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    • 2. 发明申请
    • THERMOPLASTIC RESIN COMPOSITION WITH LOW COEFFICIENT OF LINEAR THERMAL EXPANSION
    • 具有低线性热膨胀系数的热塑性树脂组合物
    • WO2005111147A1
    • 2005-11-24
    • PCT/KR2004/001777
    • 2004-07-16
    • CHEIL INDUSTRIES INC.NA, Hee SeokKIM, Tae Uk
    • NA, Hee SeokKIM, Tae Uk
    • C08L55/02
    • C08L51/04C08L25/12C08L25/16C08L35/06C08L55/02C08L2205/02C08L2205/035C08L2666/02C08L2666/04
    • The thermoplastic resin composition according to the present invention comprises (A) a diene graft polymer prepared by grafting in emulsion polymerization 100 parts by weight of monomer mixture comprising 20-30% by weight of vinyl cyanide compound and 70-80% by weight of vinyl aromatic compound to 40-60 parts by weight of diene rubber; (B) a vinyl cyanide- vinyl aromatic copolymer having a weight-average molecular weight (Mw) of 100,000~200,000 prepared by copolymerizing 20~40 parts by weight of vinyl cyanide compound and 80~60 parts by weight of vinyl aromatic compound; (C) a vinyl cyanide- vinyl aromatic copolymer having a weight-average molecular weight(Mw) of 200,000~600,000 prepared by copolymerizing 20~40 parts by weight of vinyl cyanide compound and 80~60 parts by weight of vinyl aromatic compound; and (D) a N-substituted maleimide copolymer prepared by copolymerizing 20~60 parts by weight of a mixture of maleic anhydride and N-substituted maleimide and 40~80 parts by weight of a vinyl aromatic compound and/or a vinyl cyanide compound, wherein (A) is 15~30 parts by weight, (B)+(C) is 40~85 parts by weight, (D) is 0~30 parts by weight, and (B) : (C) is from 0 : 100 to 80 : 20. The thermoplastic resin composition of the present invention has low coefficient of linear thermal expansion.
    • 根据本发明的热塑性树脂组合物包含(A)通过在乳液聚合中接枝制备的二烯接枝聚合物100重量份的包含20-30重量%乙烯基氰化合物和70-80重量%乙烯基的单体混合物 芳香族化合物,40-60重量份二烯橡胶; (B)通过共聚20〜40重量份乙烯基氰化合物和80〜60重量份乙烯基芳族化合物制备的重均分子量(Mw)为100,000〜200,000的乙烯基氰化物 - 乙烯基芳族共聚物; (C)通过共聚20〜40重量份乙烯基氰化合物和80〜60重量份乙烯基芳族化合物制备的重均分子量(Mw)为200,000〜600,000的乙烯基氰化物 - 乙烯基芳族共聚物; 和(D)通过共聚20〜60重量份的马来酸酐和N-取代的马来酰亚胺的混合物和40〜80重量份的乙烯基芳族化合物和/或乙烯基氰化合物制备的N-取代的马来酰亚胺共聚物, 其中(A)为15〜30重量份,(B)+(C)为40〜85重量份,(D)为0〜30重量份,(B):(C)为0: 100〜80:20。本发明的热塑性树脂组合物的线性热膨胀系数低。