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    • 7. 发明申请
    • A CONDUCTIVE JACKET
    • 导电夹克
    • WO2014032806A1
    • 2014-03-06
    • PCT/EP2013/002605
    • 2013-08-30
    • BOREALIS AG
    • UEMATSU, TakashiSVANBERG, ChristerTHORN, NiklasJÄGER, Karl-MichaelLINDNER, ÅsaWESTLING, Lars
    • C08L23/06H01B1/24C08L23/08C08K5/00
    • H01B1/24C08K5/005C08L23/06C08L23/0869C08L2203/202Y10T428/294
    • The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt%) of a polymer blend, 2 to 50 wt% of a conductive filler and 0.05 to 2 wt% of an antioxidant; wherein said polymer blend comprises 10 to 99 wt% of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m 3 and a melt flow rate (MFR2@190°C) according to ISO 1133 (190°C, 2.16 kg) which is less than 1.6 g/ 10 min, and 1 to 90 wt% of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.
    • 本发明涉及一种新的半导体组合物,其包含50至98重量百分比(wt%)的聚合物共混物,2至50重量%的导电填料和0.05至2重量%的抗氧化剂; 其中所述聚合物共混物包含10至99重量%的多峰高密度聚烯烃,该高密度聚烯烃具有930至970kg / m 3的密度和根据ISO 1133的熔体流动速率(MFR2 @ 190℃)( 190℃,2.16kg)小于1.6g / 10min,和1〜90wt%的热塑性弹性体,半导体组合物的制造方法以及包含半导体组合物的半导体护套,以及电力电缆,包括 半导体护套或包含半导体组合物,或在例如电力电缆中使用半导体护套或半导体组合物。