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1. 发明申请

WO2021109051A1 HIGHLY THERMALLY CONDUCTIVE FLOWABLE SILICONE COMPOSITION 审中-公开
公开(公告)号：WO2021109051A1
公开(公告)日：2021-06-10
申请号：PCT/CN2019/123175
申请日：2019-12-05
申请人： DOW SILICONES CORPORATION , ZHENG, Yan , CHEN, Chen , BHAGWAGAR, Dorab , WEI, Peng , GE, Qianqing
发明人： ZHENG, Yan , CHEN, Chen , BHAGWAGAR, Dorab , WEI, Peng , GE, Qianqing
IPC分类号： C08L83/04 , C08K3/28
摘要： A composition contains: (a) a polyorganosiloxane component comprising one or a combination of more than one polyorganosiloxane; (b) a filler treating agent comprising alkyltrialkoxysilane and trialkoxysiloxy-terminated diorganopolysiloxane; (c) 90-98 weight-percent of a combination of thermally conductive fillers comprising: (i) 25-40 weight-percent of thermally conductive filler particles having an average particle size of 70-150 micrometers and selected from one or a combination of aluminum oxide and aluminum nitride particles; (ii) 15-30 weight-percent thermally conductive filler particles having an average particle size in a range of 30-45 micrometers selected from one or a combination of aluminum oxide and aluminum nitride particles; (iii) 25-32 weight-percent aluminum oxide particles having an average particle size in a range of 1-5 micrometers; and (iv) 10-15 weight-percent thermally conductive filler particles having an average particle size in a range of 0.1 to 0.5 micrometers; where weight-percent is relative to composition weight.

2. 发明申请

WO2022061559A1 THERMAL INTERFACE MATERIAL WITH LOW DISPENSING VISCOSITY, LOW VERTICAL FLOW AFTER DISPENSING, AND LOW THERMAL IMPEDANCE AFTER CURE 审中-公开
公开(公告)号：WO2022061559A1
公开(公告)日：2022-03-31
申请号：PCT/CN2020/116991
申请日：2020-09-23
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , ZHANG, Jiguang , ZHENG, Yan , HE, Chao , GAO, Xuedong , GE, Qiangqing , BHAGWAGAR, Dorab , WEI, Peng , CHEN, Chen , CHEN, Hongyu
发明人： ZHANG, Jiguang , ZHENG, Yan , HE, Chao , GAO, Xuedong , GE, Qiangqing , BHAGWAGAR, Dorab , WEI, Peng , CHEN, Chen , CHEN, Hongyu
IPC分类号： C08L83/07 , C08L83/05 , C08K3/22 , C08K3/08
摘要： Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

3. 发明申请

WO2022133850A1 THERMAL INTERFACE MATERIAL 审中-公开
公开(公告)号：WO2022133850A1
公开(公告)日：2022-06-30
申请号：PCT/CN2020/138821
申请日：2020-12-24
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HE, Chao , BHAGWAGAR, Dorab , ZHANG, Jiguang , LING, Ling , CHEN, Hongyu , WEI, Peng , ZHENG, Yan , CHEN, Chen
发明人： HE, Chao , BHAGWAGAR, Dorab , ZHANG, Jiguang , LING, Ling , CHEN, Hongyu , WEI, Peng , ZHENG, Yan , CHEN, Chen
IPC分类号： C08L29/02 , C08L29/04 , C08L29/06 , C08K3/22 , C08K3/28
摘要： A thermal interface material comprising: (A) a polyolefin having at least two hydroxy groups per molecule; (B) at least one thermally conductive filler; (C) a phase change material with a melting point of 25 to 150 ℃; and (D) a coupling agent, wherein a content of component (B) is at least 80 mass%, a content of component (C) is 0.01 to 1 mass%, and a content of component (D) is 0.1 to 1 mass%, each based on a total mass of the present thermal interface material. The present thermal interface material becomes softer as its temperature increases, while does not exhibit pumping-out in electronic devices during power cycling.

