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    • 5. 发明申请
    • ORGANIC ELECTRONIC DEVICES PROTECTED BY ELASTOMERIC LAMINATING ADHESIVE
    • 通过弹性粘合剂保护的有机电子器件
    • WO2008144080A1
    • 2008-11-27
    • PCT/US2008/051921
    • 2008-01-24
    • NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATIONCAO, Jie
    • CAO, Jie
    • H05B33/02H05B33/10
    • H01L51/5246H01B3/447
    • An active organic electronic component is protected within an organic electronic device by an elastomeric laminating adhesive, which adheres the substrate and cover of the electronic device and encloses and protects the active organic component within the device. The organic electronic device has a structure comprising (a) a substrate; (b) an active organic component disposed on the substrate, and optionally, a barrier coating disposed over the active organic component and over part of the substrate; (c) a cover, and optionally a getter associated with the cover; (d) a cured elastomeric laminating adhesive applied in the area between the substrate and the cover and enclosing the active organic component. The laminating adhesive may be thermaily curable or curable by actinic radiation.
    • 活性有机电子部件通过弹性体层压粘合剂在有机电子器件内被保护,所述弹性体层压粘合剂粘附电子器件的基底和盖子并且包围并保护器件内的活性有机成分。 有机电子器件具有以下结构:(a)衬底; (b)设置在所述基底上的活性有机组分,和任选地,设置在所述活性有机组分和所述衬底的一部分上的阻挡涂层; (c)盖子,以及可选地与盖子相关联的吸气剂; (d)固化的弹性体层压粘合剂,其施加在基材和盖子之间的区域中并包封活性有机组分。 层压粘合剂可以是热可固化的或通过光化辐射固化的。