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1. 发明申请

WO2008029376A3 DEPOSITION OF CONDUCTIVE POLYMER AND METALLIZATION OF NON-CONDUCTIVE SUBSTRATES 审中-公开
标题翻译：导电聚合物的沉积和非导电基材的金属化
公开(公告)号：WO2008029376A3
公开(公告)日：2008-08-14
申请号：PCT/IB2007053617
申请日：2007-09-07
申请人： ENTHONE , LACHOWICZ AGATA , GLOECKNER ANDREAS
发明人： LACHOWICZ AGATA , GLOECKNER ANDREAS
IPC分类号： C25D5/54 , C25D3/38 , C25D5/56 , H05K3/42
CPC分类号： C25D5/56 , C09D5/24 , C09D5/4476 , C09D5/4484 , C25D3/38 , H05K3/424 , H05K3/427 , H05K2201/0329
摘要： A process is provided for metallizing a surface of a substrate with electrolytically plated copper metallization, the process comprising electrolytically depositing copper over the electrically conductive polymer by immersing the substrate in an electrolytic composition and applying an external source of electrons, wherein the electrolytic composition comprises a source of copper ions and has a pH between about 0.5 and about 3.5. In another aspect, a process is provided for metallizing a surface of a dielectric substrate with electrolytically plated copper metallization, the process comprising immersing the substrate into a catalyst composition comprising a precursor for forming an electrically conductive polymer on the surface of the dielectric substrate and a source of Mn (II) ions in an amount sufficient to provide an initial concentration of Mn (II) ions of at least about 0.1 g/L to form an electrically conductive polymer on the surface of the dielectric substrate, and electrolytically depositing copper over said electrically conductive polymer.
摘要翻译：提供了一种用电镀铜金属化物对衬底表面进行金属化的方法，该方法包括通过将衬底浸入电解质组合物中并施加外部电子源，在导电聚合物上电解沉积铜，其中电解质组合物包含铜离子的来源并具有约0.5至约3.5的pH。另一方面，提供了一种利用电解电镀铜金属化对电介质衬底的表面进行金属化的方法，该方法包括将衬底浸入包含用于在电介质衬底的表面上形成导电聚合物的前体的催化剂组合物，以足以提供至少约0.1g / L的Mn（II）初始浓度的量的Mn（II）离子源以在介电基底的表面上形成导电聚合物，并且在所述介电基底的表面上电解沉积铜导电聚合物。

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