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    • 2. 发明申请
    • PROCESS AND DEVICE FOR MANUFACTURING NETWORKS OF MICROLENSES
    • 用于制造微生物网络的方法和装置
    • WO1998038137A1
    • 1998-09-03
    • PCT/US1997000952
    • 1997-02-26
    • CORNING INCORPORATEDCALDERINI, Pierre, V.DANNOUX, Thierry, L., A.THEMONT, Jean-Pierre
    • CORNING INCORPORATED
    • C03B11/06
    • G02B3/0025B29C59/04B29D11/00278C03B11/082C03B23/02C03B2215/414G02B3/0031Y02P40/57
    • The device includes a housing (1), a means for heating the housing (2), and a means (8) for supporting, in the housing, at least one group (9i) composed of plates (24i) of malleable material under pressure at the temperature established in the housing (1). Moreover, the group (9i) includes generally flat molds (25i, 25'1, 25'2) and each mold includes at least one non malleable pitted surface under pressure at said temperature. The molds (25i, 25'1, 25'2) are inserted between the plates (24i). Means (13, 15, 19, 20, 21) are envisaged to apply a roughly uniform pressure, oriented perpendicularly to the surface of the plates (24i) to the entire group (9i). This pressure is suitable for causing the production of convex surfaces of microlenses on the sides of the plates (24i), which are opposite said pitted surfaces of the molds (25i, 25'1, 25'2).
    • 该装置包括壳体(1),用于加热壳体(2)的装置和用于在壳体中支撑至少一个组件(9i)的装置(8),所述组(9i)由压力下的可延展材料的板(24i)组成 在房屋建立的温度(1)。 此外,组(9i)包括大致平坦的模具(25i,25'1,25'2),并且每个模具包括在所述温度下的压力下的至少一个不可延展的凹坑表面。 模具(25i,25'1,25'2)插入在板(24i)之间。 装置(13,15,19,20,21)设想施加大致均匀的压力,垂直于板(24i)的表面定向到整个组(9i)。 该压力适合于在与模具(25i,25'1,25'2)的凹坑表面相对的板(24i)的侧面上产生微透镜的凸表面。
    • 4. 发明申请
    • PACKAGE FOR TEMPERATURE-SENSITIVE PLANAR OPTICAL COMPONENTS
    • 温度敏感平面光学部件的包装
    • WO1998024695A2
    • 1998-06-11
    • PCT/US1997023168
    • 1997-12-02
    • CORNING INCORPORATED
    • CORNING INCORPORATEDBEGUIN, Alain, M., J.SCOTTA, Felice
    • B65D00/00
    • H05K7/20G02B6/12026G02B6/12028G02B6/4201H05K5/0213
    • A package for a temperature sensitive optical component (20) includes inner (14) and outer (12) containers of low thermal conductivity plastics material, a foam insulation (18) being situated between the two containers. Within the inner container (14) are a thermally conductive plate to which the component (20), a temperature sensitive resistor, and a resistive heating element are affixed. A temperature compensating circuit (16) is located outside the inner container. The temperature sensitive resistor is part of a Wheatstone bridge at the input of the circuit (16), whereby the circuit compensates for variations in operating voltage. The output transistor of the circuit regulates the current through the resistive heating element in response to variations in the resistance of the temperature sensitive resistor. This transistor extends into the inner container (14) and is in contact with the thermally conductive plate, whereby heat from the transistor is dissipated into the plate. This maintains the temperature of the transistor substantially constant.
    • 用于温度敏感光学部件(20)的包装包括低热导率塑料材料的内部(14)和外部(12)容器,位于两个容器之间的泡沫绝缘体(18)。 在内部容器(14)内部是导热板(20),温度敏感电阻器和电阻加热元件。 温度补偿电路(16)位于内部容器的外部。 温度敏感电阻器是电路输入端(惠普斯通电桥)的一部分,由此电路补偿工作电压的变化。 电路的输出晶体管响应于温敏电阻器的电阻的变化而调节通过电阻加热元件的电流。 该晶体管延伸到内部容器(14)中并与导热板接触,由此来自晶体管的热量被散发到板中。 这保持晶体管的温度基本恒定。