4. 发明申请

WO2022183391A1 CURABLE POLYOLEFIN COMPOSITION AND CURED PRODUCT 审中-公开
公开(公告)号：WO2022183391A1
公开(公告)日：2022-09-09
申请号：PCT/CN2021/078818
申请日：2021-03-03
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HE, Chao , WEI, Peng , ZHANG, Jiguang , CHEN, Hongyu , ZHENG, Yan , CHEN, Chen , BHAGWAGAR, Dorab
发明人： HE, Chao , WEI, Peng , ZHANG, Jiguang , CHEN, Hongyu , ZHENG, Yan , CHEN, Chen , BHAGWAGAR, Dorab
IPC分类号： C09K5/06 , C08L9/00 , C08L83/04 , C08L91/06 , C08K3/01 , C08K3/016 , C08K3/22 , C08K3/28 , C08G77/442
摘要： Curable polyolefin composition comprising: (A) polyolefin having at least two aliphatic unsaturated bonds per molecule; (B) wax with melting point of 30 to 100℃; (C) organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) catalytic amount of hydrosilylation reaction catalyst, wherein content of component (A) is 20 to 80 mass%, content of component (B) is 10 to 75 mass%, and content of component (C) is 1 to 20 mass%, each based on the total mass of components (A) to (D) . The composition can be cured to form a cured product capable of storing and releasing themal energy, and preventing the wax leaking/pumping out during heat cycling.

5. 发明申请

WO2020133374A1 THERMALLY CONDUCTIVE COMPOSITION CONTAINING MGO FILLER AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED 审中-公开
公开(公告)号：WO2020133374A1
公开(公告)日：2020-07-02
申请号：PCT/CN2018/125408
申请日：2018-12-29
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
发明人： HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
IPC分类号： C08L83/07 , C08K13/02
摘要： A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.

6. 发明申请

WO2020093258A1 THERMALLY CONDUCTIVE COMPOSITION AND METHODS AND DEVICES IN WHICH SAID COMPOSITION IS USED 审中-公开
公开(公告)号：WO2020093258A1
公开(公告)日：2020-05-14
申请号：PCT/CN2018/114267
申请日：2018-11-07
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
发明人： HU, Xiaolian , ZHANG, Jiguang , ZHENG, Yan , CHEN, Hongyu , CHEN, Chen , BHAGWAGAR, Dorab , HANSEN, Darren
IPC分类号： C08L83/04 , C08K3/38 , C08K3/28 , C08K7/00 , H01L23/36 , H05K7/20
摘要： A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 μm, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 μm, (D-3) boron nitride having a mean size of from 20 to 200 μm.

7. 发明申请

WO2022204935A1 CURABLE POLYOLEFIN COMPOSITION AND CURED PRODUCT 审中-公开
公开(公告)号：WO2022204935A1
公开(公告)日：2022-10-06
申请号：PCT/CN2021/083942
申请日：2021-03-30
申请人： DOW GLOBAL TECHNOLOGIES LLC , DOW SILICONES CORPORATION , HE, Chao , BHAGWAGAR, Dorab , LING, Ling , CHEN, Hongyu , CHEN, Chen , ZHANG, Jiguang
发明人： HE, Chao , BHAGWAGAR, Dorab , LING, Ling , CHEN, Hongyu , CHEN, Chen , ZHANG, Jiguang
IPC分类号： C08L83/05 , C08G77/12 , C08L23/22 , C08L55/04 , C08K3/00 , C08J3/24
摘要： This invention relates to a curable polyolefin composition comprising: (A) a polyolefin having at least two aliphatic unsaturated bonds per molecule and having a viscosity at 25 ℃ of less than 2,500 mPa·s; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) a thermal conductive filler. The present composition can be cured to form a soft material with good thermal conductive properties.

