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1. 发明申请

WO2011156669A3 METHODOLOGIES FOR RINSING TOOL SURFACES IN TOOLS USED TO PROCESS MICROELECTRONIC WORKPIECES 审中-公开
标题翻译：用于加工微电子工件的工具中冲压工具表面的方法
公开(公告)号：WO2011156669A3
公开(公告)日：2012-04-12
申请号：PCT/US2011039904
申请日：2011-06-10
申请人： FSI INT INC , STIYER MARK A , DEKRAKER DAVID
发明人： STIYER MARK A , DEKRAKER DAVID
IPC分类号： H01L21/67
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/04
摘要： Rinsing methodologies and components to accomplish rinsing of tool surfaces in tools that are used to process one or more microelectronic workpieces. The invention can be used to rinse structures that overlie a workpiece being treated in such a manner to function in part as a lid over the process chamber while also defining a tapering flow channel over the workpiece. Rather than spray rinsing liquid onto the surface in a manner that generates undue splashing, droplet, or mist generation, a swirling flow of rinse liquid is generated on a surface of at least one fluid passage upstream from the surface to be rinsed. The swirling flow then provides smooth, uniform wetting and sheeting action to accomplish rinsing with a significantly reduced risk of generating particle contamination.
摘要翻译：冲洗方法和组件，用于在用于处理一个或多个微电子工件的工具中完成工具表面的冲洗。本发明可以用于冲洗覆盖在待处理工件上的结构，以使其部分地作为处理室上的盖而起作用，同时还在工件上限定了一个渐缩的流动通道。不会以产生不适当的飞溅，液滴或雾气的方式将冲洗液体喷淋到表面上，而是在要冲洗的表面上游的至少一个流体通道的表面上产生冲洗液体的旋转流。然后旋转流动提供平滑，均匀的润湿和薄片动作，以显着降低产生颗粒污染的风险来完成冲洗。

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