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    • 4. 发明申请
    • HALOGEN-FREE FLAME-RETARDED POLYESTER COMPOSITION
    • 无卤阻燃聚酯组合物
    • WO2005073316A1
    • 2005-08-11
    • PCT/NL2005/000067
    • 2005-01-28
    • DSM IP ASSETS B.V.JANSSEN, Robert, Hendrik, Catharina
    • JANSSEN, Robert, Hendrik, Catharina
    • C08L67/00
    • C08L67/02C08K5/34924C08L27/18C08L2666/04
    • The invention relates to a halogen-free flame-retarded thermoplastic polyester moulding composition consisting of: (A) a polymer composition consisting of a (A-a) 30-67 mass % at least one thermoplastic polyester polymer and (A-b) 0-15 mass % other polymers, of which 0-0.3 mass % of a fluorine polymer, (B) a flame retardant system consisting of (B-a) 33-55 mass % melamine cyanurate, (B-b) 0 to less than 2 mass % of a phosphorous containing flame retardant not comprising elementary phosphorous and (B-c) 0-5 mass % of an inorganic flame retardant synergist not comprising phosphorous, and (C) 0-10 mass % other additives, of which 0-5 mass fibrous reinforcing agents. The invention also relates to a moulded part for use in electrical or electronic applications comprising said polyester composition.
    • 本发明涉及一种无卤阻燃热塑性聚酯成型组合物,由以下组成:(A)由(Aa)30-67质量%至少一种热塑性聚酯聚合物和(Ab)0-15质量% 其他聚合物,其中含氟聚合物为0-0.3质量%,(B)由(Ba)33-55质量%氰尿酸三聚氰胺组成的阻燃体系,(Bb)0至小于2质量%的含磷火焰 不含基本磷的阻燃剂和(Bc)0-5质量%的不含磷的无机阻燃增效剂,(C)0-10质量%的其它添加剂,其中0-5质量的纤维增强剂。 本发明还涉及一种用于包含所述聚酯组合物的电气或电子应用的模制部件。
    • 10. 发明申请
    • HEAT STABILIZED MOULDING COMPOSITION
    • 热稳定成型组合物
    • WO2006074934A1
    • 2006-07-20
    • PCT/EP2006/000235
    • 2006-01-12
    • DSM IP ASSETS B.V.RULKENS, RudyGIJSMAN, PieterSOUR, Wilhelmus, Josephus, MariaJANSSEN, Robert, Hendrik, Catharina
    • RULKENS, RudyGIJSMAN, PieterSOUR, Wilhelmus, Josephus, MariaJANSSEN, Robert, Hendrik, Catharina
    • C08L77/00C08K5/00C08K3/00
    • C08L77/00C08K3/014C08K3/22C08K5/005C08K3/0041
    • The invention relates to a thermostabilized thermoplastic moulding composition comprising (a) a thermoplastic polyamide composition, consisting of a blend of at least two polyamides comprising (a.1) at least 50% mass, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1), being a semi-crystalline polyamide having a melting point Tm-1 , or being an amorphous polyamide having a glass transition point Tg-1 , wherein Tm-1 and Tg-1 together are denoted as T- 1 and T- 1 is at least 2000C and (a.2) a second polyamide (PA-2), with a C/N ratio of at most 7, being a semi-crystalline polyamide having a melting point Tm-2 or an amorphous polyamide having a glass transition point Tg-2, wherein Tm-2 and Tg-2 together are denoted as T-2 and T-2 is at least 200C lower than T- 1 , (b) a stabilizing system comprising a thermostabilizer selected from the group consisting of phenolic thermostabilizers, organic phosphites, aromatic amines, metal salts of elements from Group IB, MB, III and IV of the Periodic Table and metal halides of alkali and alkali earth metals, and combinations thereof, and (c) a metal oxide, or salt thereof, of a transition metal element from Group VB, VIB, VIIB and VIIIB of the Periodic Table, or a mixture thereof.
    • 本发明涉及一种热稳定的热塑性模塑组合物,其包含(a)热塑性聚酰胺组合物,其由至少两种聚酰胺的混合物组成,所述聚酰胺包含相对于热塑性聚酰胺组合物的总质量至少为50质量%的(a.1) 的第一聚酰胺(PA-1),其为具有熔点Tm-1的半结晶聚酰胺,或者是具有玻璃化转变点Tg-1的无定形聚酰胺,其中Tm-1和Tg-1一起表示为 T 1和T 1至少为200℃,(a.2)C / N比至多为7的第二聚酰胺(PA-2)是熔点为Tm-2的半结晶聚酰胺 或玻璃化转变点Tg-2的无定形聚酰胺,其中Tm-2和Tg-2一起表示为T-2,T-2比T-1低至少20℃,(b)稳定体系包含 选自酚类热稳定剂,有机亚磷酸酯,芳族胺,元素金属盐的热稳定剂 来自元素周期表的IB,MB,III和IV族的碱金属和碱土金属的金属卤化物及其组合,和(c)来自VB族的过渡金属元素的金属氧化物或其盐,VIB ,周期表的VIIB和VIIIB或其混合物。