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1. 发明申请

WO2011110369A1 APPARATUS FOR THERMALLY TREATING SEMICONDUCTOR SUBSTRATES 审中-公开
标题翻译：用于热处理半导体衬底的装置
公开(公告)号：WO2011110369A1
公开(公告)日：2011-09-15
申请号：PCT/EP2011/001256
申请日：2011-03-14
申请人： CENTROTHERM THERMAL SOLUTIONS GMBH & CO. KG , KEIM, Uwe , VÖLK, Peter
发明人： KEIM, Uwe , VÖLK, Peter
IPC分类号： H01L21/00
CPC分类号： H01L21/67109
摘要： An apparatus for thermally treating substrates, in particular semiconductor substrates is described. The apparatus comprises a processing tube for receiving a plurality of semiconductor substrates and a resistance heating element radially encompassing the processing tube. The resistance heating element is made of a material which is free of metal. By providing a material which is free of metal for the resistance heating element, the danger of diffusion of metals into the processing space within the processing tube may be obviated.
摘要翻译：描述了一种用于热处理衬底，特别是半导体衬底的设备。该装置包括用于接收多个半导体衬底的处理管和径向包围处理管的电阻加热元件。电阻加热元件由不含金属的材料制成。通过为电阻加热元件提供不含金属的材料，可以避免金属扩散到处理管内的处理空间中的危险。

2. 发明申请

WO2012016693A1 APPARATUS FOR BLOCKING AND UNBLOCKING A LOADING/UNLOADING OPENING OF A PROCESS CHAMBER 审中-公开
标题翻译：阻塞和解锁装置一个过程室的装载/卸载装置
公开(公告)号：WO2012016693A1
公开(公告)日：2012-02-09
申请号：PCT/EP2011/003895
申请日：2011-08-03
申请人： CENTROTHERM THERMAL SOLUTIONS GMBH & CO. KG , VÖLK, Peter
发明人： VÖLK, Peter
IPC分类号： H01L21/67
CPC分类号： H01L21/67126
摘要： An apparatus for blocking and unblocking a loading/unloading opening of at least one process chamber for treating substrates as well as an apparatus for treating substrates including a corresponding closing apparatus are described. The closing apparatus comprises at least one tube element having at least one inlet and/or outlet opening connectable to a fluid source and/or a vacuum source, and a casing having a chamber axially extending in the casing for housing the tube element, and a passage intersecting the chamber laterally to the axial direction, wherein the passage is aligned with the loading/unloading opening of the process chamber and wherein the chamber has a circular cross-sectional area. Furthermore, at least one fixing element for positioning and fixing a section of the tube element in a predetermined position with respect to the loading/unloading opening of the process chamber is provided. The tube element may be moved between an expanded or deployed condition and a retracted condition retracted towards the fixed section via selectively applying fluid and/or vacuum to the inner space of the tube element, wherein the tube element blocks the loading/unloading opening of the process chamber in the deployed condition and unblocks the loading/unloading opening of the process chamber in the retracted condition. The apparatus for treating a substrate comprises at least one process chamber having a loading/unloading opening and a closing apparatus of the above type.
摘要翻译：描述了用于阻塞和解除封闭至少一个用于处理基板的处理室的装载/卸载开口的装置以及用于处理包括相应的关闭装置的基板的装置。关闭装置包括至少一个管元件，其具有可连接到流体源和/或真空源的至少一个入口和/或出口开口，以及具有在壳体中轴向延伸以容纳管元件的壳体的壳体，以及通道与腔室横向相对于轴向方向，其中通道与处理室的装载/卸载开口对准，并且其中腔室具有圆形的横截面积。此外，提供了至少一个固定元件，用于将管元件的一部分相对于处理室的装载/卸载开口定位并固定在预定位置。管元件可以在膨胀或展开状态与通过选择性地向管元件的内部空间施加流体和/或真空而朝向固定部分缩回的缩回状态之间移动，其中管元件阻塞所述管元件的装载/卸载开口处理室处于展开状态，并且在缩回状态下解除处理室的装载/卸载开口。用于处理衬底的装置包括至少一个具有上述类型的装载/卸载开口和关闭装置的处理室。

3. 发明申请

WO2012079773A1 APPARATUS AND METHOD FOR THE THERMAL TREATMENT OF SUBSTRATES 审中-公开
标题翻译：用于基材热处理的装置和方法
公开(公告)号：WO2012079773A1
公开(公告)日：2012-06-21
申请号：PCT/EP2011/006387
申请日：2011-12-16
申请人： CENTROTHERM PHOTOVOLTAICS AG , PURSCHE, Oliver , VÖLK, Peter
发明人： PURSCHE, Oliver , VÖLK, Peter
IPC分类号： H01L21/67
CPC分类号： H01L21/67103 , H01L21/67109 , H01L21/67754 , H01L31/0392 , H01L31/18 , Y02E10/50
摘要： The application describes an apparatus and a method for the thermal treatment of substrates, in particular thin film substrates for photovoltaic applications. The apparatus comprises at least one substrate carrier for supporting a substrate, a heating unit having at least one heating element for heating a substrate located on the substrate carrier and at least one heating element carrier for supporting the at least one heating element. The heating element carrier is designed to allow a local change in distance between the substrate carrier and the heating element, so as to be able to provide locally different heating intensities. In the method such a change in distance is carried out during the thermal treatment.
摘要翻译：本申请描述了一种用于基板的热处理的设备和方法，特别是用于光伏应用的薄膜基板。该装置包括至少一个用于支撑衬底的衬底载体，具有至少一个用于加热位于衬底载体上的衬底的加热元件的加热单元和用于支撑至少一个加热元件的至少一个加热元件载体。加热元件载体被设计成允许基板载体和加热元件之间的距离局部变化，以便能够提供局部不同的加热强度。在该方法中，在热处理期间进行距离变化。

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