会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明申请
    • ENCAPSULANT WITH INDEX MATCHED THIXOTROPIC AGENT
    • 具有指数匹配的三氯代苯醚的包装
    • WO2012128966A2
    • 2012-09-27
    • PCT/US2012028327
    • 2012-03-08
    • CREE INCKELLER BERNDLOWES THEODORE
    • KELLER BERNDLOWES THEODORE
    • H01L33/52
    • H01L33/56H01L2924/0002H01L2924/00
    • Emitter packages are disclosed having a thixotropic agent or material, with the encapsulant exhibiting significant reduction of thixotropic agent scattering. The packages exhibit a corresponding reduction or elimination of encapsulant clouding and increased package emission efficiency. This allows for the thixotropic agents to be included in the encapsulant to alter certain properties (e.g. mechanical or thermal) while not significantly altering the optical properties of the encapsulant. One embodiment of a light emitting diode (LED) package according to the present invention comprises an LED chip with an encapsulant over the LED chip. The encapsulant has an encapsulant refractive index and also has a thixotropic material with a refractive index that is substantially the same as the encapsulant refractive index.
    • 公开了具有触变剂或材料的发射器封装,其中密封剂表现出触变剂散射的显着减少。 这些包装表现出相应的减少或消除密封剂混浊和增加的包装排放效率。 这允许触变剂包括在密封剂中以改变某些性质(例如机械或热),同时不显着改变密封剂的光学性质。 根据本发明的发光二极管(LED)封装的一个实施例包括在LED芯片上具有密封剂的LED芯片。 密封剂具有密封剂折射率,并且还具有折射率基本上与密封剂折射率相同的触变材料。
    • 8. 发明申请
    • LED PACKAGE WITH ENCAPSULANT HAVING PLANAR SURFACES
    • LED包装与具有平面表面的包装
    • WO2013188189A3
    • 2014-03-06
    • PCT/US2013044277
    • 2013-06-05
    • CREE INC
    • LOWES THEODORETARSA ERIC JHEIKMAN STENKELLER BERNDREIHERZER JESSEBENJAMIN HORMOZ
    • H01L33/54
    • H01L33/54F21V9/00H01L33/502H01L33/504H01L33/505H01L33/60H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/0002H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012
    • LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount (54) with one or more LEDs (52), and a blanket conversion material layer (56) on the LEDs and the submount. The encapsulant (58) can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.
    • 公开了紧凑且有效地发光的LED封装,并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装件可以包括具有一个或多个LED(52)的底座(54)和在LED和底座上的毯子转换材料层(56)。 密封剂(58)可以在基座上,LED上方,并且在密封剂内反射的光将到达转换材料,在其上被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时,反射光现在可以逃避密封剂,允许有效排放和更宽的排放曲线。 在某些实施例中,LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂,LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系,从而在不同应用中实现更大的灵活性。
    • 9. 发明申请
    • LED PACKAGE WITH MULTIPLE ELEMENT LIGHT SOURCE AND ENCAPSULANT HAVING PLANAR SURFACES
    • 具有多个元件光源的LED封装和具有平面表面的封装
    • WO2014058641A3
    • 2014-07-10
    • PCT/US2013062640
    • 2013-09-30
    • CREE INC
    • LOWES THEODORETARSA ERICHEIKMAN STENKELLER BERNDREIHERZER JESSEBENJAMIN HORMOZ
    • H01L33/54H01L33/24H01L33/50
    • H01L33/24F21V9/00H01L33/505H01L33/508H01L33/54H01L2924/0002H01L2924/00
    • LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or a plurality of LEDs. In packages with a plurality of LEDs, each LED can emit the same or different wavelengths of light. A blanket conversion material layer can be included on at least some of the LEDs and the submount. The encapsulant with planar surfaces can be on the submount, over at least some of the LEDs, with the planar surfaces causing total internal reflection of light within the package. TIR light within the encapsulant can reach the conversion material, where it can be absorbed and emitted omnidirectionally. TIR light can now escape from the encapsulant and allow for efficient emission and a broader emission profile when compared to conventional packages with hemispheric encapsulants.
    • 公开了LED封装,其紧凑并且有效地发光,并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 封装可以包括具有一个或多个LED的基板。 在具有多个LED的封装中,每个LED可以发射相同或不同波长的光。 至少一些LED和基座上可以包括全面转换材料层。 具有平坦表面的密封剂可以位于基板上,在至少一些LED上方,平面表面引起封装内的光的全内反射。 封装剂内的TIR光可以到达转换材料,在那里它可以被全方位地吸收和发射。 与具有半球形密封剂的传统封装相比,TIR光现在可以从密封剂中逸出并且允许有效的发射和更宽的发射轮廓。