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    • 1. 发明申请
    • PERSONAL DOCUMENT AND METHOD FOR PRODUCING IT
    • 个人文件及其制作方法
    • WO2008071697A2
    • 2008-06-19
    • PCT/EP2007063697
    • 2007-12-11
    • BUNDESDRUCKEREI GMBHPAESCHKE MANFREDPFLUGHOEFFT MALTEFISCHER JOERGBEYER-MEKLENBURG GUENTERMUTH OLIVER
    • PAESCHKE MANFREDPFLUGHOEFFT MALTEFISCHER JOERGBEYER-MEKLENBURG GUENTERMUTH OLIVER
    • G06K19/077
    • G06K19/07749G06K19/025Y10T156/10
    • The invention relates to a personal document comprising an integrated chip which can be read contactlessly and which comprises a laminate composed of a chip film, a substrate covering the chip film on the structure side of the chip and a covering layer covering the chip film on the rear side, wherein the chip film comprises a chip with integrated circuit, said chip being thinned to a thickness d = 50 µm, preferably d = 30 µm, particularly preferably d = 20 µm, and a polymeric carrier film, which, apart from contact connections, is applied both on the structure side and on the rear side of the chip. The chip is connected to the carrier film on both sides by in each case a coupling reagent whose molecules have a first chemically functional group, which preferably reacts with the semiconductor material of the chip surface and forms a covalent bond there, and have a second functional group, which preferably reacts with the polymer matrix of the carrier film, wherein the carrier film, the substrate and the covering layer each have compatible polymers which are miscible with one another, in particular soluble in one another, and the chip is connected to an antenna provided on the substrate.
    • 本发明涉及一种具有集成的接触式可芯片个人文档,它由一个芯片膜,在芯片覆盖基板和芯片膜的结构侧上的芯片膜的层叠体的背面覆盖罩层,其中所述芯片膜的厚度d = 50微米 ,优选d = d =更优选包括30微米,20微米减薄芯片集成电路和聚合物载体膜,其是除了施加到两个结构侧和芯片的背面接触端子。 该芯片是在两侧由相应的偶联试剂与载体薄膜连接两者,其中具有与芯片表面的半导体材料,在那里形成一个共价键,以及具有第二官能团,这与所述的聚合物基体优选是优先反应的第一化学官能团的分子 支持膜与载体膜,在基板和覆盖层分别具有彼此互溶,特别是彼此可溶的并且芯片连接到设置在基板上的天线的开口相容的聚合物反应。