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    • 3. 发明申请
    • EMISSIVE DEVICE WITH CHIPLETS
    • 带有芯片的发射装置
    • WO2010056358A2
    • 2010-05-20
    • PCT/US2009/006132
    • 2009-11-16
    • EASTMAN KODAK COMPANYCOK, Ronald StevenHAMER, John W.
    • COK, Ronald StevenHAMER, John W.
    • H01L51/52H01L27/32
    • H01L27/3276H01L27/3255H01L51/524
    • An emissive device includes a substrate having a substrate surface; a chiplet adhered to the substrate surface, the chiplet having one or more connection pads; a bottom electrode formed on the substrate surface, one or more organic or inorganic light-emitting layers formed over the bottom electrode, and a top electrode formed over the one or more organic or inorganic light-emitting layers; an electrical conductor including a transition layer formed over only a portion of the chiplet and only a portion of the substrate surface, the transition layer exposing at least one connection pad, the electrical conductor formed in electrical contact with the exposed connection pad and the bottom electrode; and an LED spaced from the chiplet and including a layer of light-emissive material formed over the bottom electrode and a top electrode formed over the light-emissive layer.
    • 发射装置包括具有衬底表面的衬底; 小芯片,所述小芯片粘附到所述基板表面,所述小芯片具有一个或多个连接垫; 形成在所述基板表面上的底部电极,形成在所述底部电极上的一个或多个有机或无机发光层以及形成在所述一个或多个有机或无机发光层上的顶部电极; 电导体,其包括仅形成在小芯片的一部分上方并且仅形成在衬底表面的一部分上的过渡层,过渡层暴露至少一个连接焊盘,电导体形成为与暴露的连接焊盘和底电极电接触 ; 以及与小芯片间隔开并且包括在底部电极上方形成的发光材料层和在发光层上方形成的顶部电极的LED。