8. 发明申请

WO2021016743A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT, AND ELECTRIC/ELECTRONIC EQUIPMENT 审中-公开
公开(公告)号：WO2021016743A1
公开(公告)日：2021-02-04
申请号：PCT/CN2019/097918
申请日：2019-07-26
申请人： DOW SILICONES CORPORATION , DOW TORAY CO., LTD. , FANG, Lei , CHEN, Chen , HUANG, Yan , ONISHI, Masayuki , FUJISAWA, Toyohiko , CHEN, Qi , YANG, Guijun
发明人： FANG, Lei , CHEN, Chen , HUANG, Yan , ONISHI, Masayuki , FUJISAWA, Toyohiko , CHEN, Qi , YANG, Guijun
IPC分类号： C08L83/07 , C09J183/07 , C09J183/05 , C08L83/05
摘要： A curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organosiloxane having one silicon atom-bonded hydrogen atom per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (C) an organosiloxane having one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded alkoxy group per molecule and free of alkenyl groups; (D) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (E) a hydrosilylation reaction catalyst; and (F) a condensation reaction catalyst. The composition can be cured to form a cured product exhibiting excellent adhesion property against various substrates without occurring crack and delamination after a thermal shock test.

9. 发明申请

WO2018038820A1 SYSTEMS AND METHODS FOR FACILITATING INTERAURAL LEVEL DIFFERENCE PERCEPTION BY ENHANCING THE INTERAURAL LEVEL DIFFERENCE 审中-公开
标题翻译：通过增强国际水平差异来促进国际水平差异感知的系统和方法
公开(公告)号：WO2018038820A1
公开(公告)日：2018-03-01
申请号：PCT/US2017/042273
申请日：2017-07-14
申请人： ADVANCED BIONICS AG , CHEN, Chen , SWAN, Dean , LITVAK, Leonid M.
发明人： CHEN, Chen , SWAN, Dean , LITVAK, Leonid M.
IPC分类号： H04R25/00
摘要： A binaural hearing system ("system") enhances and/or preserves interaural level differences between first and second signals. The system includes first and second audio detectors associated with first and second ears of a user, respectively. The audio detectors detect an audio signal presented to the user and generate the first and second signals to represent the audio signal as detected at the first and second ears, respectively. The system also includes a first sound processor that receives the first signal from the first audio detector and the second signal from a second sound processor via a communication link with the second sound processor. The first sound processor generates a directional signal representative of a spatial filtering of the audio signal detected at the first ear according to an end-fire directional polar pattern and presents an output signal representative of the directional signal to the user at the first ear.
摘要翻译：双耳听力系统（“系统”）增强和/或保持第一和第二信号之间的耳间水平差异。该系统包括分别与用户的第一和第二耳朵相关联的第一和第二音频检测器。音频检测器检测呈现给用户的音频信号并且生成第一和第二信号以分别表示在第一和第二耳朵处检测到的音频信号。该系统还包括第一声音处理器，其经由与第二声音处理器的通信链路从第一音频检测器接收第一信号，并且从第二声音处理器接收第二信号。第一声音处理器根据端射定向极性图案产生表示在第一耳朵处检测到的音频信号的空间滤波的定向信号，并且在第一耳朵处向用户呈现表示定向信号的输出信号。 / p>

10. 发明申请

WO2017059564A1 COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF AMINES, POLYACRYLAMIDES AND BISEPOXIDES 审中-公开
标题翻译：含有氨基甲酸酯，聚丙烯酰胺和二苯醚类的反应产物的铜电镀
公开(公告)号：WO2017059564A1
公开(公告)日：2017-04-13
申请号：PCT/CN2015/091434
申请日：2015-10-08
申请人： ROHM AND HAAS ELECTRONIC MATERIALS LLC , DOW GLOBAL TECHNOLOGIES LLC , LU, Weijing , DUAN, Lingli , NIAZIMBETOVA, Zukhra , CHEN, Chen , RZEZNIK, Maria
发明人： LU, Weijing , DUAN, Lingli , NIAZIMBETOVA, Zukhra , CHEN, Chen , RZEZNIK, Maria
IPC分类号： C07G99/00 , C25D3/38
CPC分类号： C25D3/38 , C23C18/1653 , C25D7/123
摘要： Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
摘要翻译：铜电镀浴包括胺，聚丙烯酰胺和双环氧化物的反应产物。反应产物用作矫直机，并且能够实现具有高投掷功率的铜电镀浴，并提供减少结节的铜沉积物。

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