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1. 发明申请

WO2005038530A1 THINNER COMPOSITION FOR REMOVING PHOTORESIST 审中-公开
标题翻译：用于去除光电子的薄膜组合物
公开(公告)号：WO2005038530A1
公开(公告)日：2005-04-28
申请号：PCT/KR2004/002674
申请日：2004-10-19
申请人： DONGJIN SEMICHEM CO., LTD. , YOON, Suk-il , JUN, Woo-sik , PARK, Hee-jin
发明人： YOON, Suk-il , JUN, Woo-sik , PARK, Hee-jin
IPC分类号： G03F7/32
CPC分类号： G03F7/422 , G03F7/168
摘要： The present invention relates to a thinner composition for removing photoresist, and more particularly, to a thinner composition for removing photoresist comprising (a) 100 weight parts of propylene glycol monoalkyl ether acetate, and (b) 0.001 to 1 weight parts of polyethylene oxide condensate. By applying the thinner composition for removing photoresist according to the present invention on the edges and backsides of glass substrates used in liquid crystal display devices and wafers used in the preparation of semiconductors, it is possible to effectively remove photoresist unnecessarily attached thereto in a short time period. Also, the thinner composition has high safety to the human body and is applicable in various processes by reducing steps at the interface. Further, it can simplify the preparation processes of liquid crystal display devices and semiconductors, thereby economically improving production yields.
摘要翻译：本发明涉及一种用于除去光致抗蚀剂的较薄组合物，更具体地说，涉及用于除去光致抗蚀剂的较薄组合物，其包含（a）100重量份的丙二醇单烷基醚乙酸酯，和（b）0.001至1重量份的聚环氧乙烷缩合物。通过在用于制备半导体的液晶显示装置和晶片的玻璃基板的边缘和背面上施加用于除去根据本发明的光致抗蚀剂的较薄组合物，可以在短时间内有效地除去不必要地附着于其上的光刻胶期。此外，较薄的组合物对人体具有高度的安全性，并且通过减少界面处的步骤适用于各种工艺。此外，可以简化液晶显示装置和半导体的制备过程，从而经济地提高生产率。

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