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1. 发明申请

WO2004025697A2 THERMAL PROCESS STATION WITH HEATED LID 审中-公开
标题翻译：带加热灯的热过程站
公开(公告)号：WO2004025697A2
公开(公告)日：2004-03-25
申请号：PCT/US2003/024089
申请日：2003-08-01
申请人： FSI INTERNATIONAL, INC.
发明人： NGUYEN, Vuong, P. , SIMS, Richard, E. , ZHU, Xiaoguang
IPC分类号： H01L
CPC分类号： F27B17/0025 , H01L21/67109 , H01L21/67126
摘要： Methods and apparatuses to improve the temperature uniformity of a workpiece being processed on a heated platen of a thermal processing station. A heated platen is enclosed in a housing incorporating an additional heat source that uniformly outputs thermal energy into the process chamber in which the heated platen is positioned. In preferred embodiments, this heat source is positioned in the lid of the housing. It is additionally preferred that the heated lid includes features that provide a gas flow path to introduce to and/or purge gas from the process chamber. In terms of photoresist performance, the improved thermal uniformity provided by using such an additional heat source in the housing, e.g., in the lid, offers improved line width control and line uniformity across a wafer.
摘要翻译：一种用于改善在热处理站的加热压板上加工的工件的温度均匀性的方法和装置。加热的压板被封闭在壳体中，该壳体包括额外的热源，其将热能均匀地输送到处理室中，加热的压板位于该处理室中。在优选实施例中，该热源位于壳体的盖中。另外优选地，加热的盖子包括提供气体流动路径以从处理室引入和/或吹扫气体的特征。在光致抗蚀剂性能方面，通过在壳体（例如盖）中使用这种附加热源提供的改进的热均匀性提供了改善的线宽度控制和跨晶片的线均匀性。

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