种冷却诸如远程无线电单元的发热装置的方法,所述方法包括提供与所述发热装置热接触的至少两组空气流动通道,每个通道具有空气流入 区域和空气流出区域,其中,所述第一组的通道的空气流入区域与其余组的通道的空气流出区域不同,使得通过所述剩余组的空气流出区域流出的热空气为 防止通过第一组的各个空气流入区域进入第一组的通道。
    • 5. 发明申请
    • A HEAT SINK AND A METHOD OF MAKING A COOLED DEVICE WITH A HEAT SINK
    • 一种散热器和一种制造具有散热器的冷却装置的方法
    • WO2012171551A1
    • 2012-12-20
    • PCT/EP2011/059790
    • 2011-06-14
    • HUAWEI TECHNOLOGIES CO., LTD.TSOI, Vadim
    • TSOI, Vadim
    • H01L23/367H01L23/467
    • H01L23/3672H01L23/467H01L2924/0002H01L2924/00
    • A heat sink (1) including a mounting structure, such as a mounting base, and adapted for being mounted in thermal contact with electronics equipment, said heat sink having a first end (A) and a second end (B) opposite said first end (A) and comprising: - a first heat transfer structure (30) comprising spaced apart first walls (35) mounted in thermal contact with said mounting structure, - said first walls (35) defining a plurality of major air flow passages (10) of said heat sink, said major air flow passages (10) extending between said first end (A) and said second end (B) and opening at said first end (A) and said second end (B), and - a plurality of second heat transfer structures (40) mounted in thermal contact with said first walls (35) and including spaced apart second walls (45) defining a plurality of minor flow passages (42) extending between said first end (A) and said second end (B), wherein at least some of said major air flow passages (10, 20) each including two or more of said second heat transfer structures (40) arranged in a spaced apart relationship, a plenum (4) between two adjacent second heat transfer structures (40) in a major air flow passage being defined in part by two opposite first walls (35) of said first heat transfer structure (30).
    • 一种散热器(1),包括诸如安装基座的安装结构,并且适于与电子设备热接触地安装,所述散热器具有与所述第一端(A)相对的第一端(A)和第二端(B) (A)并且包括: - 第一传热结构(30),包括与所述安装结构热接触地安装的间隔开的第一壁(35),所述第一壁(35)限定多个主要空气流动通道(10) 所述主要空气流动通道(10)在所述第一端(A)和所述第二端(B)之间延伸并且在所述第一端(A)和所述第二端(B)处开口,以及 - 多个 第二传热结构(40),其安装成与所述第一壁(35)热接触并且包括限定多个在所述第一端(A)和所述第二端(A)之间延伸的小流动通道(42)的间隔开的第二壁 B),其中至少一些所述主要空气流动通道(10,20)各自包括两个或更多个 所述第二传热结构(40)以间隔开的关系布置,主要空气流动通道中的两个相邻的第二传热结构(40)之间的增压室(4)部分地由所述第二传热结构(40)的两个相对的第一壁 第一传热结构(30)。
    • 7. 发明申请
    • LIQUID COOLING SYSTEM AND METHOD FOR COOLING AT LEAST ONE HEAT GENERATING COMPONENT
    • 用于冷却至少一个发热组件的液体冷却系统和方法
    • WO2013117212A1
    • 2013-08-15
    • PCT/EP2012/051938
    • 2012-02-06
    • HUAWEI TECHNOLOGIES CO., LTD.SHI, JianTSOI, Vadim
    • SHI, JianTSOI, Vadim
    • F25B21/02
    • F25B21/02F25B2321/0252F25B2400/04H01L23/473H01L2924/0002H05K7/20218H01L2924/00
    • The invention relates to a liquid cooling system (2) for cooling at least one heat generating component (10), where the liquid cooling system (2) comprises a liquid loop (4) in which liquid (6) is arranged to be circulated, where the liquid (6) is arranged to be cooled by a first stage cooling unit (14), where the cold side (26) of at least one Thermo Electric Cooling unit (24) is arranged at a position situated downstream of the first stage cooling unit (14) and upstream of the at least one heat generating component (10) to be cooled by liquid (6), where the at least one Thermo Electric Cooling unit (24) is arranged in its operative state to cool the liquid (6) in order to provide for further cooling power when the cooling power of the first stage cooling unit (14) is not sufficient, where the liquid (6) is further arranged to cool down the hot side (32) of the at least one Thermo Electric Cooling unit (24) and to transfer heat generated by the at least one Thermo Electric Cooling unit (24) to the first stage cooling unit (14) arranged to transfer away heat from the liquid (6). The invention also relates to a method for cooling at least one heat generating component (10) using a liquid cooling system (2) comprising a liquid loop (4) in which liquid (6) is arranged to be circulated.
    • 本发明涉及一种用于冷却至少一个发热部件(10)的液体冷却系统(2),其中液体冷却系统(2)包括其中液体(6)布置成循环的液体回路(4) 其中液体(6)被布置成由第一级冷却单元(14)冷却,其中至少一个热电冷却单元(24)的冷侧(26)被布置在位于第一级下游的位置 冷却单元(14)和所述至少一个发热部件(10)的上游,以由液体(6)冷却,其中所述至少一个热电冷却单元(24)布置在其操作状态以冷却液体( 6),以便当第一级冷却单元(14)的冷却功率不足时提供进一步的冷却功率,其中液体(6)进一步布置成使至少一个冷却单元(14)的热侧(32)冷却 热电冷却单元(24),并且传送由至少一个热电冷却单元产生的热量 t(24)到布置成从液体(6)传出热量的第一级冷却单元(14)。 本发明还涉及一种使用液体冷却系统(2)冷却至少一个发热部件(10)的方法,所述液体冷却系统(2)包括其中液体(6)布置成循环的液体回路(4)。
    • 9. 发明申请
    • CABINET COOLING
    • 橱柜冷却
    • WO2003065781A1
    • 2003-08-07
    • PCT/SE2002/000148
    • 2002-01-29
    • TELEFONAKTIEBOLAGET LM ERICSSONTSOI, Vadim
    • TSOI, Vadim
    • H05K7/20
    • H05K7/20381F25B1/06F25B23/006F25B2700/2106F25B2700/2116F25B2700/2117G05D23/1931
    • A novel electronics cooling method and system is disclosed. A very flexible and efficient operation of an electronics cooling system (10) is achieved by controlling circulation of a cooling medium in a closed system (40) containing an evaporator (13), a condenser (14), an ejector (11) and control valves (15-18). Specifically, the system is continuously allowed to operate in the most appropriate mode by controlling the valves (15-18) of the system (10) based on detected heat load and/or detected heat transfer conditions. By automatically adapting the mode of operation of the system based on the actual prevailing conditions, a unique flexibility is obtained with regard to the cooling mode in which the system will be operated. This means that the cooling capacity will be constantly optimized and that the investment cost as well as the cost for operating the system will be reduced compared to known systems having equal maximum cooling capacity.
    • 公开了一种新颖的电子冷却方法和系统。 通过控制包含蒸发器(13),冷凝器(14),喷射器(11)和控制器(11)的封闭系统(40)中的冷却介质的循环来实现电子冷却系统(10)的非常灵活和有效的操作 阀门(15-18)。 具体地,通过基于检测到的热负荷和/或检测到的传热条件控制系统(10)的阀(15-18),系统被连续允许以最适当的模式运行。 通过根据实际的现行条件自动适应系统的运行模式,可以在系统运行的冷却模式下获得独特的灵活性。 这意味着与具有相同最大冷却能力的已知系统相比,冷却能力将不断优化,并且投资成本以及操作系统的成本将会降低。