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1. 发明申请

WO2012017319A3 OPTICAL COUPLING SYSTEM 审中-公开
标题翻译：光耦合系统
公开(公告)号：WO2012017319A3
公开(公告)日：2012-04-26
申请号：PCT/IB2011002078
申请日：2011-08-08
申请人： FRAMATOME CONNECTORS INT , STRICOT YVES , YABRE GNITABOURE , DROESBEKE GERT
发明人： STRICOT YVES , YABRE GNITABOURE , DROESBEKE GERT
IPC分类号： G02B6/42
CPC分类号： G02B6/4214 , G02B6/4249
摘要： The optical coupling system comprises: - a first optical interface (25) comprising a first set of rows; a second optical interface (26) comprising a second set of rows, offset from one another by a second pitch different from the first pitch, - a first and a second light beam forming structure (15, 15') adapted to optically couple the optical interface of an optical circuit board and a mating optical device to the optical coupling system, a reflective arrangement (141, 142, 143) to offset the light transmitted through the optical coupling system.
摘要翻译：该光学耦合系统包括： - 第一光学接口（25），其包括第一组行; 包括第二组行的第二光学接口（26），所述第二组行以不同于所述第一节距的第二节距彼此偏移;第一和第二光束形成结构（15,15'），所述第一和第二光束形成结构适于将所述光学将光学电路板和配合光学装置的接口连接到光学耦合系统;反射装置（141,142,143），用于偏移透过光学耦合系统的光。

2. 发明申请

WO2012017318A3 OPTICAL COUPLING SYSTEM 审中-公开
标题翻译：光耦合系统
公开(公告)号：WO2012017318A3
公开(公告)日：2012-09-07
申请号：PCT/IB2011002073
申请日：2011-08-03
申请人： FRAMATOME CONNECTORS INT , YABRE GNITABOURE , STRICOT YVES
发明人： YABRE GNITABOURE , STRICOT YVES
IPC分类号： G02B6/42 , G02B6/43
CPC分类号： G02B6/4214 , G02B6/3897 , G02B6/4206
摘要： An optical communication system comprises : - a daughter optical circuit board (3) having an embedded optical layer (6), - a mother optical circuit board (2), having an embedded optical layer (10), - an optical coupling system having :· a first optical interface (18) optically coupled to a first optical interface of the daughter circuit board, and · a second optical interface (19) optically coupled to a first optical interface of the mother circuit board. The optical coupling system comprises an optical coupling device (17), formed as an integral part of translucent material comprising light beam forming structures (22;27), fixed to the daughter board.
摘要翻译：一种光通信系统，包括： - 具有嵌入式光层（6）的子光电路板（3）， - 具有嵌入式光层（10）的母光电路板（2）， - 光耦合系统，具有： ·第一光学接口（18），光学耦合到子电路板的第一光学接口;以及第二光学接口（19），光学耦合到母电路板的第一光学接口。光耦合系统包括光耦合装置（17），其形成为固定到子板的包括光束形成结构（22; 27）的半透明材料的整体部分。

3. 发明申请

WO2011154951A3 OPTICAL CIRCUIT BOARD WITH OPTICAL COUPLING DEVICE 审中-公开
标题翻译：具有光耦合器件的光电路板
公开(公告)号：WO2011154951A3
公开(公告)日：2012-08-02
申请号：PCT/IL2011000456
申请日：2011-06-09
申请人： FRAMATOME CONNECTORS INT , YABRE GNITABOURE , STRICOT YVES , REINHOLD COHN AND PARTNERS
发明人： YABRE GNITABOURE , STRICOT YVES
IPC分类号： G02B6/30 , G02B6/42
CPC分类号： G02B6/30 , G02B6/3885 , G02B6/4214 , G02B6/423 , G02B6/4236 , G02B6/4249 , G02B6/4292
摘要： An optical system comprises: an optical circuit board (1) having an optical layer, comprising an optical waveguide (2) embedded between top and bottom faces, and a cut-out (27) having a bottom reference layer defining an X-Y plane, an optical coupling device having a positioning member (19) extending in the cut-out, a mechanical fixation system (31) attaching the optical circuit board to the optical coupling device, and comprising a fixation pin (32) extending through the optical circuit board at the positioning member (19).
摘要翻译：一种光学系统包括：具有光学层的光学电路板（1），包括嵌入在顶面和底面之间的光波导（2）和具有限定XY平面的底部参考层的切口（27），具有在切口中延伸的定位构件（19）的光耦合装置，将光学电路板连接到光耦合装置的机械固定系统（31），并且包括一个延伸穿过光电路板的固定销（32）定位构件（19）。

