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1. 发明申请

WO2009057900A1 MEMORY CARD CHANGER, METHOD FOR READING OR WRITING DATA IN MEMORY CARD CHANGER 审中-公开
标题翻译：内存卡更换方法，用于在内存卡更换中读取或写入数据的方法
公开(公告)号：WO2009057900A1
公开(公告)日：2009-05-07
申请号：PCT/KR2008/005875
申请日：2008-10-07
申请人： EZ PEX , JEONG, Seok-Yeon , LEW, Seung-Koo , LEE, Jun-Woo
发明人： JEONG, Seok-Yeon , LEW, Seung-Koo , LEE, Jun-Woo
IPC分类号： G06K17/00
CPC分类号： G06K7/0013 , G06K19/07741
摘要： A memory card changer is disclosed. The memory card changer in accordance with an embodiment of the present invention can include a connector, which interchanges the data with a host device, a built-in memory; a slot, which attaches and detaches the plurality of external memory cards, and a processor, which controls the host device to collectively recognize or individually recognize individual storage capacities of the built-in memory and each of the memory cards inserted in the slot unit. In accordance with the present invention, the memory card changer can collectively manage individual storage capacities of the built-in memory and the plurality of external memory cards inserted in the memory card changer.
摘要翻译：公开了一种存储卡更换器。根据本发明的实施例的存储卡更换器可以包括将数据与主机设备交换的连接器，内置存储器; 连接和分离多个外部存储卡的插槽以及控制主机设备共同识别或单独地识别内置存储器和插入插槽单元中的每个存储卡的各个存储容量的处理器。根据本发明，存储卡更换器可以集中地管理内置存储器和插入存储卡更换器中的多个外部存储卡的各个存储容量。

2. 发明申请

WO2009107880A1 FLIP CHIP PACKAGING METHOD USING DOUBLE LAYER TYPE WAFER LEVEL UNDERFILL, FLIP CHIP PACKAGE MANUFACTURED USING THE SAME, AND SEMICONDUCTOR DEVICE FOR THE SAME 审中-公开
标题翻译：使用双层类型水平底层的翻转芯片包装方法，使用其制造的片状芯片包装及其相同的半导体器件
公开(公告)号：WO2009107880A1
公开(公告)日：2009-09-03
申请号：PCT/KR2008/001087
申请日：2008-02-25
申请人： LS MTRON, LTD. , ROH, June , KANG, Byung-Un , SUNG, Choong-Hyun , SEO, Joon-Mo , KIM, Jae-Hun , HYUN, Soon-Young , KIM, Ji-Eun , LEE, Jun-Woo
发明人： ROH, June , KANG, Byung-Un , SUNG, Choong-Hyun , SEO, Joon-Mo , KIM, Jae-Hun , HYUN, Soon-Young , KIM, Ji-Eun , LEE, Jun-Woo
IPC分类号： H01L23/28 , H01L23/12
CPC分类号： H01L21/563 , C08L63/00 , C09J163/00 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/131 , H01L2224/2732 , H01L2224/274 , H01L2224/27416 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29386 , H01L2224/73104 , H01L2224/73204 , H01L2224/81815 , H01L2224/83191 , H01L2224/83862 , H01L2224/9211 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/00014 , H01L2924/01014 , H01L2924/3512 , H01L2924/00 , H01L2924/0665 , H01L2924/05442 , H01L2224/29099 , H01L2224/29199
摘要： The present invention relates to a flip chip packaging method comprising the steps of forming a double layer type underfill layer having different curing temperatures on one surface of a semi¬ conductor wafer having a solder bump pattern; performing a B-stage process on the underfill layer to cure a layer having a relatively lower curing temperature among the double layer type underfill layer; dicing the semiconductor wafer into individual chips; aligning the individual chips on a substrate such that a surface of the underfill layer faces a surface of the substrate; and performing a reflow process with temperature capable of curing all of the double layer type underfill layer.
摘要翻译：本发明涉及一种倒装芯片封装方法，包括以下步骤：在具有焊料凸块图形的半导体晶片的一个表面上形成具有不同固化温度的双层型底部填充层; 在底层填充层上进行B阶段处理以固化双层型底部填充层中具有相对较低固化温度的层; 将半导体晶片切割成单个芯片; 将衬底上的各个芯片对准，使得底部填充层的表面面向衬底的表面; 以及能够固化所有双层型底部填充层的温度的回流处理。

3. 发明申请

WO2006009336A1 AUTOMATIC POSITION REGISTERING METHOD IN A MOBILE PHONE 审中-公开
标题翻译：移动电话中的自动定位注册方法
公开(公告)号：WO2006009336A1
公开(公告)日：2006-01-26
申请号：PCT/KR2004/002514
申请日：2004-10-01
申请人： SK TELECOM CO., LTD. , JEONG, Kee-Joong , NA, Dong-Won , SULL, Won-Hee , UM, Bong-Su , LEE, Jun-Woo
发明人： JEONG, Kee-Joong , NA, Dong-Won , SULL, Won-Hee , UM, Bong-Su , LEE, Jun-Woo
IPC分类号： H04Q7/38
CPC分类号： H04W4/02 , H04W64/00
摘要： Disclosed is an automatic position registering method in a mobile phone for minimizing a load of a server related to a position information by enabling the position information to be transmitted to LBS (Location Based Service) server if a predetermined given condition is .satisfied after the position information of mobile phone is obtained by an operation of a predetermined program for obtaining the position information of mobile phone. The method comprises the steps of: requesting a driving of a position information managing application built in a mobile phone by LBS server and connecting the position information managing application and LBS server; transmitting a condition for managing the position information to the mobile phone from LBS server; and checking whether the position information managing application is capable of obtaining and uploading the position information based on the condition and then transmitting the position information to LBS server.
摘要翻译：公开了一种移动电话中的自动位置登记方法，用于通过使位置信息能够发送到LBS（基于位置的服务）服务器，如果在该位置之后不满足预定的给定条件，则最小化与位置信息相关的服务器的负载通过用于获取移动电话的位置信息的预定程序的操作来获得移动电话的信息。该方法包括以下步骤：请求由LBS服务器驱动内置在移动电话中的位置信息管理应用程序，并连接位置信息管理应用程序和LBS服务器; 从LBS服务器发送用于管理位置信息到移动电话的条件; 并且检查位置信息管理应用是否能够基于条件获取和上传位置信息，然后将位置信息发送到LBS服务器。

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