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1. 发明申请

WO0003074A8 PLATING DEVICE 审中-公开
标题翻译：电镀装置
公开(公告)号：WO0003074A8
公开(公告)日：2000-05-04
申请号：PCT/JP9903729
申请日：1999-07-09
申请人： EBARA CORP , HONGO AKIHISA , SUZUKI KENICHI , CHONO ATSUSHI , TADA MITSUO , OGATA AKIRA , SENDAI SATOSHI , MISHIMA KOJI
发明人： HONGO AKIHISA , SUZUKI KENICHI , CHONO ATSUSHI , TADA MITSUO , OGATA AKIRA , SENDAI SATOSHI , MISHIMA KOJI
IPC分类号： C25D21/12 , G01R31/02
CPC分类号： C25D21/12 , G01R31/026
摘要： A conduction condition detecting means which can detect a conduction condition (contact condition) of a plurality of feeding contacts in contact with the conduction portion of a substrate to be plated, and a plating device which can form a plating film with a uniform film thickness by uniformizing plating currents flowing through individual feeding contacts. A plating device which plates a substrate to be plated (12), wherein an electrode (13) and a substrate to be plated (12) mounted to a plating jig (11) are arranged opposite to each other in a plating tank (10), the plating jig (11) is provided with a plurality of feeding contact (15) to come into contact with the conduction portion provided on the surface of the substrate to be plated (12), and a specified voltage is applied between the feeding contacts (15) and the electrode (13) to supply a plating current through the feeding contacts (15), the plating device being provided with a conduction condition detecting means (22) for detecting a conduction condition between individual feeding contacts (15) of the plating jig (11) and the conduction portion of the substrate to be plated (12).
摘要翻译：导电条件检测装置，其能够检测与待镀基板的导电部分接触的多个馈电触点的导电状态（接触状况）;以及电镀装置，其能够通过以下步骤形成具有均匀膜厚度的电镀膜：使流过各个馈电触点的电镀电流均匀化。本发明提供一种电镀装置，该电镀装置在镀槽（10）中对置配置电镀基板（12）的电极（13）和被镀基板（12），电镀夹具（11）设置有多个馈电触点（15），以与设置在待电镀基板（12）的表面上的导电部分接触，并且在馈电触点（15）与电极（13）之间的导电状态检测装置（22），用于通过馈电触点（15）提供电镀电流，所述电镀装置设置有用于检测电镀夹具（11）和待镀基板（12）的导电部分。

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