4. 发明申请

WO2006002925A8 VERY HIGH FREQUENCY ELECTRICAL CONNECTOR 审中-公开
标题翻译：非常高频的电气连接器
公开(公告)号：WO2006002925A8
公开(公告)日：2010-08-05
申请号：PCT/EP2005007059
申请日：2005-06-30
申请人： FRAMATOME CONNECTORS INT , DROESBEKE GERT , BARLERIN STEPHANE , FARES-KARAM ANTOINE , LEMARECHAL DAVID , STRICOT YVES
发明人： DROESBEKE GERT , BARLERIN STEPHANE , FARES-KARAM ANTOINE , LEMARECHAL DAVID , STRICOT YVES
IPC分类号： H01R4/24 , H01R13/03 , H01R13/115 , H01R13/658 , H01R13/66
CPC分类号： H01R13/035 , H01R4/2404 , H01R13/112 , H01R13/6599 , H01R13/6658
摘要： The invention concerns an electrical connector (1) comprising a box (2), at least one electrically conductive track (7, 9, 10, 11) and a plurality of first electrical contacts (8), the first contacts being designed to come into contact with complementary second electrical contacts (20) of a complementary connection device (5). In order to reduce the manufacturing cost of such an electrical connector and increase the electronic data transfer capacity through this electrical connector, the invention provides that the first electrical contacts are connected to electrically conductive tracks by joining, and that the box is formed by at least one molded plastic that is at least partially metal-coated to form the electrically conductive tracks.
摘要翻译：本发明涉及一种包括盒（2），至少一个导电轨道（7,9,10,11）和多个第一电触点（8）的电连接器（1），所述第一触点被设计成进入与互补连接装置（5）的互补的第二电触头（20）接触。为了降低这种电连接器的制造成本并且通过该电连接器增加电子数据传输能力，本发明提供了第一电触头通过接合连接到导电轨道，并且该盒至少形成一个模制塑料，其至少部分金属涂覆以形成导电轨道。

5. 发明申请

WO9949499A3 METHOD FOR CONNECTING AND SUPPORTING A CSP HOUSING CONNECTION WITH AN INTEGRATED CIRCUIT 审中-公开
标题翻译：用于连接和支持与集成电路的CSP外壳连接的方法
公开(公告)号：WO9949499A3
公开(公告)日：2000-06-15
申请号：PCT/FR9900669
申请日：1999-03-22
申请人： BULL SA , COURANT PATRICK , PETIT CLAUDE , STRICOT YVES
发明人： COURANT PATRICK , PETIT CLAUDE , STRICOT YVES
IPC分类号： H01L23/31 , H01L23/495
CPC分类号： H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： The invention concerns a method for electrical connection between an integrated circuit (10) housing connection pads (9i) and a CSP housing output terminals (18), which consists in connecting the integrated circuit (10) connection pads (9i) to a connecting support (1) arranged opposite and on a different level from the connecting pads (9i) via electrical conductors (8i) arranged on the connecting support (1). The method is characterised in that, after the support (1) has been arranged opposite the integrated circuit (10), it consists in moving at least part (7i) of the support to bring it in the proximity of the integrated circuit (10) connection pads (9i), and in connecting the conductors (8i) supported by the support part (7i) of the support (1) on the integrated circuit (10) connection pads (9i). The invention is particularly applicable to CSP housing interconnection technique (18).
摘要翻译：本发明涉及一种用于容纳连接焊盘（9i）和CSP壳体输出端子（18）的集成电路（10）之间的电连接的方法，其包括将集成电路（10）连接焊盘（9i）连接到连接支架（1）通过布置在所述连接支撑件（1）上的电导体（8i）相对并且在与所述连接焊盘（9i）不同的水平面上。该方法的特征在于，在支撑件（1）已经布置成与集成电路（10）相对之后，其包括移动至少部分（7i）的支撑件以使其在集成电路（10）附近，连接焊盘（9i），并且连接由集成电路（10）连接焊盘（9i）上的支撑体（1）的支撑部分（7i）支撑的导体（8i）。本发明特别适用于CSP外壳互连技术（18）。

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